Patents by Inventor Yi Liu

Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260266131
    Abstract: A snap on window covering is described. The window covering includes a first rail, a second rail, and a fabric that couples the first and second rails. The first rail includes a clip interface configured to enable attachment to a tension rod configured to be mounted between opposing first and second side jambs of an interior window frame. In another aspect, a window shade system includes the window covering. A motorized window covering that uses a headrail is also described. In an aspect, the motorized window covering comprises a headrail type motorized window covering with a battery unit. The battery unit includes a housing, a battery pack, an input coupling for a central drive shaft of the headrail, and an output coupling for the central drive shaft of the headrail. In another aspect, the motorized window covering comprises a microcontroller configured to perform various operations of the motorized window covering.
    Type: Application
    Filed: March 10, 2026
    Publication date: September 10, 2026
    Inventors: Andrew E. EINAUDI, Alex LIU, Yi LIU
  • Publication number: 20260268443
    Abstract: A video super-resolution method, an electronic device a computer-readable storage medium are provided. The method includes obtaining an original video frame of a video to be subjected to super-resolution; obtaining pixel values of pixels in a super-resolution frame corresponding to the original video frame according to pixel values of pixels in the original video frame and a preset mapping relationship; wherein the preset mapping relationship is a mapping relationship generated according to pixel values of pixels in an input video frame of a video super-resolution network model and pixel values of pixels in an output video frame of the video super-resolution network model, and the video super-resolution network model is a model obtained by training a preset machine learning model based on a model training sample; and generating the super-resolution video frame according to the pixel values of the pixels in the super-resolution video frame.
    Type: Application
    Filed: September 8, 2023
    Publication date: September 10, 2026
    Inventors: Yingjie ZHANG, Tianchun XU, Jian YU, Yi LIU, Yifan ZHU, Shijie ZHAO
  • Publication number: 20260271579
    Abstract: A display panel and a display device are provided. A first optical component area has a first width along a first direction greater than a second width along a second direction, and a display area includes a first display area and a second display area located at two sides of the first optical component area along the second direction. The display panel includes first signal lines, which include first-type signal lines and second-type signal lines and each include a first portion arranged in the first display area and a second portion arranged in the second display area. A first bypass portion connecting the first portion and the second portion of the first-type signal line is arranged in the display area. A second bypass portion connecting the first portion and the second portion of the second-type signal line is arranged in the first frame area.
    Type: Application
    Filed: April 29, 2026
    Publication date: September 10, 2026
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Gaojun HUANG, Zhongjie ZHANG, Yi LIU, Chunmei GAO, Qibing WEI
  • Publication number: 20260265851
    Abstract: A method for forming a component for a steel bearing. The method includes forming a steel-bearing component comprising a bainite-dominant material and forming in the steel-bearing component a nitrogen-strengthened surface layer, wherein the nitrogen-strengthened surface layer is formed by diffusing nitrogen with or without carbon into a surface layer of the component using a one-step carbo-nitro-austempering heat treatment cycle.
    Type: Application
    Filed: March 4, 2025
    Publication date: September 10, 2026
    Applicant: GM Global Technology Operations LLC
    Inventors: Peng Shen, Wenying Yang, Jack M. Gayney, Yi Liu, Zhe Li, Gregory Melekian
  • Patent number: 12729293
    Abstract: Disclosed is a polymer composition comprising at least the following components A) 20 to 75 wt.-% based on the overall weight of the polymer composition of a polymer blend, comprising a1) polypropylene; a2) polyethylene; wherein the weight ratio of a1) to a2) is from 3:7 to 12:1; and wherein the polymer blend A) is a recycled material; B) 25 to 80 wt.-% based on the overall weight of the polymer composition of a virgin polypropylene homopolymer. Also disclosed are a process for manufacturing the polymer composition, a process for improving mechanical properties of a polymer blend A) by incorporating B) into A) and articles made from the resulting polymer composition.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: September 8, 2026
    Assignee: Borealis AG
    Inventors: Susanne Margarete Kahlen, Hermann Braun, Yi Liu, Meta Cigon, Philip Knapen
  • Publication number: 20260262328
    Abstract: Provided are a surface passivation structure for a cut solar cell, a preparation method thereof, a cut solar cell, and a photovoltaic module. The surface passivation structure includes a silicon substrate, where one side or two opposite sides of the silicon substrate are laser-cut surfaces; a front/back surface of the silicon substrate includes a base region located in a central portion and small textured regions located on four side edges; the base region is provided with a boron emitter; a front passivation and anti-reflection layer covers the boron emitter and the small textured regions; surfaces of the boron emitter and the small textured regions are provided with pyramidal textured structures; and a pyramid in the base region has a larger dimension than pyramids in the small textured regions. The provided removes pn junctions on a laser-cut edge and a non-laser-cut edge and forms small pyramidal textured structures.
    Type: Application
    Filed: April 28, 2026
    Publication date: September 3, 2026
    Applicant: Teranergy Technology Co., Ltd.
