Patents by Inventor Yi-Lin Chuang

Yi-Lin Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250087580
    Abstract: A method of forming a three dimensional integrated circuit (3DIC) structure includes forming a first inter-layer via which connects at a location of a first device layer, wherein the first inter-layer via has a footprint that is at least one factor of ten smaller than a footprint of a first circuit region. The method further includes forming a first conductive segment in a second device layer, different from the first device layer, wherein the first conductive segment electrically connects to the first inter-layer via.
    Type: Application
    Filed: November 21, 2024
    Publication date: March 13, 2025
    Inventors: Yi-Lin CHUANG, Ching-Fang CHEN, Jia-Jye SHEN
  • Patent number: 12242788
    Abstract: A method includes providing a placing layout of the integrated circuit; generating a routed layout including a layout region with a systematic design rule check (DRC) violation; and performing a loop when the DRC the systematic DRC violation exists. The loop includes: generating an adjusted routing layout of the integrated circuit by adjusting the layout region with the systematic DRC violation according to a target placement recipe; extracting features of the placing layout to obtain extracted data; extracting features of the layout region with the systematic DRC violation to obtain extracted routing data; generating a plurality of aggregated-cluster models based upon the extracted data and the extracted routing data; selecting a target aggregated-cluster model from the plurality of aggregated-cluster models by comparing the extracted data to the plurality of aggregated-cluster models; and selecting the target placement recipe from a plurality of placement recipes to generate the adjusted routing layout.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: March 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shih-Yao Lin, Yi-Lin Chuang, Yin-An Chen, Shih Feng Hong
  • Patent number: 12216980
    Abstract: A method includes the following operations: identifying a layer of a first layout based on a first violation generated on the layer; generating a metal density value associated with the layer; when the metal density value is larger than or equal to a preset value, classifying the first violation into a first class corresponding to routing congestions of the first layout; when the first violation is classified into the first class, assigning, to the first violation, a first operation of a plurality of first pre-stored operations corresponding to the first class; and performing the first operation to the first layout to generate a second layout.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: February 4, 2025
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin Chuang, Song Liu, Pei-Pei Chen, Heng-Yi Lin, Shih-Yao Lin, Chin-Hsien Wang
  • Publication number: 20240394460
    Abstract: Systems and methods are provided for predicting systematic design rule check (DRC) violations in a placement layout before routing is performed on the placement layout. A systematic DRC violation prediction system includes DRC violation prediction circuitry. The DRC violation prediction circuitry receives placement data associated with a placement layout. The DRC violation prediction circuitry inspects the placement data associated with the placement layout, and the placement data may include data associated with a plurality of regions of the placement layout, which may be inspected on a region-by-region basis. The DRC violation prediction circuitry predicts whether one or more systematic DRC violations would be present in the placement layout due to a subsequent routing of the placement layout.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Inventors: Yi-Lin CHUANG, Shih-Yao LIN, Szu-ju HUANG, Yin-An CHEN, Shih Feng HONG
  • Patent number: 12154851
    Abstract: A method (of forming a three dimensional integrated circuit (3DIC) structure) includes: forming an interconnection layer including forming a first inter-layer via which connects at a first predetermined location to a first circuit region of a first device layer and which has a footprint that is at least one factor of ten smaller than a footprint of the first circuit region; and forming a first conductive segment in a first metallization layer of a second device layer so as to align with and thereby connect to the first inter-layer via.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: November 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Lin Chuang, Ching-Fang Chen, Jia-Jye Shen
  • Publication number: 20240330563
    Abstract: A system and method for fixing DRC violations includes receiving a layout pattern having a design rule check (DRC) violation therein, determining that the layout pattern is an inlier based upon a comparison of the layout pattern with a plurality of previously analyzed layout patterns. The comparison may be performed by an anomaly detection algorithm. The system and method may also include selecting a recipe from a pool of recipes previously applied to the plurality of previously analyzed layout patterns for fixing the DRC violation in the layout clip upon determining that the layout pattern is an inlier.
