Patents by Inventor Yi-Hung Chen
Yi-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250101151Abstract: A hydrocarbon resin polymer including a repeating unit (A) is derived from dicyclopentadiene (DCPD). The hydrocarbon resin polymer has a fluorine substituent, and the content of the fluorine substituent is 100 to 4500 ppm based on the total weight of the hydrocarbon resin polymer. A manufacturing method of the above hydrocarbon resin polymer. The manufacturing method includes polymerizing a mixture in the presence of a fluorine-containing compound, wherein the fluorine-containing compound is a boron trifluoride complex and the mixture includes a dicyclopentadiene. A substrate structure includes a resin layer, and a conductive layer disposed on the resin layer. The resin layer is formed from a resin composition including the above hydrocarbon resin polymer using a cross-linking process.Type: ApplicationFiled: September 25, 2024Publication date: March 27, 2025Inventors: Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Ka Chun AU-YEUNG, Chiung-Yao HUANG, Tzu-Yin HUANG, Yi-Hsuan TANG
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Patent number: 12261069Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.Type: GrantFiled: January 19, 2024Date of Patent: March 25, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
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Publication number: 20250081904Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof. The Houttuynia cordata hydroponic culture medium includes a plant fertilizer and a Houttuynia cordata growth-promoting additive. The Houttuynia cordata growth-promoting additive is selected from the group consisting of: vitamin B complex, seaweed essence, amino acid, microorganism, and a combination thereof. An electronic conductivity of the Houttuynia cordata hydroponic culture medium is between 0.4 ms/cm and 2.0 ms/cm.Type: ApplicationFiled: November 22, 2024Publication date: March 13, 2025Inventors: FANG-RONG CHANG, WEI-HUNG WU, YI-HONG TSAI, CHUNG-HSIEN CHEN, YEN-CHI LOO, HSUEH-ER CHEN, YEN-CHANG CHEN, HUI-PING HSIEH, CHEN HSIEH
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Publication number: 20250087533Abstract: A method of forming a semiconductor device includes: forming a via in a first dielectric layer disposed over a substrate; forming a second dielectric layer over the first dielectric layer; forming an opening in the second dielectric layer, where the opening exposes an upper surface of the via; selectively forming a capping layer over the upper surface of the via, where the capping layer has a curved upper surface that extends above a first upper surface of the first dielectric layer distal from the substrate; after forming the capping layer, forming a barrier layer in the opening over the capping layer and along sidewalls of the second dielectric layer exposed by the opening; and filling the opening by forming an electrically conductive material over the barrier layer.Type: ApplicationFiled: March 28, 2024Publication date: March 13, 2025Inventors: Ming-Hsing Tsai, Ya-Lien Lee, Chih-Han Tseng, Kuei-Wen Huang, Kuan-Hung Ho, Ming-Uei Hung, Chih-Cheng Kuo, Yi-An Lai, Wei-Ting Chen
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Publication number: 20250066582Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.Type: ApplicationFiled: August 22, 2024Publication date: February 27, 2025Inventors: Yi-Hsuan TANG, Chien-Han CHEN, Wei-Liang LEE, Ming-Hung LIAO, Yu-Tien CHEN, Yu-Chen HSU, Tzu-Yuan SHIH, Ka Chun AU-YEUNG
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Patent number: 12230740Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.Type: GrantFiled: April 22, 2021Date of Patent: February 18, 2025Assignee: EPISTAR CORPORATIONInventors: Jhih-Yong Yang, Hsin-Ying Wang, De-Shan Kuo, Chao-Hsing Chen, Yi-Hung Lin, Meng-Hsiang Hong, Kuo-Ching Hung, Cheng-Lin Lu
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Patent number: 12224226Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.Type: GrantFiled: August 29, 2022Date of Patent: February 11, 2025Assignee: InnoLux CorporationInventors: Chin-Lung Ting, Chung-Kuang Wei, Cheng-Chi Wang, Yeong-E Chen, Yi-Hung Lin
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Publication number: 20250034323Abstract: A polymer is a biodegradable polymer, and a constituent monomer of the polymer includes a 2-hydroxyethyl methacrylate, a lactide and a caprolactone. When an average molecular weight of the polymer is Mw, a degradation rate of the polymer on a 7th day is Dr7, and a time for the polymer to reach a 1% degradation rate is TDr1p, the specific conditions related to Mw and Dr7 or TDr1p, respectively, can be satisfied.Type: ApplicationFiled: June 27, 2024Publication date: January 30, 2025Inventors: Wei-Yuan CHEN, Po-Tsun CHEN, Rih-Sian CHEN, Yi-Rou LU, Yu Jie HONG, Chun-Hung TENG
