Patents by Inventor Yi Liu

Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10903024
    Abstract: A keyboard device includes a membrane circuit board, a base plate, a coupling structure and a key structure. The base plate includes a substrate and a protrusion structure. The protrusion structure is bent and protruded upwardly from the substrate. A bent region is formed between the protrusion structure and the substrate. A coupling opening is formed in the bent region. The coupling structure filled in the coupling opening to cover the protrusion structure. The key structure includes a keycap and a connecting element. The connecting element is connected between the keycap and the coupling structure.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: January 26, 2021
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Chun-Yuan Liu, Tsu-Yi Chen, Lei-Lung Tsai
  • Patent number: 10900904
    Abstract: The present invention relates to a method for detecting moisture and volatile matter content in raw coal using the value of baseline drift, comprising the following steps: selecting a plurality of types of standard coal having different coal ranks and different ash contents, performing a Raman spectroscopy test and a proximate analysis on each type of standard coal, calculating the value of baseline drift in the Raman spectrum, and setting up the mapping relationship between the value of baseline drift in the Raman spectrum and the characteristic parameters of the moisture and the volatile matter content. The same method and reference are used to perform a Raman spectroscopy test on raw coal to be tested, so as to calculate the value of baseline drift in a Raman spectrum of the raw coal to be tested, and obtain the moisture and volatile matter content of the raw coal to be tested.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: January 26, 2021
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Jun Xiang, Jun Xu, Sheng Su, Song Hu, Yi Wang, Jiawei Liu, Zhe Xiong, Jing Zhou, Hao Tang, Mengxia Qing, Wei Liu
  • Publication number: 20210020828
    Abstract: A magnetoresistive random access memory (MRAM), including a bottom electrode layer on a substrate, a magnetic tunnel junction stack on the bottom electrode layer, and a top electrode layer on the magnetic tunnel junction stack, wherein the material of top electrode layer is titanium nitride, and the percentage of nitrogen in the titanium nitride gradually decreases from the top surface of top electrode layer to the bottom surface of top electrode layer.
    Type: Application
    Filed: August 5, 2019
    Publication date: January 21, 2021
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, Jing-Yin Jhang, I-Ming Tseng, Yu-Ping Wang, Chien-Ting Lin, Kun-Chen Ho, Yi-Syun Chou, Chang-Min Li, Yi-Wei Tseng, Yu-Tsung Lai, JUN XIE
  • Publication number: 20210015824
    Abstract: Disclosed is use of a thieno[3,2-d]pyrimidin-4-one compound represented by general formula (I). Definition of each substituent is as stated in the description and claims, and the compound is used for preparing medicines for treating and/or preventing liver fibrosis and related diseases or preparing a DPP-4 inhibitor, or is used as a DPP-4 inhibitor.
    Type: Application
    Filed: March 8, 2019
    Publication date: January 21, 2021
    Inventors: Hong LIU, Jia LI, Jiang WANG, Yi ZANG, Jian LI, Jingya LI, Dandan SUN, Hualiang JIANG, Kaixian CHEN
  • Publication number: 20210020691
    Abstract: A magnetoresistive random access memory (MRAM), including multiple cell array regions, multiple MRAM cells disposed in the cell array region, a silicon nitride liner conformally covering on the MRAM cells, an atomic layer deposition dielectric layer covering on the silicon nitride liner in the cell array region, wherein the surface of atomic layer deposition dielectric layer is a curved surface concave downward to the silicon nitride liner at the boundary of MRAM cells, and an ultra low-k dielectric layer covering on the atomic layer deposition dielectric layer.
    Type: Application
    Filed: August 6, 2019
    Publication date: January 21, 2021
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Ying-Cheng Liu, Yi-Hui Lee, Chin-Yang Hsieh, Yi-An Shih, Jing-Yin Jhang, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20210009795
    Abstract: The disclosure relates to a tie resin formulation with excellent adhesion to polyethylene terephthalate (PET). The resin includes (A) an ethylene acrylate copolymer formed from ethylene and alkyl acrylate, where the ethylene acrylate copolymer has an acrylate content of 10 to 30 weight percent and an ethylene content of 90 to 70 weight percent based on the total weight of the ethylene acrylate copolymer and the acrylate content and (B) a transesterification catalyst; where the resin includes: 30 to 99.999 weight percent of the ethylene acrylate copolymer based on the total weight of the resin; 0.001 to 10 weight percent of the transesterification catalyst based on the total weight of the resin; and (C) 0 to 69.999 of a non-polar polyolefin based on the total weight of the resin.
