Abstract: A laser module is provided. The laser module includes a substrate, a laser diode and a diffuser. The substrate has a surface and a base plane, wherein the base plane is parallel to the surface. The laser diode is disposed on the surface. The diffuser is disposed above the laser diode, wherein an included angle is formed between the diffuser and the base plane, and the included angle is greater than 5 degrees.

Abstract: The present invention provides a preparation method of pharmaceutical composition for treating chronic stroke, involving injection via brain into the cranium of a patient having chronic stroke for six months or more; the pharmaceutical composition is a suspension at least comprising adipose-derived stem cells treated by cell expansion, an active synergistic component and a growth factor, wherein the expression level of CD34 and CD45 of the adipose-derived stem cells treated by cell expansion is 10% or less, and the expression level of CD90 and CD105 is 90% or more; the active synergistic component is an extracellular vesicle; the growth factor is at least one selected from the group consisting of HGF, G-CSF, Fractalkine, IP-10, EGF, IL-1?, IL-1?, IL-4, IL-5, IL-13, IFN?, TGF? and sCD40L. The present invention overcomes the limitations of previous cell therapy and provides a cell-based preparation that is clinically safe and therapeutically effective for chronic cerebral stroke.

Abstract: An electronic device including a circuit layer, an electronic element, a first flow-path structure and a fluid material is disclosed. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The first flow-path structure includes a first flow path, and the electronic element is disposed in the first flow-path structure. The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element. The circuit layer includes an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes an upper surface; a plurality of exposed regions, formed in the semiconductor stack and exposing the upper surface; a lower protective layer, covering the exposed regions and the second semiconductor layer; a first reflective structure, formed on the second semiconductor layer and including a plurality of first openings on the second semiconductor layer; a second reflective structure, formed on the first reflective structure and electrically connected to the second semiconductor layer through the plurality of first openings; and an upper protective layer, formed on the second reflective structure; wherein the upper protective layer contacts and overlaps the lower protective layer on the exposed regions; wherein the first reflective structure and the

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: A driving circuit includes a driving transistor, first to second capacitors and first to third switching transistors. The driving transistor is configured to control a driving current provided to a light emitting element to emit light. The first capacitor includes a first terminal coupled to a gate terminal of the driving transistor. The first switching transistor coupled between a second terminal of the first capacitor and a driving voltage terminal. The second switching transistor includes a first terminal coupled to a gate terminal of the first switching transistor and a second terminal coupled to a first reference voltage terminal. The third switching transistor coupled between a gate terminal of the second switching transistor and a second reference voltage terminal. The second capacitor includes a first terminal coupled to a gate terminal of the third switching transistor and a second configured to receive a sweep signal.

Abstract: A connecting device used for electrically connecting a power source with a power consuming module is provided. The connecting device includes a female connecting base and a male connecting base. The female connecting base has two opposite surfaces, a rim disposed on one of the surfaces and two terminals exposed on the surfaces. The terminals are connected to the live wire and neutral wire of the power source separately. The male connecting base includes a clamp, two conductive strips, and a ground strip. The rim is clamped, and the male connecting base is fastened to the female connecting base by the clamp. The terminals are connected to the conductive strips, while the end surface of each conductive strip protrudes from the surface of the male connecting base. The ground strip includes a ground surface which protrudes from the end surfaces of the conductive strips.

Abstract: A hydrocarbon resin polymer including a repeating unit (A) is derived from dicyclopentadiene (DCPD). The hydrocarbon resin polymer has a fluorine substituent, and the content of the fluorine substituent is 100 to 4500 ppm based on the total weight of the hydrocarbon resin polymer. A manufacturing method of the above hydrocarbon resin polymer. The manufacturing method includes polymerizing a mixture in the presence of a fluorine-containing compound, wherein the fluorine-containing compound is a boron trifluoride complex and the mixture includes a dicyclopentadiene. A substrate structure includes a resin layer, and a conductive layer disposed on the resin layer. The resin layer is formed from a resin composition including the above hydrocarbon resin polymer using a cross-linking process.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: A method of forming a semiconductor device includes: forming a via in a first dielectric layer disposed over a substrate; forming a second dielectric layer over the first dielectric layer; forming an opening in the second dielectric layer, where the opening exposes an upper surface of the via; selectively forming a capping layer over the upper surface of the via, where the capping layer has a curved upper surface that extends above a first upper surface of the first dielectric layer distal from the substrate; after forming the capping layer, forming a barrier layer in the opening over the capping layer and along sidewalls of the second dielectric layer exposed by the opening; and filling the opening by forming an electrically conductive material over the barrier layer.

Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof. The Houttuynia cordata hydroponic culture medium includes a plant fertilizer and a Houttuynia cordata growth-promoting additive. The Houttuynia cordata growth-promoting additive is selected from the group consisting of: vitamin B complex, seaweed essence, amino acid, microorganism, and a combination thereof. An electronic conductivity of the Houttuynia cordata hydroponic culture medium is between 0.4 ms/cm and 2.0 ms/cm.

Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.

Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

Abstract: A polymer is a biodegradable polymer, and a constituent monomer of the polymer includes a 2-hydroxyethyl methacrylate, a lactide and a caprolactone. When an average molecular weight of the polymer is Mw, a degradation rate of the polymer on a 7th day is Dr7, and a time for the polymer to reach a 1% degradation rate is TDr1p, the specific conditions related to Mw and Dr7 or TDr1p, respectively, can be satisfied.

Abstract: An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.

Abstract: Disclosed is a pixel circuit. A pulse width signal generator provides a pulse width signal to a control terminal of a light-emitting control switch on a drive current path of a drive current generator. A multiple lighting controller adjusts the pulse width signal provided by the pulse width signal generator according to a multiple emission control signal to allow a light-emitting element to perform multi-emission.

Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

Abstract: A method for performing automatic layout defect checking (ALDC) control regarding circuit design, associated apparatus and an associated computer-readable medium are provided. The method applicable to a processing circuit may include: providing a web-based entry in an ALDC control system running on a processing circuit, for any user among multiple users to upload at least a layout file of a package substrate design of at least one package substrate to the ALDC control system, in order to obtain at least the layout file from a client electronic device through the web-based entry; utilizing at least one backend program module to check the layout file according to a plurality of predetermined layout defect checking rules to generate at least one checking result, and create a layout defect checking report of the package substrate design; and sending the layout defect checking report corresponding to the layout file to the client electronic device.