Abstract: A plasticizer, which is biodegradable, has a molecule including a central structure, at least two connecting structures and at least one side-chain structure. The central structure includes at least one of a benzene derivative and at least one amino acid. The connecting structures are respectively connected to the central structure, wherein the connecting structures include a first connecting structure and a second connecting structure. The first connecting structure is an amine group, and the second connecting structure is a carboxyl group. The side-chain structure is a chain of multiple carbon atoms, and the side-chain structure is connected to at least one of the first connecting structure and the second connecting structure. An amide bond is formed as the side-chain structure connected to the amine group, and an ester bond is formed as the side-chain structure connected to the carboxyl group.

Abstract: A semiconductor device includes a bridge carrier, a first die, a second die, a first encapsulant, a cap carrier, a third die, and a second encapsulant. The bridge carrier includes a carrier substrate and a bridge redistribution structure disposed on the carrier substrate. The first die and the second die are disposed side by side on the bridge carrier. The bridge redistribution structure electrically connects the first die and the second die. The first encapsulant laterally encapsulates the first die and the second die. The cap carrier is disposed over the first die and the second die. The third die is located between the first die and the cap carrier. The second encapsulant laterally encapsulates the third die.

Abstract: The present invention provides a topical composition having a fermented product of lactic acid bacteria synbiotics as an active ingredient. The fermented product of lactic acid bacteria synbiotics is obtained by performing a fermenting step with lactic acid bacteria and a deactivating step on a fermenting substrate. The lactic acid bacteria are consisting of Lactobacillus salivarius subsp. salicinius AP-32, Bifidobacterium animalis subsp. lactis CP-9 and Lactobacillus acidophilus TYCA06. The fermenting substrate includes animal protein, plant protein and/or plant extracts. The aforementioned fermented product of lactic acid bacteria synbiotics can effectively inhibit the growth of Staphylococcus aureus and/or Propionibacterium acnes, and can be used in the topical composition.

Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.

Abstract: A method for tuning a plurality of image signal processor (ISP) parameters of a camera includes performing a first iteration. The first iteration includes extracting image features from an initial image, arranging a tuning order of the plurality of ISP parameters of the camera according to at least the plurality of ISP parameters and the image features, tuning a first set of the ISP parameters according to the tuning order to generate a first tuned set of the ISP parameters, and replacing the first set of the ISP parameters with the first tuned set of the ISP parameters in the plurality of ISP parameters to generate a plurality of updated ISP parameters.

Abstract: An integrated display with antenna is used in wireless communications devices, including mobile phones and Augmented Reality and Virtual Reality (AR/VR) devices, to enhance radio frequency coverage while minimizing the overall sized of the wireless communication devices. The antenna's geometry can be precisely determined by manipulating the conductive and dielectric pixels within the display panel. The dielectric material within the display panel can be composed of metamaterials. Additionally, the antenna in the display panel can be structured as an antenna array. This array configuration optimizes mobile device coverage and performance by shaping and directing the radiation pattern of signals.

Abstract: The present disclosure provides bispecific binding proteins and fragments thereof which bind to human CD137 and a tumor associated antigen (e.g., Claudin-6, Claudin 18.2, or Nectin-4), to polynucleotide sequences encoding these antibodies and to cells producing them. The disclosure further relates to therapeutic compositions comprising these antibodies, and to methods of their use for cancer detection, prognosis and antibody-based immunotherapy.

Abstract: An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.

Abstract: A power converter is provided. The power converter includes first to fourth switches electrically connected in series, a flying capacitor and a controller. Positive and negative terminals of the flying capacitor are electrically connected to the second and third switches respectively. The controller operates the first and fourth switches to perform a first complementary switching with a first dead time, and operates the second and third switches to perform a second complementary switching with a second dead time. The controller determines to regulate the first or second dead time by detecting a capacitor voltage of the flying capacitor, such that the capacitor voltage of the flying capacitor is maintained within a balance voltage range.

Abstract: A method and apparatus for minimizing silicon germanium facets in planar metal oxide semiconductor structures is disclosed. For example, a device fabricated according to the method may include a semiconductor substrate, a plurality of gate stacks formed on the substrate, a plurality of source/drain regions formed from silicon germanium, and a shallow trench isolation region positioned between two source/drain regions of the plurality of source/drain regions. Each source/drain region of the plurality of source/drain regions is positioned adjacent to at least one gate stack of the plurality of gate stacks. Moreover, the shallow trench isolation region forms a trench in the substrate without intersecting the two source/drain regions.

