Patents by Inventor Yi-Hsuan Hsiao
Yi-Hsuan Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250126883Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.Type: ApplicationFiled: December 23, 2024Publication date: April 17, 2025Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
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Publication number: 20250118536Abstract: Semiconductor processing systems and methods for increased etch selectivity and rate are provided. Methods include etching a target material of a semiconductor substrate by flowing one or more plasma precursors through a microwave applicator into a remote plasma region of a semiconductor processing chamber. Generating a remote plasma within the remote plasma region at a microwave frequency, where the generated remote plasma comprises a density of greater than 1×1010 per cm3, an ion energy of less than or about 50 eV, or a combination thereof. Flowing the plasma effluents into a processing region of the semiconductor processing chamber. The microwave applicator includes a resonator body and a plate, where the resonator body is formed from or coated with a first dielectric material and the plate is formed from or coated with a second dielectric material.Type: ApplicationFiled: October 10, 2023Publication date: April 10, 2025Applicant: Applied Materials, Inc.Inventors: Yi-Hsuan Hsiao, Dongqing Yang, Kelvin Chan, Philip A. Kraus, Thai Cheng Chua, Ping-Hwa Hsieh, Nitin K. Ingle
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Publication number: 20250098257Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a first dielectric layer over the substrate. The semiconductor device structure also includes a first metal gate stack and a second metal gate stack over the substrate and the first dielectric layer. The semiconductor device structure further includes a second dielectric layer beside the first metal gate stack and an insulating structure over the substrate. A portion of the insulating structure is between the first metal gate stack and the second metal gate stack. The insulating structure penetrates into the second dielectric layer.Type: ApplicationFiled: December 4, 2024Publication date: March 20, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsuan HSIAO, Shu-Yuan KU, Chih-Chang HUNG, I-Wei YANG, Chih-Ming SUN
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Patent number: 12218130Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.Type: GrantFiled: December 1, 2023Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
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Patent number: 12166105Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first dielectric layer over the semiconductor substrate. The semiconductor device structure also includes a first conductive material and a second conductive material disposed over the semiconductor substrate and the first dielectric layer. The semiconductor device structure further includes a second dielectric layer surrounding the first conductive material and the second conductive material and an insulating structure over the semiconductor substrate. The insulating structure is disposed between the first conductive material and the second conductive material. The insulating structure comprises a material different from the first dielectric layer and the second dielectric layer.Type: GrantFiled: October 19, 2023Date of Patent: December 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsuan Hsiao, Shu-Yuan Ku, Chih-Chang Hung, I-Wei Yang, Chih-Ming Sun
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Publication number: 20240306391Abstract: Two-dimensional (2D) materials formed in very thin layers improve the operation of semiconductor devices. However, forming a contact on 2D material tends to damage and penetrate the 2D material. A relatively gentle etch process has been developed that is very selective to the 2D material and allows vertical holes to be etched down to the 2D material without damaging or penetrating the 2D material. A low-power deposition process forms a protective liner when performing the metal fill to further prevent damage to the 2D material when forming the metal contacts in the holes. These processes allow a vertical metal contact to be formed on a planar 2D material or a vertical sidewall contact be formed in a 3D NAND without damaging the 2D material. This increases the contact area, reduces the contact resistance, and improves the performance of the 2D material in the device.Type: ApplicationFiled: March 6, 2024Publication date: September 12, 2024Applicant: Applied Materials, Inc.Inventors: Hao-Ling Tang, Arvind Kumar, Mahendra Pakala, Keith Tatseun Wong, Yi-Hsuan Hsiao, Dongqing Yang, Mark Conrad, Rio Soedibyo, Minrui Yu
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Publication number: 20240194534Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.Type: ApplicationFiled: February 26, 2024Publication date: June 13, 2024Inventors: Ya-Yi Tsai, Yi-Hsuan Hsiao, Shu-Yuan Ku, Ryan Chia-Jen Chen, Ming-Ching Chang
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Publication number: 20240113113Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
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Patent number: 11915980Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.Type: GrantFiled: December 12, 2022Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ya-Yi Tsai, Yi-Hsuan Hsiao, Shu-Yuan Ku, Ryan Chia-Jen Chen, Ming-Ching Chang
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Publication number: 20240047557Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first dielectric layer over the semiconductor substrate. The semiconductor device structure also includes a first conductive material and a second conductive material disposed over the semiconductor substrate and the first dielectric layer. The semiconductor device structure further includes a second dielectric layer surrounding the first conductive material and the second conductive material and an insulating structure over the semiconductor substrate. The insulating structure is disposed between the first conductive material and the second conductive material. The insulating structure comprises a material different from the first dielectric layer and the second dielectric layer.Type: ApplicationFiled: October 19, 2023Publication date: February 8, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsuan HSIAO, Shu-Yuan KU, Chih-Chang HUNG, I-Wei YANG, Chih-Ming SUN