    Inventors: Yuheng ZENG, Biao WU, Xiaowei LIU, Yi LIU, Xukai ZHAO, Mingdun LIAO, Shihua CHEN, Yikun LIU, Haoxiang DONG, Jichun YE
  • Patent number: 12725236
    Abstract: The present application discloses a low-light image enhancement method based on wavelet transform and Retinex-Net, and belongs to the field of image enhancement technology. In order to solve the problems of colour distortion and lack of details such as edges and textures when Retinex-Net processes some images, the present application adds the wavelet transform, fuses the high-frequency components with regional characteristics, and processes only the low-frequency component with Retinex-Net, to retain more details of edges and textures in the image, and transfers the low-frequency and high-frequency components from the HSV space to the value space for value fusion and stretching, to effectively improve the colour distortion of the image, and also improve the expression of details of the image. The present application retains more detail information while avoiding colour distortion, and the enhancement effect is satisfactory.
    Type: Grant
    Filed: May 20, 2024
    Date of Patent: September 1, 2026
    Inventors: Dengyin Zhang, Yi Liu
  • Patent number: 12727447
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a wafer structure. The wafer structure has a normal region and a trimmed region adjacent to the normal region. A top surface of the trimmed region is lower than a top surface of the normal region. The semiconductor structure includes a dielectric layer and a conductive layer disposed on the wafer structure in the normal region and the trimmed region. The semiconductor structure includes a protective layer disposed on a portion of the dielectric layer in the trimmed region and a portion of the conductive layer in the trimmed region. The semiconductor structure includes another dielectric layer disposed on a portion of the dielectric layer in the normal region and a portion of the conductive layer in the normal region and on the protective layer.
    Type: Grant
    Filed: December 13, 2023
    Date of Patent: September 1, 2026
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Tien-Tsai Hung, Yi Liu, Guo-Hai Zhang, Ching-Hwa Tey
  • Patent number: 12727495
    Abstract: An electrical package can include a substrate having a first side and a second side opposite the first side. One or more electrical components mounted to the substrate, and a plurality of electrically conductive interconnect members can be coupled to the second side of the substrate. At least one of the interconnect members can have an elongated shape with a length that is longer than a width. The interconnect member with the elongated shape positioned can be at or proximate one of the corners. The interconnect members can be arranged as a grid, with first interconnect members each occupying a single grid cell, and second interconnect members each occupying at least two grid cells. The second interconnect members can have a shape of two of the first interconnect members coupled by a bridge portion.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: September 1, 2026
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jeffrey Sailer, Howard E. Chen, Yi Liu
  • Publication number: 20260250480
    Abstract: The present disclosure provides a process of preparing a polymer composition comprising a post-consumer recycled polypropylene resin comprising the steps of M) pre-treating a plastic feedstock by subjecting the plastic feedstock to mechanical recycling process; S) subjecting the plastic feedstock to solvent-based recycling process to obtain the post-consumer recycled polypropylene resin; and C) melt-processing the post-consumer recycled polypropylene resin obtained from step S) to obtain said polymer composition, wherein the conditions of the steps M), S) and C) are particularly selected and combined for the preparation of high-purity polypropylene recyclates.
    Type: Application
    Filed: March 8, 2024
    Publication date: August 27, 2026
    Applicants: BOREALIS GMBH, IFP ENERGIES NOUVELLES
    Inventors: Andreas ALBRECHT, Joel FAWAZ, Alexandra Romina ALBUNIA, Yi LIU, Noureddine AJELLAL, Mohammad AL-HAJ ALI, Lukas SOBCZAK, Henry SLEIJSTER, Pablo Ivan AGUAYO ARELLANO, Mubashar SATTAR, Wilfried WEISS, Damien LEINEKUGEL LE COCQ, Mathilde SIBEAUD
  • Publication number: 20260254075
    Abstract: A battery housing, a battery cell, a large-capacity battery, and a manufacturing method for the large-capacity battery are provided. The battery housing is provided with a sealing mechanism and an opening communicating with an inner cavity of the battery housing. The sealing mechanism seals the opening, and the sealing mechanism is openable by an external force. An electrolyte between the battery cells can be shared in a convenient operation mode. A plurality of battery cells are located in a uniform electrolyte system.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 27, 2026
    Applicant: D-AUS ENERGY STORAGE TECHNOLOGY (XI'AN) CO., LTD.
    Inventors: Zhengjun LEI, Sanxue ZHANG, Xiaoyu HAN, Jian QIANG, Mengqi CHEN, Yi LIU
  • Publication number: 20260240864
    Abstract: The invention concerns the use of the compound of formula III for the manufacture of a pharmaceutical composition comprising 9 mg of the compound of formula III for the treatment of a disease selected from the group consisting of idiopathic pulmonary fibrosis (IPF), progressive pulmonary fibrosis (PPF) and systemic sclerosis (SSc) in a patient suffering from said disease, characterized therein that this pharmaceutical composition comprising 9 mg of the compound of formula III is administered twice daily in combination with or concomitantly to a strong CYP3A-inhibitor (strong P450 3A (CYP3A) inhibitor) to said patient.