    Type: Application
    Filed: June 7, 2024
    Publication date: October 3, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chen Huang, Heng-Yi Lin, Yi-Lin Chuang
  • Patent number: 12106034
    Abstract: Systems and methods are provided for predicting systematic design rule check (DRC) violations in a placement layout before routing is performed on the placement layout. A systematic DRC violation prediction system includes DRC violation prediction circuitry. The DRC violation prediction circuitry receives placement data associated with a placement layout. The DRC violation prediction circuitry inspects the placement data associated with the placement layout, and the placement data may include data associated with a plurality of regions of the placement layout, which may be inspected on a region-by-region basis. The DRC violation prediction circuitry predicts whether one or more systematic DRC violations would be present in the placement layout due to a subsequent routing of the placement layout.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: October 1, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Lin Chuang, Henry Lin, Szu-Ju Huang, Yin-An Chen, Amos Hong
  • Patent number: 12099793
    Abstract: Systems and methods are provided for predicting systematic design rule check (DRC) violations in a placement layout before routing is performed on the placement layout. A systematic DRC violation prediction system includes DRC violation prediction circuitry. The DRC violation prediction circuitry receives placement data associated with a placement layout. The DRC violation prediction circuitry inspects the placement data associated with the placement layout, and the placement data may include data associated with a plurality of regions of the placement layout, which may be inspected on a region-by-region basis. The DRC violation prediction circuitry predicts whether one or more systematic DRC violations would be present in the placement layout due to a subsequent routing of the placement layout.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: September 24, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Lin Chuang, Henry Lin, Szu-ju Huang, Yin-An Chen, Amos Hong
  • Patent number: 12039249
    Abstract: A system and method for fixing DRC violations includes receiving a layout pattern having a design rule check (DRC) violation therein, determining that the layout pattern is an inlier based upon a comparison of the layout pattern with a plurality of previously analyzed layout patterns. The comparison may be performed by an anomaly detection algorithm. The system and method may also include selecting a recipe from a pool of recipes previously applied to the plurality of previously analyzed layout patterns for fixing the DRC violation in the layout clip upon determining that the layout pattern is an inlier.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: July 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Chen Huang, Heng-Yi Lin, Yi-Lin Chuang
  • Patent number: 12039251
    Abstract: A device is disclosed. The cell block includes a pin disposed at a Nth metal layer in a cell layout. The first metal interconnect is disposed at a (N+1)th metal layer above the Nth metal layer and stacked over the pin, and electrically coupled to the pin. The second interconnects are disposed at a (N+2)th metal layer and stacked over the first metal interconnect, and parallel to each other. The second metal interconnects are electrically coupled to the first metal interconnect, and forming an equivalent tapping point of the pin of the cell block. The equivalent tapping point and the pin are vertically overlapped with each other, and fabrication of the device is initiated after a DRC or a SEM simulation test is passed. A first width of at least one first metal interconnect is different from a second width of one of the plurality of second metal interconnects.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: July 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Lin Chuang, Huang-Yu Chen, Yun-Han Lee
  • Patent number: 12019971
    Abstract: A violation prediction system includes machine learning circuitry trained based on past data to predict the presence of violations in electronic device designs after routing has been performed. The machine learning circuitry configured to predict, based on the past data and a pre-routing layout of an electronic device design, whether one or more violations would be present in in the electronic device design due to routing of the layout.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: June 25, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Lin Chuang, Szu-ju Huang, Shih-Yao Lin, Shih Feng Hung, Yin-An Chen
  • Publication number: 20240176945
    Abstract: A method includes: training a machine learning model with a plurality of electronic circuit placement layouts; predicting, by the machine learning model, fix rates of design rule check (DRC) violations of a new electronic circuit placement layout; identifying hard-to-fix (HTF) DRC violations among the DRC violations based on the fix rates of the DRC violations of the new electronic circuit placement layout; and fixing, by an engineering change order (ECO) tool, the DRC violations.