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Patent number: 11855085Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.Type: GrantFiled: July 25, 2022Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
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Patent number: 11830926Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first metal gate stack and a second metal gate stack over the semiconductor substrate. The first metal gate stack and the second metal gate stack are electrically isolated from each other, and the first metal gate stack has a curved edge facing the second metal gate stack. The semiconductor device structure also includes a dielectric layer surrounding the first metal gate stack and the second metal gate stack.Type: GrantFiled: December 10, 2021Date of Patent: November 28, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsuan Hsiao, Shu-Yuan Ku, Chih-Chang Hung, I-Wei Yang, Chih-Ming Sun
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Publication number: 20230335442Abstract: A method incudes forming first and second semiconductor fins upwardly extending from a substrate; forming a gate strip extending across the first and second semiconductor fins; growing first source/drain regions on the first semiconductor fin and at opposite sides of the gate strip, second source/drain regions on the second semiconductor fin and at opposite sides of the gate strip; depositing a dielectric layer over the first and second source/drain regions; forming an isolation material in the dielectric layer and between one of the first source/drain regions and one of the second source/drain regions; performing an etching process on the isolation material and the gate strip to form an opening, the opening breaking the grid strip and recessing the isolation material; forming a separation material in the opening.Type: ApplicationFiled: June 20, 2023Publication date: October 19, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Chang HUNG, Shu-Yuan KU, I-Wei YANG, Yi-Hsuan HSIAO, Ming-Ching CHANG, Ryan Chia-Jen CHEN
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Patent number: 11721588Abstract: The first and second fins extend upwardly from a semiconductor substrate. The shallow trench isolation structure laterally surrounds lower portions of the first and second fins. The first gate structure extends across an upper portion of the first fin. The second gate structure extends across an upper portion of the second fin. The first source/drain epitaxial structures are on the first fin and on opposite sides of the first gate structure. The second source/drain epitaxial structures are on the second fin and on opposite sides of the second gate structure. The separation plug interposes the first and second gate structures and extends along a lengthwise direction of the first fin. The isolation material cups an underside of a portion of the separation plug between one of the first source/drain epitaxial structures and one of the second source/drain epitaxial structures.Type: GrantFiled: June 7, 2021Date of Patent: August 8, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Chang Hung, Shu-Yuan Ku, I-Wei Yang, Yi-Hsuan Hsiao, Ming-Ching Chang, Ryan Chia-Jen Chen
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Publication number: 20230105271Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.Type: ApplicationFiled: December 12, 2022Publication date: April 6, 2023Inventors: Ya-Yi Tsai, Yi-Hsuan Hsiao, Shu-Yuan Ku, Ryan Chia-Jen Chen, Ming-Ching Chang
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Patent number: 11527443Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.Type: GrantFiled: March 8, 2021Date of Patent: December 13, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ya-Yi Tsai, Yi-Hsuan Hsiao, Shu-Yuan Ku, Ryan Chia-Jen Chen, Ming-Ching Chang
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Publication number: 20220359510Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
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Patent number: 11444080Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.Type: GrantFiled: October 30, 2020Date of Patent: September 13, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Chang Hung, Chia-Jen Chen, Ming-Ching Chang, Shu-Yuan Ku, Yi-Hsuan Hsiao, I-Wei Yang
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Publication number: 20220102532Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first metal gate stack and a second metal gate stack over the semiconductor substrate. The first metal gate stack and the second metal gate stack are electrically isolated from each other, and the first metal gate stack has a curved edge facing the second metal gate stack. The semiconductor device structure also includes a dielectric layer surrounding the first metal gate stack and the second metal gate stack.Type: ApplicationFiled: December 10, 2021Publication date: March 31, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsuan HSIAO, Shu-Yuan KU, Chih-Chang HUNG, I-Wei YANG, Chih-Ming SUN
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Patent number: 11201230Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first metal gate stack and a second metal gate stack over a semiconductor substrate. The semiconductor device structure also includes a dielectric layer surrounding the first metal gate stack and the second metal gate stack. The semiconductor device structure further includes an insulating structure between the first metal gate stack and the second metal gate stack. The insulating structure has a first convex surface facing towards the first metal gate stack.Type: GrantFiled: October 22, 2019Date of Patent: December 14, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Hsuan Hsiao, Shu-Yuan Ku, Chih-Chang Hung, I-Wei Yang, Chih-Ming Sun