Patents by Inventor Yi-Hung Chen
Yi-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12230740Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.Type: GrantFiled: April 22, 2021Date of Patent: February 18, 2025Assignee: EPISTAR CORPORATIONInventors: Jhih-Yong Yang, Hsin-Ying Wang, De-Shan Kuo, Chao-Hsing Chen, Yi-Hung Lin, Meng-Hsiang Hong, Kuo-Ching Hung, Cheng-Lin Lu
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Patent number: 12224226Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.Type: GrantFiled: August 29, 2022Date of Patent: February 11, 2025Assignee: InnoLux CorporationInventors: Chin-Lung Ting, Chung-Kuang Wei, Cheng-Chi Wang, Yeong-E Chen, Yi-Hung Lin
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Publication number: 20250034323Abstract: A polymer is a biodegradable polymer, and a constituent monomer of the polymer includes a 2-hydroxyethyl methacrylate, a lactide and a caprolactone. When an average molecular weight of the polymer is Mw, a degradation rate of the polymer on a 7th day is Dr7, and a time for the polymer to reach a 1% degradation rate is TDr1p, the specific conditions related to Mw and Dr7 or TDr1p, respectively, can be satisfied.Type: ApplicationFiled: June 27, 2024Publication date: January 30, 2025Inventors: Wei-Yuan CHEN, Po-Tsun CHEN, Rih-Sian CHEN, Yi-Rou LU, Yu Jie HONG, Chun-Hung TENG
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Publication number: 20250029538Abstract: Disclosed is a pixel circuit. A pulse width signal generator provides a pulse width signal to a control terminal of a light-emitting control switch on a drive current path of a drive current generator. A multiple lighting controller adjusts the pulse width signal provided by the pulse width signal generator according to a multiple emission control signal to allow a light-emitting element to perform multi-emission.Type: ApplicationFiled: July 17, 2024Publication date: January 23, 2025Applicant: AUO CorporationInventors: Chih-Lung Lin, Yi-Jui Chen, Jui-Hung Chang, Yi-Chien Chen, Ming-Yang Deng, Ming-Hung Chuang
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Publication number: 20250029910Abstract: An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.Type: ApplicationFiled: October 8, 2024Publication date: January 23, 2025Applicant: Innolux CorporationInventors: Yeong-E Chen, Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang
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Patent number: 12205854Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.Type: GrantFiled: September 19, 2023Date of Patent: January 21, 2025Assignee: InnoLux CorporationInventors: Yeong-E Chen, Kuang-Chiang Huang, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng
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Publication number: 20250005257Abstract: A method for performing automatic layout defect checking (ALDC) control regarding circuit design, associated apparatus and an associated computer-readable medium are provided. The method applicable to a processing circuit may include: providing a web-based entry in an ALDC control system running on a processing circuit, for any user among multiple users to upload at least a layout file of a package substrate design of at least one package substrate to the ALDC control system, in order to obtain at least the layout file from a client electronic device through the web-based entry; utilizing at least one backend program module to check the layout file according to a plurality of predetermined layout defect checking rules to generate at least one checking result, and create a layout defect checking report of the package substrate design; and sending the layout defect checking report corresponding to the layout file to the client electronic device.Type: ApplicationFiled: June 10, 2024Publication date: January 2, 2025Applicant: MEDIATEK INC.Inventors: Shu-Huan Chang, Yi-Hung Chen, Chih-Jung Hsu, Chen Lien, Guan-Qi Fang, Deng-Yao Tu, Po-Yang Chen
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Patent number: 12182967Abstract: The present disclosure describes systems and techniques for creating a super-resolution image (122) of a scene captured by a user device (102). Natural handheld motion (110) introduces, across multiple frames (204, 206, 208) of an image of a scene, sub-pixel offsets that enable the use of super-resolution computations (210) to form color planes (212, 214, 216), which are accumulated (218) and combined (220) to create a super-resolution image (122) of the scene.Type: GrantFiled: August 6, 2019Date of Patent: December 31, 2024Assignee: Google LLCInventors: Yi Hung Chen, Chia-Kai Liang, Bartlomiej Maciej Wronski, Peyman Milanfar, Ignacio Garcia Dorado