    Type: Application
    Filed: February 9, 2024
    Publication date: May 30, 2024
    Inventors: Ching Hsu, Shih-Yao Lin, Yi-Lin Chuang
  • Publication number: 20240135078
    Abstract: Systems, methods, and computer programs products are described for optimizing circuit synthesis for implementation on an integrated circuit. A register transfer level code description of logic behavior of a circuit. The register transfer level code description is converted into structurally defined circuit designs for multiple types of components and feature size technologies. A floor plan of each structurally defined circuit design is generated. A physically simulated circuit is created for each floor plan. A range of operating conditions is swept over to analyze power, performance, and area of each physically simulated circuit.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Inventors: Chao-Chun Lo, Boh-Yi Huang, Chih-yuan Stephen Yu, Yi-Lin Chuang, Chih-Sheng Hou
  • Publication number: 20240126973
    Abstract: A method includes: identifying a first design rule check (DRC) violation in a cluster box on an integrated circuit layout; locating a first target cell at a first original location in the cluster box, the first target cell being connected to the first DRC violation; detecting a first plurality of candidate locations for the first target cell in the cluster box; calculating resource costs associated with the first plurality of candidate locations; determining a first relocation location, among the first plurality of candidate locations, associated with a minimum resource cost for the first target cell; and relocating the first target cell from the first original location to the first relocation location.
    Type: Application
    Filed: August 10, 2023
    Publication date: April 18, 2024
    Inventors: Ching Hsu, Heng-Yi Lin, Yi-Lin Chuang
  • Publication number: 20240104285
    Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin CHUANG, Shi-Wen TAN, Song LIU, Shih-Yao LIN, Wen-Yuan FANG
  • Patent number: 11928415
    Abstract: A method includes: training a machine learning model with a plurality of electronic circuit placement layouts; predicting, by the machine learning model, fix rates of design rule check (DRC) violations of a new electronic circuit placement layout; identifying hard-to-fix (HTF) DRC violations among the DRC violations based on the fix rates of the DRC violations of the new electronic circuit placement layout; and fixing, by an engineering change order (ECO) tool, the DRC violations.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching Hsu, Shih-Yao Lin, Yi-Lin Chuang
  • Patent number: 11900037
    Abstract: Systems, methods, and computer programs products are described for optimizing circuit synthesis for implementation on an integrated circuit. A register transfer level code description of logic behavior of a circuit. The register transfer level code description is converted into structurally defined circuit designs for multiple types of components and feature size technologies. A floor plan of each structurally defined circuit design is generated. A physically simulated circuit is created for each floor plan. A range of operating conditions is swept over to analyze power, performance, and area of each physically simulated circuit.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao-Chun Lo, Boh-Yi Huang, Chih-yuan Stephen Yu, Yi-Lin Chuang, Chih-Sheng Hou
  • Patent number: 11893334
    Abstract: A method is provided and includes several operations: forming a first group of macros in a first region, wherein the first group of macros are aligned with a first boundary of a channel that is coupled thereto through pins of the first group of macros; forming a second group of macros in the first region to align with a second boundary of the channel that is coupled thereto through pins of the second group of macros, wherein the first and second groups of macros are coupled to a first register; and forming a third group of macros in a second region different from the first region. A first macro and a second macro that are in the third group of macros are aligned with the first and second boundaries respectively. The third group of macros are coupled to a second register different from the first register.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: February 6, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin Chuang, Shi-Wen Tan, Song Liu, Shih-Yao Lin, Wen-Yuan Fang
  • Patent number: 11853675
    Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: December 26, 2023
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin Chuang, Shi-Wen Tan, Song Liu, Shih-Yao Lin, Wen-Yuan Fang
  • Patent number: 11853681
    Abstract: A method includes: identifying a first design rule check (DRC) violation in a cluster box on an integrated circuit layout; locating a first target cell at a first original location in the cluster box, the first target cell being connected to the first DRC violation; detecting a first plurality of candidate locations for the first target cell in the cluster box; calculating resource costs associated with the first plurality of candidate locations; determining a first relocation location, among the first plurality of candidate locations, associated with a minimum resource cost for the first target cell; and relocating the first target cell from the first original location to the first relocation location.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching Hsu, Heng-Yi Lin, Yi-Lin Chuang