    Type: Application
    Filed: February 13, 2026
    Publication date: August 20, 2026
    Inventors: Christian Benedikt Otto HESSLINGER, Dilara JAPPAR, Yi LIU, Peter NICKOLAUS, Susanne STOWASSER, Florian VOSS, Yichao YU, Donald ZOZ
  • Publication number: 20260242560
    Abstract: The present disclosure relates to a polymer composition, preferably a melt-processed polymer composition, comprising at least 95 wt %, based on the total weight of the polymer composition, of a post-consumer recycled polypropylene resin, the polymer composition having an ethylene content (C2(CF)) of the crystalline fraction (CF), in the range of from [C2?3.4] to [C2?0.2] wt %, preferably from [C2?3.0] to [C2?0.6] wt %, more preferably from [C2?2.4] to [C2?1.2] wt % of the total weight of the crystalline fraction of the polymer composition, as determined by Crystex analysis as described in the specification; and a heat deflection resistance of at least 97° C., preferably in the range of 97° C. to 110° C., more preferably in the range of 98° C. to 105° C., determined with DMTA as described herein and expressed by the temperature at which the storage modulus E? of 400 MPa is reached (T(E?=400 MPa)).
    Type: Application
    Filed: March 8, 2024
    Publication date: August 20, 2026
    Applicant: BOREALIS GMBH
    Inventors: Andreas ALBRECHT, Joel FAWAZ, Alexandra Romina ALBUNIA, Yi LIU, Noureddine AJELLAL, Mohammad AL-HAJ ALI, Lukas SOBCZAK, Henry SLEIJSTER, Pablo Ivan AGUAYO ARELLANO, Mubashar SATTAR
  • Publication number: 20260247895
    Abstract: A method for packaging radio frequency identification (RFID) chips is provided. The method includes: coating a conductive medium onto surfaces of the RFID chips of a whole wafer; and then performing film expansion to create gaps between adjacent RFID chips, to obtain an assembly of spaced-apart chips; attaching a conductor layer to a surface of the conductive medium of the assembly of the spaced-apart chips, and performing hot pressing to cure the conductive medium, to bond the RFID chips to the conductor layer; severing the conductor layer between two pads of each of the RFID chips, and then dicing the conductor layer along the gaps between the adjacent RFID chips to form independent modified RFID chips; and performing the packaging by using two portions of the conductor layer in each of the modified RFID chips as bonding points.
    Type: Application
    Filed: February 18, 2026
    Publication date: August 20, 2026
    Inventors: Junhua Mao, Yi Liu
  • Patent number: 12711571
    Abstract: An image processing method, an electronic device and a storage medium are provided. The method includes acquiring a first image; performing down-sampling processing on the first image to obtain a first down-sampled image; performing average pooling processing on pixels in the first down-sampled image to obtain a first pooled image; determining a plurality of pixel merging weights corresponding to pixels in the first down-sampled image; and performing pixel merging processing on the first down-sampled image and the first pooled image based on the plurality of pixel merging weights to obtain a second image.
    Type: Grant
    Filed: August 23, 2024
    Date of Patent: August 18, 2026
    Assignees: Douyin Vision Co., Ltd., Lemon Inc.
    Inventors: Ziyao Xu, Yi Liu, Shijie Zhao, Junlin Li, Li Zhang
  • Patent number: 12712407
    Abstract: A composite conductor for a vehicle, a propulsion system for a vehicle, and a method of forming a composite busbar for a vehicle. The composite conductor includes a surface, and a first copper tape laminated to the surface. The composite conductor is electrically conductive exhibiting an electrical conductivity of 1.0×10{circumflex over (7)} Siemens per meter (S/m) or greater. The first copper tape includes a layer of carbon nanotubes sandwiched between a first copper layer and a second copper layer. The composite busbar may be connected to a plurality of windings in the stator of an electric motor.
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: August 18, 2026
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Qigui Wang, Yi Liu, Kestutis A. Sonta, Vang N. Kue, Akshay Trivedi
  • Patent number: D1145988
    Type: Grant
    Filed: July 9, 2025
    Date of Patent: September 1, 2026
    Inventors: Yi Liu, Huanlong Wu, Linjun Yu, Weirui Liu, Luyao Han, Jie Luo
  • Patent number: D1146856
    Type: Grant
    Filed: January 17, 2025
    Date of Patent: September 8, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haojing Yang, Xin Li, Chuhan Chen, Yi Liu, Menglin Xiao
  • Patent number: D1146857
    Type: Grant
    Filed: January 17, 2025
    Date of Patent: September 8, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haojing Yang, Xin Li, Yi Liu, Menglin Xiao, Chuhan Chen
  • Patent number: D1146858
    Type: Grant
    Filed: January 17, 2025
    Date of Patent: September 8, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haojing Yang, Xin Li, Yi Liu, Menglin Xiao, Chuhan Chen