Abstract: A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

Abstract: Disclosed are a display panel and a display device. The display panel comprises: a base substrate, a plurality of scanning lines, a first insulating layer, a plurality of data lines, an interlayer insulating layer, and an auxiliary power line. The auxiliary power line comprises: a plurality of sub-auxiliary power lines and a plurality of auxiliary conduction lines; the plurality of sub-auxiliary power lines are arranged in a first direction and extend in a second direction, and two sub-auxiliary power lines that are at least partially adjacent are electrically connected by means of at least one auxiliary conduction line; the orthographic projection of at least one of the plurality of auxiliary conduction lines on the base substrate does not overlap the orthographic projections of the scanning lines on the base substrate.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: Systems and methods for implementation of a disposable miniaturized implant for treatment of Post-Operative Ileums (POI), a miniaturized implant for treating chronic GI dysmotility (e.g., dysphagia, gastroesophageal reflux disease (GERD), nausea, functional dyspepsia, blockage of transit, and gastroparesis, inflammatory bowel disease) and obesity, by providing electrical stimulation to the part of bowel going through surgery to expedite the healing process while recording the smooth muscle activities simultaneously, or providing stimulation on a treatment location of the GI tract or the branch of the vagus nerve. Systems and methods are also provided for non-invasive, transcutaneous stimulation of anatomy within the abdomen of the patient.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: A method of selectively and conformally doping semiconductor materials is disclosed. Some embodiments utilize a conformal dopant film deposited selectively on semiconductor materials by thermal decomposition. Some embodiments relate to doping non-line of sight surfaces. Some embodiments relate to methods for forming a highly doped crystalline semiconductor layer.

Abstract: Provided are a pixel circuit, a driving method and a display apparatus, including: a light emitting device; a driving transistor, configured to produce a current for driving the light emitting device to emit light according to a data voltage; a voltage control circuit, coupled to the driving transistor, wherein the voltage control circuit is configured to reset the driving transistor (M0) and input the data voltage in response to a loaded signal; and a light emitting control circuit, coupled to the driving transistor and the light emitting device, wherein the light emitting control circuit is configured to provide the current produced by the driving transistor to the light emitting device; wherein a frequency of resetting the driving transistor is not less than a frequency of inputting the data voltage.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: The present invention relates to a polyethylene composition comprising a base resin having a density of from 952.0 kg/m3 to 960.0 kg/m3, determined according to ISO 1183, wherein the polyethylene composition has a melt flow rate MFR21 (190° C., 21.16 kg), of from 1.0 to 7.5 g/10 min, determined according to ISO 1133, a complex viscosity at a frequency of 0.05 rad/s eta0.05 of from 750 kPa #s to 1900 kPa #s, determined according to ISO 6721-1 and ISO 6721-10, and a white spot rating of not more than 12.0, determined according to ISO 18553, a polyethylene composition obtainable by a multi-stage process, a process for producing said polyethylene composition, an article, such as a pipe or pipe fitting, comprising said polyethylene composition and the use of said polyethylene composition for the production of an article.

Abstract: An array substrate is provided. The array substrate includes K number of reset signal lines respectively configured to provide reset signals to reset transistors in K columns pixel driving circuits of the array substrate. The K number of reset signal lines includes a plurality of third reset signal lines in (2k?1)-th columns of K columns, K and k being positive integers, 1?k?(K/2); and a plurality of fourth reset signal lines in (2k)-th columns of the K columns.

Abstract: A semiconductor device, a circuit board structure and a manufacturing forming thereof are provided. A circuit board structure includes a core layer, a first build-up layer and a second build-up layer. The first build-up layer and the second build-up layer are disposed on opposite sides of the core layer. The circuit board structure has a plurality of stress releasing trenches extending into the first build-up layer and the second build-up layer.

