Patents by Inventor Yi Hung
Yi Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12362557Abstract: Systems and methods are provided for a self-biasing electro-static discharge (ESD) power clamp. The ESD power clamp comprises an ESD detection circuit coupled to a positive supply voltage node and a ground voltage node. The ESD detection circuit includes a first node having a first voltage level during a standby mode and a second voltage level during an ESD mode. The ESD power clamp further comprises a discharge circuit coupled to the ESD detection circuit that includes a plurality of discharge elements a self-biasing node having a third voltage level during the standby mode. The third voltage level provides a voltage drop across at least one of the discharge elements that is less than the first voltage level. The discharge circuit provides a high-impedance path during the standby mode and a low-impedance path during the ESD mode.Type: GrantFiled: March 31, 2023Date of Patent: July 15, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tao Yi Hung, Jam-Wem Lee, Kuo-Ji Chen, Wun-Jie Lin
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Publication number: 20250228054Abstract: An optoelectronic device includes a semiconductor stack, including a first semiconductor layer, an active layer, and a second semiconductor layer; a contact electrode formed on the second semiconductor layer; an insulating reflective structure covering the contact electrode and including a plurality of insulating reflective structure openings to expose the contact electrode; a metal reflective structure covering the plurality of insulating reflective structure openings to electrically connect to the contact electrode; and an insulating structure including one or more first insulating structure openings to expose the first semiconductor layer and one or more second insulating structure openings to expose the metal reflective structure.Type: ApplicationFiled: December 31, 2024Publication date: July 10, 2025Inventors: Yu-Ling LIN, Yi-Hung LIN, Chao-Hsing CHEN, Chien-Ya HUNG
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Publication number: 20250205038Abstract: A tissue scaffold is provided. The tissue scaffold includes a textile formed by interweaving a plurality of warp yarns and a plurality of weft yarns. The textile includes a first region and a second region, and the second region is adjacent to the first region. The plurality of warp yarns have different diameters in the first region and the second region. The textile has a plurality of pores, and the size of each of the plurality of pores is between 100 ?m and 800 ?m. A method of manufacturing the aforementioned tissue scaffold is also provided.Type: ApplicationFiled: December 27, 2023Publication date: June 26, 2025Applicant: Industrial Technology Research InstituteInventors: Chih-Chieh Huang, Lih-Tao HSU, Cheng-Yi WU, Meng-Hsueh LIN, Hui-Ting HUANG, Chen-Hsuan LIN, Yi-Hung WEN, Fang-Chieh CHANG, Hsin-Hsin SHEN, Pei-I TSAI, Jun-Jae HUANG
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Patent number: 12328441Abstract: An image processing method for a video processor for generating an interpolated frame includes steps of: receiving a segmentation map comprising a plurality of segmentation flags; generating an original motion vector (MV) for a first block of the interpolated frame; determining whether to label the first block as a segmentation boundary according to the plurality of segmentation flags in an area corresponding to the first block; generating a correction MV for the first block when the first block is labeled as the segmentation boundary; determining whether the first block is in a cover area or an uncover area according to the correction MV; and selecting a final MV for a specific pixel of the first block from the original MV and the correction MV according to the segmentation map and according to whether the first block is determined to be in the cover area or the uncover area.Type: GrantFiled: August 4, 2023Date of Patent: June 10, 2025Assignee: NOVATEK Microelectronics Corp.Inventor: Yi-Hung Huang
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Publication number: 20250177161Abstract: An expandable spinal implant includes a flexible body, an expander component, a fastener and an anti-reverse mechanism. The flexible body includes a base portion and flexible arms each having a free end and a fixed end connecting the base portion. The flexible arms surround an installation space. The expander component is partially in the installation space and exerts pressure on the free ends to move the free ends away from one another. The fastener includes a head portion and a screw portion. The head portion and the expander component are at opposite sides of the base portion. The screw portion passes through the base portion and screwed into the expander component. The anti-reverse mechanism is fixed to the base portion and blocks one side of the head portion located away from the expander component. The anti-reverse mechanism and the expander component are at opposite sides of the base portion.Type: ApplicationFiled: December 26, 2023Publication date: June 5, 2025Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin SHEN, Pei-I TSAI, Chih-Chieh HUANG, Kuo-Yi YANG, Shih-Ping LIN, Yi-Hung WEN, Wei-Lun FAN, Shu-Fen YEH, Ting-Ni HUANG, An-Li CHEN
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Publication number: 20250158047Abstract: An aluminum battery includes a negative electrode structure. The negative electrode structure includes a substrate and an aluminum alloy layer located on the substrate. The aluminum alloy layer includes an aluminum element and a non-aluminum element. A content of the aluminum element in the aluminum alloy layer is greater than or equal to 85 wt % and less than 100 wt %, while a content of the non-aluminum element in the aluminum alloy layer is less than or equal to 15 wt % and greater than 0 wt %. A manufacturing method of the aluminum battery is also provided.Type: ApplicationFiled: July 4, 2024Publication date: May 15, 2025Applicant: APh ePower Co., Ltd.Inventors: Jui-Hsuan Wu, Shih Po Ta Tsai, Wei-Ting Chen, Kuan-Ting Chen, Fei-Yi Hung
