Abstract: A rim bolt socket comprises a body and a protective ring. The body is provided with a protective section, a working section connected to the protective section, and a driving section connected to the working section. A connection between an outer peripheral wall of the protective section and an outer peripheral wall of the working section is formed with a first step, and a first combination part is formed on the outer peripheral wall of the protective section. The protective ring is sleeved on the protective section of the body, a second combination part is formed on an inner peripheral wall of the protective ring to be combined with the first combination part, and a first stopper is provided at one end of the protective ring to butt against the first step.

Abstract: An electronic device includes a substrate, a driving element, a conductive layer, and an electronic element is provided. The driving element is disposed on the substrate. The conductive layer is disposed on the substrate, wherein along a first direction, there is a first distance between the driving element and a first side of the conductive layer extended along a second direction, and there is a second distance between the driving element and a second side of the conductive layer extended along the second direction, wherein the first distance is different from the second distance. The electronic element is disposed on the conductive layer and electrically connected to the driving element through a first conductive line. In a top view, the first conductive line is overlapped with the first side of the conductive layer and the second side of the conductive layer.

Abstract: A modulating device includes multiple modulators, multiple switches, and a driving circuit. The driving circuit drives switches of more than two rows among the switches within a time period. Each of the modulators comprises a pixel circuit and a working element. The pixel circuit is electrically connected to the working element. The working element is one of a varactor and a variable resistor. The modulating device further comprises a plurality of scan lines connecting to the driving circuit. A first scan line and a second scan line transmit a first scanning signal to switches of two rows among the switches. The first scan line and the second scan line which transmit the same first scanning signal are separated by a plurality of third scan lines, and the plurality of third scan lines receive a plurality of scanning signals respectively different from the first scanning signal.

Abstract: A light-emitting device includes a semiconductor stack, an insulating reflective structure having an opening, and an electrode located on the insulating reflective structure and filled in the opening to electrically connect to the semiconductor stack. The semiconductor stack having includes a main surface, and a side surface inclined to the main surface. The light-emitting device has a dominant wavelength and a peak wavelength. The insulating reflective structure includes: a first part located on the main surface and having a first thickness; and a second part located on the side surface and having a second thickness different from the first thickness. The second part of the insulating reflective structure has a reflectivity of more than 90% for the dominant wavelength or the peak wavelength within an incident angle of 0° to 30°.

Abstract: An electronic device and a repair method thereof are provided. The repair method of the electronic device includes: providing a panel, wherein the panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor, wherein the transistor comprises a first electrode and a second electrode; and cutting at least one of the first electrode and the second electrode with a laser beam, wherein a cutting point formed by the laser beam does not overlap with the first conductive layer.

Abstract: An electronic device includes: a substrate; a scan line disposed on the substrate and used to output a first signal; a first data line disposed on the substrate and intersecting with the scan line, wherein the first data line is used to output a second signal; a first sub-pixel disposed on the substrate and receiving the first signal and the second signal; and a second sub-pixel disposed on the substrate and receiving the first signal and the second signal, wherein a color of the first sub-pixel is the same as a color of the second sub-pixel.

Abstract: A contact lens and a method of manufacturing the same are provided. The contact lens includes a contact lens body and a blue light blocking material. The blue light blocking material covers the contact lens body. The blue light blocking material includes a plurality of metal particles dispersed on the contact lens body. The contact lens has good blue light blocking efficacy and surface properties.

Abstract: A contact lens and a method of manufacturing the same are provided. The contact lens includes a contact lens body and a blue light blocking material covering the contact lens body. The blue light blocking material includes a plurality of metal particles dispersed on the contact lens body. The present invention includes compositions of at least one compound including metal ion with at least one or more reducing factors. The interactions between reducing factors endow contact lens body with homogeneous or pupil-regional preference of metal particles distribution with enhanced or decreased efficacy of blue light blocking. A further modification strengthens surface properties of contact lens including contact angle, water break-up time and long-term protein depositions.

Abstract: A light-emitting device comprises a semiconductor stack comprising a first semiconductor layer and a second semiconductor layer, wherein in a top view, the semiconductor stack comprises an outer peripheral region and an inner region, the outer peripheral region exposes the first semiconductor layer, and the second semiconductor layer is disposed in the inner region; an outer insulated structure comprising an insulation layer and a protective layer, the insulation layer comprising a plurality of first insulation layer outer openings and a second insulation layer opening; a first electrode covering the plurality of first insulation layer outer openings; and a second electrode covering the second insulation layer opening, wherein the outer insulated structure comprises a total thickness gradually decreasing from the outer peripheral region to the inner region.