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Patent number: 12150755Abstract: An integrated display with antenna is used in wireless communications devices, including mobile phones and Augmented Reality and Virtual Reality (AR/VR) devices, to enhance radio frequency coverage while minimizing the overall sized of the wireless communication devices. The antenna's geometry can be precisely determined by manipulating the conductive and dielectric pixels within the display panel. The dielectric material within the display panel can be composed of metamaterials. Additionally, the antenna in the display panel can be structured as an antenna array. This array configuration optimizes mobile device coverage and performance by shaping and directing the radiation pattern of signals.Type: GrantFiled: January 22, 2024Date of Patent: November 26, 2024Assignee: Micro Mobio CorporationInventors: Zlatko Aurelio Filipovic, Weiping Wang, Adam James Wang, Guan-Wu Wang, Yi-Hung Chen
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Patent number: 12112904Abstract: The teaching equipment of an electromechanical system provided by the present invention is used to connect an emergency stop loop of electromechanical equipment, including a multi-stage key switch, an enabling switch and a safety control device. The multi-stage key switch is used to switch between a first mode and a second mode. The multi-stage key switch generates a switching signal during switching. The enabling switch is connected to the emergency stop loop. The safety control device is used to receive the switching signal. The safety control device includes a transient emergency stop circuit and a disconnection loop time. The safety control device triggers the emergency stop loop to enter the emergency stop state according to the switching signal. The emergency stop state includes that the transient emergency stop circuit interrupts the emergency stop loop until the disconnection loop time is up.Type: GrantFiled: January 25, 2022Date of Patent: October 8, 2024Assignee: HIWIN TECHNOLOGIES CORP.Inventors: Yen-Shun Huang, Yi-Hung Chen, Shun-Kai Chang
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Publication number: 20240242016Abstract: A layout routing method includes determining a routing pattern according to a swapping rule, a via pattern, area constraints and pin locations; optimizing swapping in differential pairs according to the routing pattern; extracting features of each routing net to obtain extracted features; using an unsupervised algorithm to generate different routing groups according to the extracted features; and determining a routing order of the routing groups according to complex features of the routing groups.Type: ApplicationFiled: December 25, 2023Publication date: July 18, 2024Applicant: MEDIATEK INC.Inventors: Chih-Jung Hsu, Chen Lien, Deng-Yao Tu, Po-Yang Chen, Guan-Qi Fang, Shu-Huan Chang, Yi-Hung Chen, Yao-Chun Su, Yu-Yang Chen
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Patent number: 12010440Abstract: The present disclosure describes systems and techniques directed to optical image stabilization movement to create a super-resolution image of a scene. The systems and techniques include a user device (102) introducing (502), through an optical image stabilization system (114), movement to one or more components of a camera system (112) of the user device (102). The user device (102) then captures (504) respective and multiple frames (306) of an image of a scene, where the respective and multiple frames (306) of the image of the scene have respective, sub-pixel offsets of the image of the scene across the multiple frames (306) as a result of the introduced movement to the one or more components of the camera system (112). The user device (102) performs (506), based on the respective, sub-pixel offsets of the image of the scene across the respective, multiple frames (306), super-resolution computations and creates (508) the super-resolution image of the scene based on the super-resolution computations.Type: GrantFiled: March 15, 2023Date of Patent: June 11, 2024Assignee: Google LLCInventors: Yi Hung Chen, Chia-Kai Liang, Bartlomiej Maciej Wronski, Peyman Milanfar, Ignacio Garcia Dorado
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Patent number: 12003044Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.Type: GrantFiled: November 19, 2023Date of Patent: June 4, 2024Inventors: Guan-Wu Wang, Terng-Jie Lin, Yi-Hung Chen, Wen-Chung Liu, Weiping Wang