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Publication number: 20250157904Abstract: A manufacturing method of a package device is provided. First, a carrier is provided, and then a conductive element is formed on the carrier. Thereafter, a conductive pad is formed on the conductive element. Next, a redistribution layer is formed on the conductive pad. Then, the carrier and at least a part of the conductive element are removed.Type: ApplicationFiled: January 13, 2025Publication date: May 15, 2025Applicant: InnoLux CorporationInventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
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Publication number: 20250140205Abstract: An electronic device is provided. The electronic device includes at least one electronic circuit, a scan line, and a scan signal conversion circuit. The scan line transmits a first scan signal. The scan signal conversion circuit is electrically connected to the at least one electronic circuit and the scan line. The scan signal conversion circuit receives the first scan signal, converts the first scan signal into a second scan signal, and provides the second scan signal to the at least one electronic circuit.Type: ApplicationFiled: September 25, 2024Publication date: May 1, 2025Applicant: Innolux CorporationInventors: Chin-Lung Ting, Yi-Hung Lin, Kung-Chen Kuo, Po-Syun Chen
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Publication number: 20250140645Abstract: An electronic device including a circuit layer, an electronic element, a first flow-path structure and a fluid material is disclosed. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The first flow-path structure includes a first flow path, and the electronic element is disposed in the first flow-path structure. The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element. The circuit layer includes an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.Type: ApplicationFiled: December 30, 2024Publication date: May 1, 2025Applicant: InnoLux CorporationInventors: Chin-Lung TING, Chung-Kuang WEI, Cheng-Chi WANG, Yeong-E CHEN, Yi-Hung LIN
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Publication number: 20250132221Abstract: An electronic package is provided and includes: a carrier structure, an electronic component disposed on the carrier structure, a heat dissipation structure disposed on the electronic component, a heat conductor sandwiched between the electronic component and the heat dissipation structure, a first intermetallic compound layer formed between the heat dissipation structure and the heat conductor, and a second intermetallic compound layer formed between the heat conductor and the electronic component. Therefore, stable connections can be formed between the heat dissipation structure, the heat conductor and the electronic component via the first intermetallic compound layer and the second intermetallic compound layer to improve heat dissipation effect.Type: ApplicationFiled: June 26, 2024Publication date: April 24, 2025Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Dai-Fei LI, Liang-Yi HUNG, Chia-Cheng CHEN, Yu-Po WANG
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Publication number: 20250125611Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Applicant: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Li-Wei Chu, Tao Yi Hung, Chia-Hui Chen, Wun-Jie Lin, Jam-Wem Lee
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Publication number: 20250125044Abstract: A caregiving robot and a caregiving system and method employing the same are provided. The caregiving robot includes a movement module, an interaction module and a control module. The interaction module receives an input instruction from the caregiver, and the input instruction includes an identity information and a target location information of the care recipient and a caregiving task information. During execution of the caregiving task, the control module controls the movement module to make the caregiving robot move to a target location according to the target location information. When the caregiving robot arrives at the target location, the control module controls the interaction module to interact with the care recipient according to the caregiving task information so as to collect health status input from the care recipient, and generates a status report accordingly. The status report includes health status information and status evaluation information of the care recipient.Type: ApplicationFiled: October 9, 2024Publication date: April 17, 2025Inventors: Huanyue Liao, Tzu-Yi Hung, Li Han Chen, Qing Liu
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Publication number: 20250126936Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes an upper surface; a plurality of exposed regions, formed in the semiconductor stack and exposing the upper surface; a lower protective layer, covering the exposed regions and the second semiconductor layer; a first reflective structure, formed on the second semiconductor layer and including a plurality of first openings on the second semiconductor layer; a second reflective structure, formed on the first reflective structure and electrically connected to the second semiconductor layer through the plurality of first openings; and an upper protective layer, formed on the second reflective structure; wherein the upper protective layer contacts and overlaps the lower protective layer on the exposed regions; wherein the first reflective structure and theType: ApplicationFiled: December 17, 2024Publication date: April 17, 2025Inventors: Jhih-Yong YANG, Hsin-Ying WANG, De-Shan KUO, Chao-Hsing CHEN, Yi-Hung LIN, Meng-Hsiang HONG, Kuo-Ching HUNG, Cheng-Lin LU