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Publication number: 20250029910Abstract: An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.Type: ApplicationFiled: October 8, 2024Publication date: January 23, 2025Applicant: Innolux CorporationInventors: Yeong-E Chen, Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang
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Publication number: 20250029538Abstract: Disclosed is a pixel circuit. A pulse width signal generator provides a pulse width signal to a control terminal of a light-emitting control switch on a drive current path of a drive current generator. A multiple lighting controller adjusts the pulse width signal provided by the pulse width signal generator according to a multiple emission control signal to allow a light-emitting element to perform multi-emission.Type: ApplicationFiled: July 17, 2024Publication date: January 23, 2025Applicant: AUO CorporationInventors: Chih-Lung Lin, Yi-Jui Chen, Jui-Hung Chang, Yi-Chien Chen, Ming-Yang Deng, Ming-Hung Chuang
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Patent number: 12205854Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.Type: GrantFiled: September 19, 2023Date of Patent: January 21, 2025Assignee: InnoLux CorporationInventors: Yeong-E Chen, Kuang-Chiang Huang, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng
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Publication number: 20250005257Abstract: A method for performing automatic layout defect checking (ALDC) control regarding circuit design, associated apparatus and an associated computer-readable medium are provided. The method applicable to a processing circuit may include: providing a web-based entry in an ALDC control system running on a processing circuit, for any user among multiple users to upload at least a layout file of a package substrate design of at least one package substrate to the ALDC control system, in order to obtain at least the layout file from a client electronic device through the web-based entry; utilizing at least one backend program module to check the layout file according to a plurality of predetermined layout defect checking rules to generate at least one checking result, and create a layout defect checking report of the package substrate design; and sending the layout defect checking report corresponding to the layout file to the client electronic device.Type: ApplicationFiled: June 10, 2024Publication date: January 2, 2025Applicant: MEDIATEK INC.Inventors: Shu-Huan Chang, Yi-Hung Chen, Chih-Jung Hsu, Chen Lien, Guan-Qi Fang, Deng-Yao Tu, Po-Yang Chen
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Patent number: 12182967Abstract: The present disclosure describes systems and techniques for creating a super-resolution image (122) of a scene captured by a user device (102). Natural handheld motion (110) introduces, across multiple frames (204, 206, 208) of an image of a scene, sub-pixel offsets that enable the use of super-resolution computations (210) to form color planes (212, 214, 216), which are accumulated (218) and combined (220) to create a super-resolution image (122) of the scene.Type: GrantFiled: August 6, 2019Date of Patent: December 31, 2024Assignee: Google LLCInventors: Yi Hung Chen, Chia-Kai Liang, Bartlomiej Maciej Wronski, Peyman Milanfar, Ignacio Garcia Dorado
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Patent number: 12150755Abstract: An integrated display with antenna is used in wireless communications devices, including mobile phones and Augmented Reality and Virtual Reality (AR/VR) devices, to enhance radio frequency coverage while minimizing the overall sized of the wireless communication devices. The antenna's geometry can be precisely determined by manipulating the conductive and dielectric pixels within the display panel. The dielectric material within the display panel can be composed of metamaterials. Additionally, the antenna in the display panel can be structured as an antenna array. This array configuration optimizes mobile device coverage and performance by shaping and directing the radiation pattern of signals.Type: GrantFiled: January 22, 2024Date of Patent: November 26, 2024Assignee: Micro Mobio CorporationInventors: Zlatko Aurelio Filipovic, Weiping Wang, Adam James Wang, Guan-Wu Wang, Yi-Hung Chen