    Type: Application
    Filed: March 29, 2018
    Publication date: January 14, 2021
    Applicant: Dow Global Technologies LLC
    Inventors: Andong Liu, Yunlong Guo, Yong Zheng, Hongyu Chen, Brian Walther, Yi Zhang
  • Publication number: 20210013026
    Abstract: A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.
    Type: Application
    Filed: May 14, 2020
    Publication date: January 14, 2021
    Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE, Dan GONG
  • Publication number: 20210014861
    Abstract: Embodiments of this application disclose a time domain resource allocation method. The method may include: determining N pieces of candidate time domain resource information, where N is greater than or equal to 2; and receiving indication information, where the indication information is to be used to determine, from the N pieces of candidate time domain resource information, a time domain resource allocated to a data channel. For at least one of M frame structure parameters, a time domain resource indicated by at least one of the N pieces of candidate time domain resource information is different from a time domain resource used by at least one of the following signals and/or channels in LTE: a cell-specific reference signal (CRS), a physical downlink control channel (PDCCH), a multimedia broadcast single frequency network (MBSFN), a primary synchronization signal (PSS), a secondary synchronization signal (SSS), and/or a physical broadcast channel (PBCH).
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Inventors: Ting Wang, Zhe Liu, Hao Tang, Yi Wang
  • Patent number: 10890641
    Abstract: Exemplary quantitative susceptibility mapping methods, systems and computer-accessible medium can be provided to generate images of tissue magnetism property from complex magnetic resonance imaging data using the Bayesian inference approach, which minimizes a cost function consisting of a data fidelity term and two regularization terms. The data fidelity term is constructed directly from the complex magnetic resonance imaging data. The first prior is constructed from matching structures or information content in known morphology. The second prior is constructed from a region having an approximately homogenous and known susceptibility value and a characteristic feature on anatomic images. The quantitative susceptibility map can be determined by minimizing the cost function. Thus, according to the exemplary embodiment, system, method and computer-accessible medium can be provided for determining magnetic susceptibility information associated with at least one structure.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: January 12, 2021
    Assignee: Cornell University
    Inventors: Yi Wang, Zhe Liu, Youngwook Kee, Alexey Dimov, Yan Wen, Jingwei Zhang, Pascal Spincemaille
  • Patent number: 10893534
    Abstract: The method for air interface resource allocation, including allocating a first air interface resource to a first service with a first latency sensitivity, allocating, to a second service with a second latency sensitivity that is greater than the first latency sensitivity, a second air interface resource on subcarriers of all frequency bands within a current transmission time interval (TTI); and preempting, for the second service, the first air interface resource allocated to the first service, wherein the second service has a higher priority for obtaining the first air interface resource than the first service.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: January 12, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Qi Liu, Yi Zhang, Wenyuan Yong
  • Publication number: 20210005586
    Abstract: A semiconductor structure includes a semiconductor package and a connector. The semiconductor package includes a die and a redistribution structure. The redistribution structure is disposed over the die, and includes a plurality of conductive patterns stacking on one another and electrically connected to the die. The connector is disposed on the redistribution structure, and includes a connecting element. The connecting element penetrates the conductive patterns and is electrically connected to the die.