Abstract: An electronic device includes a first substrate, a first conducting layer disposed on the first substrate, a first insulating layer disposed on the first conducting layer, a second conducting layer disposed on the first conducting layer, and a second insulating layer disposed on the first insulating layer. The second conducting layer includes a first conductive portion electrically connected to the first conducting layer through a first opening of the first insulating layer. The second insulating layer includes protruding patterns protruding from a surface of the first insulating layer. The protruding patterns include a first protruding pattern and a second protruding pattern separated from each other in a top view. In the top view, the first opening is disposed between the first protruding pattern and the second protruding pattern along a first direction, and the first conductive portion is spaced apart from the first protruding pattern and the second protruding pattern.

Abstract: An electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; a second insulating layer disposed on the first metal bump; a metal layer, wherein the first insulating layer is disposed between the second insulating layer and the metal layer; a second metal bump disposed between the metal layer and the first insulating layer, wherein the second metal bump electrically connects to the first metal bump; a third insulating layer disposed between the second metal bump and the first insulating layer, wherein the third insulating layer includes an opening exposing a portion of the second metal bump; and a fourth insulating layer disposed between the third insulating layer and the first insulating layer, wherein a portion of the fourth insulating layer extends and is disposed in the opening to contact the second metal bump.

Abstract: An electronic device is provided. The electronic device includes at least one electronic circuit, a scan line, and a scan signal conversion circuit. The scan line transmits a first scan signal. The scan signal conversion circuit is electrically connected to the at least one electronic circuit and the scan line. The scan signal conversion circuit receives the first scan signal, converts the first scan signal into a second scan signal, and provides the second scan signal to the at least one electronic circuit.

Abstract: A contact lens and a method of manufacturing the same are provided. The contact lens includes a contact lens body and a blue light blocking material covering the contact lens body. The blue light blocking material includes a plurality of metal particles dispersed on the contact lens body. The present invention includes compositions of at least one compound including metal ion with at least one or more reducing factors. The interactions between reducing factors endow contact lens body with homogeneous or pupil-regional preference of metal particles distribution with enhanced or decreased efficacy of blue light blocking. A further modification strengthens surface properties of contact lens including contact angle, water break-up time and long-term protein depositions.

Abstract: An electronic device includes a substrate, a driving element, a conductive layer, and an electronic element is provided. The driving element is disposed on the substrate. The conductive layer is disposed on the substrate, wherein there is a first distance (B) between the driving element and an edge of the conductive layer. The electronic element is disposed on the conductive layer and is electrically connected to the driving element, wherein there is a second distance (A) between the electronic element and the edge of the conductive layer, and the first distance (B) is greater than the second distance (A).

Abstract: The disclosure provides an adjusting device having an active region and a peripheral region adjacent to the active region. The adjusting device includes a first substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer, and a sealant layer. The first insulating layer is disposed on the first conducting layer and includes a first opening disposed in the peripheral region. The second conducting layer is disposed on the first conducting layer and electrically connected to the first conducting layer through the first opening. The second insulating layer includes multiple first protruding structures disposed in the peripheral region and on the first insulating layer. The sealant layer is disposed in the peripheral region and on the second insulating layer. The first opening is disposed between two of the first protruding structures.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.

Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

Abstract: An electronic device is provided and includes a carrier and a redistribution layer. The carrier includes an electronic component and an encapsulation structure surrounding the electronic component. The redistribution unit is disposed on the carrier and electrically connected with the electronic component. The redistribution unit includes a first isolation layer and a second isolation layer, in which the second isolation layer is farther from the electronic component than the first isolation layer, and a thickness of the first isolation layer is greater than a thickness of the second isolation layer.

Abstract: An electronic device is provided. The electronic device includes a bonding point, an electrostatic discharge protection circuit and a scan transistor. The electrostatic discharge protection circuit is electrically connected to the bonding point. The scan transistor has a first terminal, a second terminal and a control terminal. The second terminal of the scan transistor is electrically connected to the bonding point and the electrostatic discharge protection circuit.

Abstract: A communication device and a driving method thereof are provided. The communication device includes a substrate, a plurality of scan lines, and a plurality of data lines. The plurality of scan lines are disposed on the substrate and divided into R scan line groups, where R is a positive integer greater than 1. A number of the plurality of data lines is R×S, S is a positive integer, and R scan lines are simultaneously turned on.