Patents by Inventor Yi-Hung Lin

Yi-Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210135052
    Abstract: A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure includes a first dopant. The second semiconductor structure is located on the first semiconductor structure and includes a second dopant different from the first dopant. The active region includes a plurality of semiconductor pairs and is located between the first semiconductor structure and the second semiconductor structure. One of the plurality of semiconductor pairs has a barrier layer and a well layer and includes the first dopant. The barrier layer has a first thickness and a first Al content, and the well layer has a second thickness and a second Al content, the second thickness is less than the first thickness, and the second Al content is less than the first Al content.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 6, 2021
    Inventors: Yen-Chun Tseng, Kuo-Feng Huang, Shih-Chang Lee, Ming-Ta Chin, Shih-Nan Yen, Cheng-Hsing Chiang, Chia-Hung Lin, Cheng-Long Yeh, Yi-Ching Lee, Jui-Che Sung, Shih-Hao Cheng
  • Publication number: 20210124144
    Abstract: An optical element driving mechanism includes a fixed portion, a movable portion, a driving assembly, and a circuit assembly. The movable portion is connected to the optical element and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit assembly is connected to the driving assembly. The driving assembly is electrically connected to an external circuit via the circuit assembly.
    Type: Application
    Filed: October 23, 2020
    Publication date: April 29, 2021
    Inventors: Yi-Ho CHEN, Chen-Hsin HUANG, Chao-Chang HU, Chen-Chi KUO, Ying-Jen WANG, Ya-Hsiu WU, Sin-Jhong SONG, Che-Hsiang CHIU, Kuen-Wang TSAI, Mao-Kuo HSU, Tun-Ping HSUEH, I-Hung CHEN, Chun-Chia LIAO, Wei-Zhong LUO, Wen-Chang LIN
  • Publication number: 20210126048
    Abstract: A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.
    Type: Application
    Filed: January 7, 2021
    Publication date: April 29, 2021
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Ying-Tsang Liu, Yu-Chu Li, Tzu-Yang Lin, Yu-Hung Lai
  • Publication number: 20210125970
    Abstract: A micro light-emitting device module includes a circuit substrate, a planarization layer and a micro light-emitting device. The planarization layer is disposed on an upper surface of the circuit substrate and has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the circuit substrate. The micro light-emitting device is disposed on the first surface of the planarization layer. A maximum height difference of the second surface of the planarization layer is greater than a thickness of the micro light-emitting device.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 29, 2021
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Yun-Li Li, Tzu-Yang Lin, Yu-Hung Lai, Pei-Hsin Chen, Yi-Chun Shih
  • Publication number: 20210119333
    Abstract: An electromagnetic wave adjusting device includes a first substrate, a first conductive element, a first insulation layer, a second substrate, a second conductive element, a dielectric layer, and a conductive layer. The first conductive element is disposed on the first substrate. The first insulation layer is disposed on the first conductive element. The second conductive element is disposed on the second substrate. The dielectric layer is disposed between the first substrate and the second substrate. The first conductive layer is disposed on the first insulation layer and electrically connected to the first conductive element. The electromagnetic wave adjusting device includes an overlap area and a capacitance adjustable area. An overlap portion of the first conductive element and the second conductive element constitutes the overlap area, the capacitance adjustable area includes the overlap area, and at least part of the first conductive layer is disposed in the capacitance adjustable area.
    Type: Application
    Filed: September 29, 2020
    Publication date: April 22, 2021
    Applicant: Innolux Corporation
    Inventors: Hsiuyi Tsai, Yi Hung Lin, Chia-Chi Ho, Yan-Zheng Wu
  • Publication number: 20210048705
    Abstract: An electronic device including a pair of substrates, a sealant, and a heating unit is provided. Each of the pair of substrates includes a peripheral area and an active area, and each of the peripheral areas are adjacent to an edge of a corresponding one of the pair of substrates. The sealant is disposed between the pair of substrates. The heating unit is disposed on one of the pair of substrates and comprising a first portion disposed in the peripheral area of the one of the pair of substrates and adjacent to an edge of the one of the pair of substrates, a third portion disposed in the active area, and a second portion connecting the first portion and the third portion. The resistance of the first portion is less than a resistance of the third portion. Therefore, the electronic device may have improved heating efficiency.
    Type: Application
    Filed: July 27, 2020
    Publication date: February 18, 2021
    Applicant: Innolux Corporation
    Inventors: Yi Hung Lin, I-Yin Li, Chia-Chi Ho, Hsiuyi Tsai
  • Publication number: 20210050657
    Abstract: An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.
    Type: Application
    Filed: July 20, 2020
    Publication date: February 18, 2021
    Applicant: Innolux Corporation
    Inventors: Yi Hung Lin, Chung-Kuang Wei, Tang Chin Hung, I-Yin Li, Chia-Chi Ho
  • Publication number: 20210035909
    Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.