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Patent number: 11980694Abstract: A sterilization apparatus for a portable electronic device including a cabinet and a carrier is provided. The carrier includes a base slidably disposed on the cabinet, multiple first positioning elements and multiple second positioning elements disposed in parallel on the base, multiple sterilization light sources corresponding to the second positioning elements and multiple pressure sensors disposed in parallel in the base. The base is configured to carry at least one portable electronic device. One second positioning element is disposed between any two adjacent first positioning elements, and any first positioning element and any second positioning element adjacent to each other are separated by a positioning space. The pressure sensors are respectively located in the positioning spaces. One sterilization light source is disposed between any two adjacent pressure sensors, and the pressure sensors are configured to sense a pressure from the portable electronic device.Type: GrantFiled: May 13, 2021Date of Patent: May 14, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Yi-Hung Chen, Chih-Wen Chiang, Yun-Tung Pai, Yen-Hua Hsiao, Yao-Kuang Su, Yi-Hsuan Lin, Han-Sheng Siao
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Publication number: 20240136383Abstract: A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Yi-Hung Chen, Shih-Hsun Hsu, Yi-Fang Yang
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Patent number: 11901390Abstract: A semiconductor device includes a substrate, a dielectric layer, a plurality of dielectric patterns and a conductive pad. The substrate includes a first surface and a second surface opposite to the first surface. The dielectric layer is disposed at the first surface of the substrate, and the substrate is disposed between the dielectric layer and the second surface of the substrate. The dielectric patterns are disposed on the dielectric layer and between the first surface and the second surface of the substrate. The conductive pad is inserted between the plurality of dielectric patterns and extended into the dielectric layer.Type: GrantFiled: November 15, 2021Date of Patent: February 13, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Yi-Hung Chen, Shih-Hsun Hsu, Yi-Fang Yang
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Patent number: 11877842Abstract: A communication device comprising: a first unit having a first antenna, a second antenna, and a first signal transmitting and receiving circuitry; a second unit having a third antenna, a fourth antenna, and a second signal transmitting and receiving circuitry, wherein the second unit is located in proximity to the first unit; and wherein the second unit is capable of receiving signals at a first signal frequency, down converting the signals to a second signal frequency, and relaying the signals through a barrier to the first unit. Wherein the first signal frequency is in the millimeter wave range and the second signal frequency is in the microwave range.Type: GrantFiled: March 14, 2022Date of Patent: January 23, 2024Assignee: Micro Mobio CorporationInventors: Zlatko Aurelio Filipovic, Weiping Wang, Adam James Wang, Guan-Wu Wang, Yi-Hung Chen
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Publication number: 20240004254Abstract: A display device includes a driving substrate, a display medium layer, a glue layer, and a protective layer. The display medium layer is disposed on the driving substrate. The glue layer is disposed around the display medium layer. The protective layer covers the display medium layer and the glue layer, and the protective layer is bent toward the driving substrate along the glue layer.Type: ApplicationFiled: January 18, 2023Publication date: January 4, 2024Applicant: E Ink Holdings Inc.Inventors: Tsai-Wei Shei, Yen-Ze Huang, Yuan-Hsun Cheng, Yi-Hung Chen, Jen-Shiun Huang
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Publication number: 20230411564Abstract: A light-emitting diode (LED) and a manufacturing method thereof are disclosed. The LED includes: a substrate, a light-tight reflective layer, an inner epitaxial layer, an outer epitaxial layer, a non-conducting layer, an ohmic metallic body, a first electrode, and a second electrode. The inner epitaxial layer and the outer epitaxial layer are separated from each other by a separation space. In a view made from a top side of the LED, the separation space forms a closed path and surrounds the light exit hole. The separation space provides an effect of blocking an electrical current and a light emission area in the inner epitaxial layer. By redirecting light emitting from a lateral side of the inner epitaxial layer toward a top side of the LED, the LED shows a low side light ratio.Type: ApplicationFiled: January 19, 2023Publication date: December 21, 2023Inventors: YUAN-HUI FU, YI-HUNG CHEN, TAI-HSIANG HU
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Patent number: D1033422Type: GrantFiled: May 15, 2020Date of Patent: July 2, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Han-Sheng Siao, Yi-Hsuan Lin, Yen-Hua Hsiao, Yun-Tung Pai, Yi-Hung Chen, Chuan-Fong Lee