Patents by Inventor Yi Hui

Yi Hui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963868
    Abstract: A double-sided aspheric diffractive multifocal lens and methods of manufacturing and design of such lenses in the field of ophthalmology. The lens can include an optic comprising an aspheric anterior surface and an aspheric posterior surface. On one of the two surfaces a plurality of concentric diffractive multifocal zones can be designed. The other surface can include a toric component. The double-sided aspheric surface design results in improvement of the modulation transfer function (MTF) of the lens-eye combination by aberration reduction and vision contrast enhancement as compared to one-sided aspheric lens. The surface having a plurality of concentric diffractive multifocal zones produces a near focus, an intermediate focus, and a distance focus.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: April 23, 2024
    Assignee: AST Products, Inc.
    Inventors: Yi-Feng Chiu, Chuan-Hui Yang, Wen-Chu Tseng
  • Patent number: 11965833
    Abstract: A detection device includes a frame, a transport mechanism, detection mechanisms, and a grasping mechanism. The transport mechanism includes a feeding line, a first flow line, and a second flow line arranged in parallel on the frame. The detection mechanisms are arranged on the frame and located on two sides of the transport mechanism. The grasping mechanism is arranged on the frame and used to transport workpieces on the feeding line to the detection mechanisms, transport qualified workpieces to the first flow line, and transport unqualified workpieces to the second flow line.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: April 23, 2024
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jing-Zhi Hou, Lin-Hui Cheng, Yan-Chao Ma, Jin-Cai Zhou, Zi-Long Ma, Neng-Neng Zhang, Yi Chen, Chen-Xi Tang, Meng Lu, Peng Zhou, Ling-Hui Zhang, Lu-Hui Fan, Shi-Gang Xu, Cheng-Yi Chao, Liang-Yi Lu
  • Patent number: 11968512
    Abstract: In an example, a speaker device may include a first transducer and a second transducer. The first transducer may include a first diaphragm, a first magnetic circuit, and a first voice coil disposed in a magnetic gap of the first magnetic circuit to cause vibration of the first diaphragm. The second transducer may include a second diaphragm, a second magnet circuit, and a second voice coil disposed in a magnetic gap of the second magnetic circuit to cause vibration of the second diaphragm. Further, the speaker device may include a magnetic plate having a first surface coupled to the first transducer and a second surface coupled to the second transducer. The first surface is opposite to the second surface.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yen-Hsin Ho, Yi-Ying Lai, Chen-Hui Hu, Chen-Yu Chang
  • Publication number: 20240122894
    Abstract: Provided is a method for coupling flavonoid-containing compounds to provide flavonoid dimers, trimers and oligomers. The method comprises contacting a flavonoid-containing compound with base in the presence of air. Flavonoid dimers, trimers and oligomers may also be useful in the treatment of diseases, such as fungal infections and diseases associated with starch hydrolase.
    Type: Application
    Filed: December 10, 2021
    Publication date: April 18, 2024
    Applicant: National University of Singapore
    Inventors: Xin Yang, Dejian Huang, Ke Du, Yi Hui Joanne Toy
  • Patent number: 11960138
    Abstract: An active alignment machine includes a base, a first pillar, a second pillar, a distribution module, a first alignment module, a second alignment module and a third alignment module. The first pillar has a first pillar top surface. The second pillar has a second pillar top surface. The first pillar top surface and the second pillar top surface cooperatively support plural assembling specifications. The distribution module is installed on the base and arranged between the first pillar and the second pillar. The first alignment module, the second alignment module and third alignment module are replaceable to be assembled with or dissembled from the first pillar top surface and the second pillar top surface. The first alignment module, the second alignment module and third alignment module work with the distribution module to perform the active alignment on a first-type product, a second-type product and a third-type product, respectively.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 16, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Ching-Hui Chang, Yi-Hou Chen
  • Patent number: 11955401
    Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11942375
    Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a first semiconductor fin and a second semiconductor fin over a semiconductor substrate. The second semiconductor fin is wider than the first semiconductor fin. The method also includes forming a gate stack over the semiconductor substrate, and the gate stack extends across the first semiconductor fin and the second semiconductor fin. The method further includes forming a first source/drain structure on the first semiconductor fin, and the first source/drain structure is p-type doped. In addition, the method includes forming a second source/drain structure on the second semiconductor fin, and the second source/drain structure is n-type doped.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsing-Hui Hsu, Po-Nien Chen, Yi-Hsuan Chung, Bo-Shiuan Shie, Chih-Yung Lin
  • Patent number: 11927793
    Abstract: A double-sided display device includes a first panel, a second panel, a light guide plate and a light source. The second panel is arranged opposite to the first panel. The light guide plate is arranged between the first panel and the second panel, and includes a main body portion including a first surface and a second surface, a first pattern arranged on the first surface, and a second pattern arranged on the second surface. The light source is arranged adjacent to the light guide plate. The first pattern is different from the second pattern.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: March 12, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Yi-Hui Lee, Kuan-Chou Chen, Yung-Chih Cheng
  • Patent number: 11928038
    Abstract: An approach for managing data set access based on data set relevance. The approach monitors data set access activities associated with a user. The approach detects access of a first data set by the user. The approach determines a group of data sets associated with the first data set based on a data set mapping associated with the user. The approach recalls one or more data sets of the group of data sets from a slower storage device to a faster storage device.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 12, 2024
    Assignee: International Business Machines Corporation
    Inventors: Jing Wen Chen, Zhao Yu Wang, Peng Hui Jiang, Jing BJ Ren, Yi Jie Ma, Wen Zhong Liu
  • Publication number: 20240081157
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240071847
    Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Yi-Huan Liao, Ping-Yin Hsieh, Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
  • Publication number: 20240071656
    Abstract: A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer.