    Type: Application
    Filed: July 3, 2020
    Publication date: February 4, 2021
    Applicant: Innolux Corporation
    Inventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
  • Patent number: 10910285
    Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: February 2, 2021
    Assignee: InnoLux Corporation
    Inventors: Yi-Hung Lin, Chien-Chang Lu, Cheng-I Wu, Li-Wei Sung, Cheng-Chi Wang, Chin-Lung Ting
  • Patent number: 10903559
    Abstract: A method for manufacturing a liquid-crystal antenna device is provided. The method includes step (a) providing a first mother substrate. The first mother substrate includes a first region and a second region. The first region has a plurality of first sides. An extension line of at least one of the first sides divides the second region into a first part and a second part. The method also includes the following steps: (b) forming a first electrode layer on the first region and the second region, and (c) cutting the first mother substrate along the first sides of the first region.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: January 26, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Yi-Hung Lin, Chin-Lung Ting, Hui-Min Huang, Tang-Chin Hung
  • Publication number: 20200357732
    Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.
    Type: Application
    Filed: July 28, 2020
    Publication date: November 12, 2020
    Inventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
  • Patent number: 10818779
    Abstract: An IC manufacturing method includes forming first mandrels and second mandrels over a substrate; and forming first spacers on sidewalls of the first mandrels and second spacers on sidewalls of the second mandrels. Each of the first and second spacers has a loop structure with two curvy portions connected by two lines. The method further includes removing the first and second mandrels; and removing the curvy portions from each of the first spacers without removing the curvy portions from the second spacers. The second spacers are used for monitoring variations of the IC fabrication processes.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: October 27, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Che Tseng, Chen-Yuan Wang, Wilson Hsieh, Yi-Hung Lin, Chung-Li Huang
  • Patent number: 10763179
    Abstract: An example semiconductor wafer includes a semiconductor layer, a dielectric layer disposed on the semiconductor layer, and a layer of the metal disposed on the dielectric layer. An example method of determining an effective work function of a metal on the semiconductor wafer includes determining a surface barrier voltage of the semiconductor wafer, and determining a metal effective work function of the semiconductor wafer based, at least in part, on the surface barrier voltage.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: September 1, 2020
    Assignee: SEMILAB Semiconductor Physics Laboratory Co., Ltd.
    Inventors: Dmitriy Marinskiy, Thye Chong Loy, Jacek Lagowski, Sung-Li Wang, Lin-Jung Wu, Shyh-Shin Ferng, Yi-Hung Lin, Sheng-Shin Lin
  • Publication number: 20200190874
    Abstract: A latch mechanism includes a first and second latch body. The first and second latch body respectively includes a first and second base, a first and second latch portion and a first and second acting portion. The first latch body disposes through the second base. The second acting portion is pivoted to the second base. The second latch portion is disposed on the rotational path and limited to the first latch portion. The second acting portion includes a first and a second pushing structure. When the second acting portion is rotated along the rotational path, the second latch portion is pushed by the first pushing structure such that the second latch portion is disengaged from the first latch portion, and then the first acting portion is pushed by the second pushing structure such that the first latch body is disengaged from the second latch body in a releasing direction.
    Type: Application
    Filed: September 16, 2019
    Publication date: June 18, 2020
    Inventors: JOAKIM UIMONEN, ERIC YI-HUNG LIN
  • Patent number: 10651549
    Abstract: A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 ?m, and less than the thickness of the sealing element.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: May 12, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: I-Yin Li, Chin-Lung Ting, Chia-Chi Ho, Yi-Hung Lin
  • Publication number: 20200123656
    Abstract: A system and method for plasma enhanced deposition processes. An exemplary semiconductor manufacturing system includes a susceptor configured to hold a semiconductor wafer and a sector disposed above the susceptor. The sector includes a first plate and an overlying second plate, operable to form a plasma there between. The first plate includes a plurality of holes extending through the first plate, which vary in at least one of diameter and density from a first region of the first plate to a second region of the first plate.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Inventors: Kun-Mo LIN, Yi-Hung LIN, Jr-Hung LI, Tze-Liang LEE, Ting-Gang CHEN, Chung-Ting KO
  • Publication number: 20200091594
    Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.
    Type: Application
    Filed: August 21, 2019
    Publication date: March 19, 2020
    Inventors: Yi-Hung LIN, Tang-Chin HUNG, Chia-Chi HO, I-Yin LI
  • Patent number: D883181
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: May 5, 2020
    Assignee: MOBILITY HOLDINGS, LIMITED
    Inventors: Joakim Uimonen, Eric Yi-Hung Lin
  • Patent number: D886686
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: June 9, 2020
    Assignee: MOBILITY HOLDINGS, LIMITED
    Inventors: Joakim Uimonen, Eric Yi-Hung Lin
  • Patent number: D906183
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: December 29, 2020
    Assignee: MOBILITY HOLDINGS, LIMITED
    Inventors: Joakim Uimonen, Eric Yi-Hung Lin