    Type: Application
    Filed: September 17, 2020
    Publication date: January 7, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo
  • Publication number: 20210002327
    Abstract: A method for removing precursors in recombinant human nerve growth factor (rhNGF) by hydrophobic interaction chromatography (HIC) is provided, where a Chinese hamster ovary (CHO) cell culture is processed by column chromatography for preliminary purification, and the pretreated sample obtained therefrom is further processed in a HIC column by washing the sample and then eluting the HIC column.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 7, 2021
    Inventors: Wenchao Liu, Hongliang Sun, Yi Zhang, Yuesheng Wang
  • Publication number: 20210002341
    Abstract: A method for removing an N-terminal truncated variant and an abnormal variant in recombinant human nerve growth factor (rhNGF) is provided. An rhNGF raw material loaded on a cation-exchange material is washed with a washing liquid to obtain a washed raw material from which an N-terminal truncated variant and an abnormal variant have been removed, where the washing liquid has higher electrical conductivity than the rhNGF raw material. Cation-exchange chromatography (CEC) elution is then performed on the washed raw material with an elution buffer having higher electrical conductivity than the washing liquid. A purified rhNGF product is obtained from the eluate.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 7, 2021
    Inventors: Wenchao Liu, Hongliang Sun, Yi Zhang, Yuesheng Wang
  • Patent number: 10888000
    Abstract: A manufacturing method of a circuit board includes the following steps. A conductive plate is provided. The conductive plate is patterned to form ducts. The patterned conductive plate is laminated with a core dielectric layer. The lamination leaves exposed a bottom surface of the patterned conductive plate. Through holes are opened in portions of the core dielectric layer within the ducts. A conductive material is formed in the through holes and over the core dielectric layer to produce a metallization layer electrically insulated from the patterned conductive plate. Dielectric layers and conductive layers are alternately stacked on an upper surface of the core dielectric layer. The conductive layers are electrically connected to the metallization layer.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: January 5, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Yi Wu, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu
  • Patent number: 10882847
    Abstract: Compounds having activity as inhibitors of G12C mutant KRAS protein are provided. The compounds have the following structure (I): or a pharmaceutically acceptable salt, tautomer, stereoisomer or prodrug thereof, wherein R1, R3a, R3b, R4a, R4b, G1, G2, G2, G3, G4, m1, m2, m3, m4, L1, L2 and E are as defined herein. Methods associated with preparation and use of such compounds, pharmaceutical compositions comprising such compounds and methods to modulate the activity of G12C mutant KRAS protein for treatment of disorders, such as cancer, are also provided.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: January 5, 2021
    Assignee: ARAXES PHARMA LLC
    Inventors: Liansheng Li, Jun Feng, Yun Oliver Long, Pingda Ren, Yi Liu
  • Patent number: 10884042
    Abstract: A method includes performing by a processor: receiving a first plurality of power system frequency measurements from a plurality of phasor measurement units (PMUs) in the power system over a first time interval, generating a first plurality of multi-dimensional ellipsoids based on the first plurality of power system frequency measurements, extracting a plurality of first graphic parameter values from the first plurality of multi-dimensional ellipsoids, respectively, performing a regression analysis on the plurality of first graphic parameter values to generate a predictive relationship between the plurality of first graphic parameter values and inertia values of the power system, receiving a second plurality of power system frequency measurements from the plurality of PMUs over a second time interval, generating a second plurality of multi-dimensional ellipsoids based on the second plurality of power system frequency measurements, extracting a plurality of second graphic parameter values from the second plura
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: January 5, 2021
    Assignee: UNIVERSITY OF TENNESSEE RESEARCH FOUNDATION
    Inventors: Yong Liu, Yi Cui, Yilu Liu
  • Patent number: 10882446
    Abstract: Disclosed is a graded early warning system for rollover of heavy-duty truck based on time-varying interactive Kalman filtering and early warning method thereof. The system includes an infrared speed measuring module, a gyroscope, a humidity signal acquisition sensor, a bluetooth data transmission module and a main control chip. The infrared speed measuring module, the gyroscope, the humidity signal acquisition sensor are respectively connected with input ends of the main control chip through control lines. A video output end of the main control chip is connected with a liquid crystal display through video signal line. The main control chip is wirelessly connected with a mobile phone through the bluetooth data transmission module.
    Type: Grant
    Filed: January 13, 2019
    Date of Patent: January 5, 2021
    Assignee: Henan Polytechnic University
    Inventors: Jingwei Guo, Lutian Li, Jiajun Zhan, Xin Qin, Zhongqi Xie, Haofei Guo, Fugen Lin, Chen Wang, Yi Cai, Yinan Chen, Shuang Ma, Yating Hu, Yanran Liu, Yaxing Zhai, Donghui Xie
  • Patent number: D907046
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: January 5, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsing-Yi Kao, Ming-Chung Liu, Yu-Hsin Chen
  • Patent number: D907047
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: January 5, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsing-Yi Kao, Ming-Chung Liu, Chia-Wei Huang, Yu-Hsin Chen, Hong-Tien Wang
  • Patent number: D908851
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: January 26, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Pin-Hsing Lee, Po-Chun Liu, Wen-Yi Chiu