    Type: Application
    Filed: January 13, 2023
    Publication date: February 29, 2024
    Inventors: Chien Hui WU, Yung-Hsien CHANG, Cheng-Yu TUNG, Ming-Hsun LU, Yi-An SHA
  • Publication number: 20240074328
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11892990
    Abstract: Embodiments of the present invention provide a computer system a computer program product, and a method that comprises converting received data from a time-based domain to a frequency-based domain using a signal processing algorithm; identifying transactional noise within the converted data by identifying contextual factors based on a determined pattern, wherein the transactional noise is data associated with an identified fraudulent transaction; filtering the identified transactional noise by removing datapoints within the converted data that reaches a predetermined threshold of signal strength using the signal processing algorithm; and generating a line graph depicting removal of the data that is indicative of the identified transactional noise from the converted data.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: February 6, 2024
    Assignee: International Business Machines Corporation
    Inventors: Shuyan Lu, Yi-Hui Ma, Eugene Irving Kelton, John H. Walczyk, III
  • Publication number: 20240032439
    Abstract: A method of fabricating magnetoresistive random access memory, including providing a substrate, forming a bottom electrode layer, a magnetic tunnel junction stack, a top electrode layer and a hard mask layer sequentially on the substrate, wherein a material of the top electrode layer is titanium nitride, a material of the hard mask layer is tantalum or tantalum nitride, and a percentage of nitrogen in the titanium nitride gradually decreases from a top surface of top electrode layer to a bottom surface of top electrode layer, and patterning the bottom electrode layer, the magnetic tunnel junction stack, the top electrode layer and the hard mask layer into multiple magnetoresistive random access memory cells.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 25, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, Jing-Yin Jhang, I-Ming Tseng, Yu-Ping Wang, Chien-Ting Lin, Kun-Chen Ho, Yi-Syun Chou, Chang-Min Li, Yi-Wei Tseng, Yu-Tsung Lai, JUN XIE
  • Publication number: 20240027811
    Abstract: A display device, including a first display panel, a second display panel, and a first optical structure layer, is provided. The first display panel has a first display surface emitting light toward a first direction. The second display panel has a second display surface emitting light toward a second direction, wherein the first direction is different from the second direction. The first optical structure layer is disposed on the first display panel, wherein a glossiness of the first optical structure layer is between 4 GU and 35 GU, and a reflectivity of specular component included (SCI) of the first optical structure layer is between 3% and 6%. The display device provided by the disclosure can reduce the influence of ambient light from the outside on a displayed image.
    Type: Application
    Filed: June 8, 2023
    Publication date: January 25, 2024
    Applicant: Innolux Corporation
    Inventors: Yu-Chun Hsu, Wei-Ming Chu, Yi-Hui Lee, Yung-Chih Cheng, Kuan-Chou Chen, Sheng-Nan Fan
  • Publication number: 20240016357
    Abstract: A robotic cleaning system may include a docking station, a robotic cleaner that includes at least one of a first set of robot charging contacts or a second set of robot charging contacts, the first and second sets of robot charging contacts being configured to electrically couple the robotic cleaner to the docking station, a dust cup configured to removably couple to the robotic cleaner, and a mop module configured to removably couple to the robotic cleaner. When the mop module is coupled to the robotic cleaner, the robotic cleaner may be configured to electrically couple to the docking station using the first set of robot charging contacts. When the mop module is not coupled to the robotic cleaner, the robotic cleaner may be configured to electrically couple to the docking station using the second set of robot charging contacts.
    Type: Application
    Filed: August 17, 2022
    Publication date: January 18, 2024
    Inventors: Simon HUGHES, Zhanglin Liu, Yi hui ZHANG, Yafei Shen, Wulin Tian, Scott TEUSCHER, John LEWIS, Hamish THOMPSON
  • Publication number: 20240016356
    Abstract: A robotic cleaner may include one or more driven wheels, at least one environmental sensor, and a mop module. The mop module may include a tank having a tank inlet and a tank outlet, a pad coupled at a bottom side of the tank, the pad configured to contact a surface to be cleaned and to receive liquid from the tank outlet, and a latch configured to transition between a latched position, a release position, and a refill position. When in the latched position and in the release position, at least a portion of the latch may extend over the tank inlet and, when in the refill position, the latch may be displaced from the tank inlet, exposing the tank inlet.
    Type: Application
    Filed: August 17, 2022
    Publication date: January 18, 2024
    Inventors: Jun Feng DING, Evan P. JASPER, Yi hui ZHANG, Hamish THOMPSON, Max DAVIDOWITZ, Simon HUGHES, Jianjun GE, Jian XIANG
  • Patent number: D1016369
    Type: Grant
    Filed: January 23, 2022
    Date of Patent: February 27, 2024
    Inventor: Yi Hui Tang