Abstract: A touch control structure, a touch display panel and an electronic device are provided. The touch control structure includes: a first metal layer and a second metal layer stacked on the base substrate, an insulating layer between the first metal layer and the second metal layer, the first metal layer includes a plurality of first touch sub-electrodes arranged along a first direction and spaced apart from each other, a plurality of second touch sub-electrodes and a plurality of connection electrodes which are arranged along a second direction, the plurality of first touch sub-electrodes and the plurality of second touch sub-electrodes are spaced apart from each other; the second metal layer includes a plurality of bridge electrodes spaced apart from each other, each of the plurality of bridge electrodes is electrically connected with two adjacent first touch sub-electrodes through a plurality of via structures in the insulating layer.

Abstract: A method for identifying transformation products of antibiotics from known and potential unknown transformation pathways includes: step 1: collecting samples, extracting antibiotics and transformation products thereof, and obtaining non-target data by ultra-high performance liquid chromatography-high resolution mass spectrometry; step 2: identifying transformation products of antibiotics from known and unknown transformation pathways; step 3: generating a list of candidate transformation products and annotating their structures; step 4: extracting feature fragments based on structure annotations of the transformation products obtained in step 3, and searching for spectra with the feature fragment, and supplementing the transformation products from unknown transformation pathway; and step 5: obtaining a final list of identified products based on annotated structures.

Abstract: The invention pertains to a composition for use in increasing the relative abundance of Bacteroides and Parabacteroides in the intestinal microbiota of an infant that was delivered by Caesarean section or of an infant that was exposed to antibiotics early in life (e.g. intrapartum antibiotic prophylaxis (IAP)), preferably an infant that was delivered by Caesarean section, wherein the composition comprises Bifidobacterium breve and non-digestible oligosaccharide(s).

Abstract: Compositions and methods for treating Duchenne Muscular Dystrophy (DMD) and excising small portions of exons 44, 50, and 53 of the DMD gene are encompassed.

Abstract: Provided is a recombinant yeast expressing germacrene A synthetase or a fusion protein thereof, wherein the fusion protein is germacrene A synthetase and farnesyl pyrophosphate synthase. The recombinant yeast improves the yield of germacrene A, and is suitable for the industrialized production of ?-elemene and/or germacrene A.

Abstract: A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.

Abstract: Systems and methods are provided for multi-modal test-time adaptation. The method includes inputting a digital image into a pre-trained Camera Intra-modal Pseudo-label Generator, and inputting a point cloud set into a pre-trained Lidar Intra-modal Pseudo-label Generator. The method further includes applying a fast 2-dimension (2D) model, and a slow 2D model, to the inputted digital image to apply pseudo-labels, and applying a fast 3-dimension (3D) model, and a slow 3D model, to the inputted point cloud set to apply pseudo-labels. The method further includes fusing pseudo-label predictions from the fast models and the slow models through an Inter-modal Pseudo-label Refinement module to obtain robust pseudo labels, and measuring a prediction consistency for the pseudo-labels.

Abstract: The present application discloses a batch-type image distribution method based on an IPFS, which includes: obtaining a list of cluster nodes needed to download images; calculating a caching ratio of an image layer of images to be distributed of each node, comparing the caching ratio of each node with a threshold of a preset node, and obtaining a complete image from an image repository; adding the node with the complete image to a list of source nodes, and adding remaining nodes needed to download images to a list of demand nodes, and constructing an IPFS network, and exporting and sharing the image; calculating target demand nodes using an optimization algorithm, and inputting the target demand nodes into the IPFS network for image download, and importing the downloaded image into a container and starting the container.

Abstract: A package structure includes at least one semiconductor die, a plurality of hollow cylinders, an insulating encapsulant, a redistribution layer and through holes. The plurality of hollow cylinders is surrounding the at least one semiconductor die. The insulating encapsulant has a top surface and a bottom surface opposite to the top surface, wherein the insulating encapsulant encapsulates the at least one semiconductor die and the plurality of hollow cylinders. The redistribution layer is disposed on the top surface of the insulant encapsulant and over the at least one semiconductor die. The through holes are penetrating through the plurality of hollow cylinders.