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Publication number: 20250123631Abstract: An autonomous mobile robot and an operating method thereof are provided. The autonomous mobile robot includes a movement module, a detection module, a control module and an interaction module. The control module includes a determination unit and a navigation unit. The determination unit determines whether there is an obstacle near or on a predetermined path of the autonomous mobile robot according to the environment information. When the obstacle is on the predetermined path, the navigation unit decides an obstacle avoidance strategy according to the environment information and the type of the obstacle. The obstacle avoidance strategy at least includes moving along a side path, stopping aside to yield, moving backward and stopping at a yielding point to yield, and detouring. When the obstacle is near or on the predetermined path, the interaction module performs an interaction action according to the obstacle avoidance strategy and the type of the obstacle.Type: ApplicationFiled: October 9, 2024Publication date: April 17, 2025Inventors: Chun-Lin Chen, Ying Song, Li Han Chen, Tzu-Yi Hung, Yongjun Wee, Qing Liu
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Patent number: 12270709Abstract: An infrared sensor uses an infrared lens with infrared filtering and focusing functions. Thus, an infrared filter can be omitted to reduce the costs and volume. In addition, a getter on the inside of a metal cover of the infrared sensor can be activated when the metal cover is soldered to the substrate of the infrared sensor. Therefore, the packaging process of the infrared sensor can be simplified.Type: GrantFiled: May 25, 2021Date of Patent: April 8, 2025Assignee: TXC CORPORATIONInventors: Tzong-Sheng Lee, Jen-Wei Luo, Chia-Hao Weng, Chun-Chi Lin, Ting-Chun Hsu, Hui-Jou Yu, Yi-Hung Lin, Sung-Hung Lin
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Publication number: 20250111056Abstract: Techniques are described herein in which boot firmware validated by secure flash memory validates read-only portions of firmware stored by the firmware or a downloaded image of the read-only portions. The secure flash memory validates a portion of the firmware, which includes the boot firmware and a reference hash of the read-only portions, by comparing a calculated hash of the portion and the reference hash of the portion. The boot firmware initiates a boot of the firmware and validates the read-only portions (or the downloaded image of the read-only portions) by comparing a calculated hash of the read-only portions (or a calculated hash of the downloaded image) and the reference hash of the read-only portions. The boot firmware completes the boot of the firmware based at least on the read-only portions (or the downloaded image) being validated.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Inventors: Cheng-Yi HUNG, Vimalraj Vasudevan THEKKOOT, Rochak CHADHA, Gregory J. ZAVERTNIK
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Publication number: 20250105068Abstract: An electronic package and a manufacturing method thereof are provided, in which a first barrier body and a second barrier body are disposed respectively, and a heat dissipation structure is formed with a hole thereon. Thereby, gas in the heat dissipation structure can be discharged via the hole, so as to prevent the gas from remaining in a thermal conductive layer and affecting the heat dissipation effect.Type: ApplicationFiled: July 2, 2024Publication date: March 27, 2025Inventors: Chuan-Shun LI, Pin-Jing SU, Liang-Yi HUNG, Chia-Cheng CHEN, Yu-Po WANG
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Patent number: 12255638Abstract: The disclosure provides an electrical apparatus, including a substrate, a plurality of gate driver units and a plurality of gate lines. The gate driver units are disposed on the substrate. The gate lines are disposed on the substrate. Each of the gate lines is respectively electrically connected to the corresponding gate driver unit. Each of the gate lines is configured to transmit a respective gate signal. The gate lines include a first gate line and a second gate line. The first gate line and the second gate line are configured to transmit the respective gate signals at a same time.Type: GrantFiled: January 31, 2023Date of Patent: March 18, 2025Assignee: Innolux CorporationInventors: Hsiu-Yi Tsai, Yu-Ti Huang, Yu-Hsiang Chiu, Yi-Hung Lin
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Publication number: 20250089379Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.Type: ApplicationFiled: November 26, 2024Publication date: March 13, 2025Inventors: Tao-Yi HUNG, Wun-Jie LIN, Jam-Wem LEE, Kuo-Ji CHEN
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Patent number: 12243246Abstract: An image processing method for a video processor, for generating an extrapolated frame according to a previous frame and a current frame, includes steps of: projecting a plurality of motion vectors (MVs) to the extrapolated frame subsequent to the current frame; determining whether a block of the extrapolated frame is projected by at least two of the MVs; selecting at least two candidate MVs from the MVs projected to the block when the block is projected by at least two of the MVs; calculating a blended MV which is a mixture of the at least two candidate MVs, and projecting the blended MV to the previous frame; obtaining a reference MV corresponding to position of the previous frame projected by the blended MV; and comparing the reference MV with the at least two candidate MVs, to select a final MV for the block from the at least two candidate MVs.Type: GrantFiled: September 21, 2022Date of Patent: March 4, 2025Assignee: NOVATEK Microelectronics Corp.Inventors: Yi-Hung Huang, Hsiao-En Chang