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Patent number: 12112904Abstract: The teaching equipment of an electromechanical system provided by the present invention is used to connect an emergency stop loop of electromechanical equipment, including a multi-stage key switch, an enabling switch and a safety control device. The multi-stage key switch is used to switch between a first mode and a second mode. The multi-stage key switch generates a switching signal during switching. The enabling switch is connected to the emergency stop loop. The safety control device is used to receive the switching signal. The safety control device includes a transient emergency stop circuit and a disconnection loop time. The safety control device triggers the emergency stop loop to enter the emergency stop state according to the switching signal. The emergency stop state includes that the transient emergency stop circuit interrupts the emergency stop loop until the disconnection loop time is up.Type: GrantFiled: January 25, 2022Date of Patent: October 8, 2024Assignee: HIWIN TECHNOLOGIES CORP.Inventors: Yen-Shun Huang, Yi-Hung Chen, Shun-Kai Chang
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Publication number: 20240242016Abstract: A layout routing method includes determining a routing pattern according to a swapping rule, a via pattern, area constraints and pin locations; optimizing swapping in differential pairs according to the routing pattern; extracting features of each routing net to obtain extracted features; using an unsupervised algorithm to generate different routing groups according to the extracted features; and determining a routing order of the routing groups according to complex features of the routing groups.Type: ApplicationFiled: December 25, 2023Publication date: July 18, 2024Applicant: MEDIATEK INC.Inventors: Chih-Jung Hsu, Chen Lien, Deng-Yao Tu, Po-Yang Chen, Guan-Qi Fang, Shu-Huan Chang, Yi-Hung Chen, Yao-Chun Su, Yu-Yang Chen
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Patent number: 12010440Abstract: The present disclosure describes systems and techniques directed to optical image stabilization movement to create a super-resolution image of a scene. The systems and techniques include a user device (102) introducing (502), through an optical image stabilization system (114), movement to one or more components of a camera system (112) of the user device (102). The user device (102) then captures (504) respective and multiple frames (306) of an image of a scene, where the respective and multiple frames (306) of the image of the scene have respective, sub-pixel offsets of the image of the scene across the multiple frames (306) as a result of the introduced movement to the one or more components of the camera system (112). The user device (102) performs (506), based on the respective, sub-pixel offsets of the image of the scene across the respective, multiple frames (306), super-resolution computations and creates (508) the super-resolution image of the scene based on the super-resolution computations.Type: GrantFiled: March 15, 2023Date of Patent: June 11, 2024Assignee: Google LLCInventors: Yi Hung Chen, Chia-Kai Liang, Bartlomiej Maciej Wronski, Peyman Milanfar, Ignacio Garcia Dorado
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Patent number: 12003044Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.Type: GrantFiled: November 19, 2023Date of Patent: June 4, 2024Inventors: Guan-Wu Wang, Terng-Jie Lin, Yi-Hung Chen, Wen-Chung Liu, Weiping Wang
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Patent number: 11980694Abstract: A sterilization apparatus for a portable electronic device including a cabinet and a carrier is provided. The carrier includes a base slidably disposed on the cabinet, multiple first positioning elements and multiple second positioning elements disposed in parallel on the base, multiple sterilization light sources corresponding to the second positioning elements and multiple pressure sensors disposed in parallel in the base. The base is configured to carry at least one portable electronic device. One second positioning element is disposed between any two adjacent first positioning elements, and any first positioning element and any second positioning element adjacent to each other are separated by a positioning space. The pressure sensors are respectively located in the positioning spaces. One sterilization light source is disposed between any two adjacent pressure sensors, and the pressure sensors are configured to sense a pressure from the portable electronic device.Type: GrantFiled: May 13, 2021Date of Patent: May 14, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Yi-Hung Chen, Chih-Wen Chiang, Yun-Tung Pai, Yen-Hua Hsiao, Yao-Kuang Su, Yi-Hsuan Lin, Han-Sheng Siao
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Patent number: D1033422Type: GrantFiled: May 15, 2020Date of Patent: July 2, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Han-Sheng Siao, Yi-Hsuan Lin, Yen-Hua Hsiao, Yun-Tung Pai, Yi-Hung Chen, Chuan-Fong Lee