Abstract: A polymer, which is a composition of a battery, includes a polyester. The polyester is polymerized by at least two monomers, wherein each of the at least two monomers is selected from a group consisting of a carbonate ester and a polyol. The polyester can further include an end-capped polycarbonate ester, and the end-capped polycarbonate ester includes an inert group on an end thereof.

Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region and a second cell region and a diffusion region on the substrate extending through the first cell region and the second cell region. Preferably, the diffusion region includes a first H-shape and a second H-shape according to a top view.

Abstract: A polymer has a degradability and includes a monomer. The monomer of the polymer includes a benzene derivative, a lactide and a caprolactone. A ratio of the benzene derivative in the polymer is smaller than a ratio of the lactide in the polymer. The ratio of the benzene derivative in the polymer is smaller than a ratio of the caprolactone in the polymer.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: The teaching equipment of an electromechanical system provided by the present invention is used to connect an emergency stop loop of electromechanical equipment, including a multi-stage key switch, an enabling switch and a safety control device. The multi-stage key switch is used to switch between a first mode and a second mode. The multi-stage key switch generates a switching signal during switching. The enabling switch is connected to the emergency stop loop. The safety control device is used to receive the switching signal. The safety control device includes a transient emergency stop circuit and a disconnection loop time. The safety control device triggers the emergency stop loop to enter the emergency stop state according to the switching signal. The emergency stop state includes that the transient emergency stop circuit interrupts the emergency stop loop until the disconnection loop time is up.

Abstract: Some implementations described herein provide an inductor device formed in a substrate of a semiconductor device including an integrated circuit device. The inductor device may use one or more conduction layers that are included in the substrate. Furthermore, the inductor device may be electrically coupled to the integrated circuit device. By forming the inductor device in the substrate of the semiconductor device, an electrical circuit including the inductor device and the integrated circuit device may be formed within a single semiconductor device.

Abstract: An electronic device, including an active device substrate, an insulation film, a vertical wire, and an anisotropic conductive adhesive, is provided. The active device substrate includes a substrate, a first wire, and a second wire. The first wire is configured on a first surface of the substrate, the second wire is configured on a second surface of the substrate, and a side surface connects the first surface to the second surface that is opposite to the first surface. The insulation film is configured on the side surface of the substrate. The vertical wire is configured on a surface of the insulation film and is located between the insulation film and the side surface of the substrate. The anisotropic conductive adhesive is configured between the vertical wire and the side surface of the substrate and electrically connects the vertical wire to the first wire and the second wire.

Abstract: A motor driver is provided. The motor driver includes an AC/DC converter, a DC/AC converter, a heat dissipation plate and a busbar module. The AC/DC converter converts an AC input power to a DC power and includes a first thermal module, a second thermal module, a first capacitor pack and a second capacitor pack. The DC/AC converter is connected with the AC/DC converter, converts the DC power to an AC output power, and includes a third thermal module. The heat dissipation plate includes an upper surface and a lower surface. The first thermal module is disposed on the upper surface. The second thermal module and the third thermal module are disposed on two opposite surfaces, respectively. The first capacitor pack is disposed on the upper surface. The second capacitor pack is disposed on the lower surface and corresponding to the first capacitor pack.

Abstract: An electronic switch device and an electronic switch system are provided, wherein the electronic switch system includes: an electronic switch device, which includes: a sensing module, which includes: a pressure sensing module for providing a pressure sensing signal; and a touch control sensing module disposed on the pressure sensing module for providing a touch control sensing signal; and a comparator circuit coupled to the sensing module for receiving the pressure sensing signal.

Abstract: A method forming a semiconductor package device includes: providing a substrate; forming a flip chip die on a first side on the substrate; and forming a molding compound on the first side of the substrate. The molding compound covers the flip chip die. The method further includes forming a heat sink on the molding compound; and forming a taping layer on a second side of the substrate, wherein the second side is opposite from the first side in a vertical direction. After forming the taping layer, the method further includes performing a pre-cut process and an etching process on the heat sink; and removing the taping layer.