Patents by Inventor Yi Liu
Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240121306Abstract: This application provides a feedback indication method and apparatus, to more comprehensively indicate a feedback, so as to improve applicability of a sensing technology in a scenario of a plurality of devices and a plurality of interactions. The method and the apparatus may be applied to a communication system. The method includes: A first device generates a first frame, and sends the first frame. The first frame includes first information, and the first information indicates a feedback type of a first feedback and/or a feedback type of a second feedback. The first feedback and the second feedback are feedbacks at different levels.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Inventors: Mengshi HU, Xiao HAN, Rui DU, Jian YU, Chenchen LIU, Yi LV, Xun YANG
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Publication number: 20240120295Abstract: A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.Type: ApplicationFiled: January 30, 2023Publication date: April 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Szu-Hsien Lee, Yun-Chung Wu, Pei-Wei Lee, Fu Wei Liu, Jhao-Yi Wang
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Patent number: 11952307Abstract: A method for preparing a microstructure on the surface of glass by titanium oxide nanoparticle-assisted infrared nanosecond laser, including the following steps: (1) dropwise applying a titanium oxide nanoparticle hydrogel onto the surface of a glass sample; (2) pressing another piece of glass on the surface of the hydrogel, so the hydrogel is evenly distributed between the two pieces of glass, and allowing the two pieces of glass to stand horizontally for a period of time to air-dry the hydrogel; (3) separating the two pieces of glass to obtain a glass with a uniform titanium oxide nanoparticle coating; (4) forming a microstructure using an infrared nanosecond laser with a wavelength of 1064 nm; and (5) performing after-treatment, including ultrasonically cleaning the sample with acetone, absolute ethanol and deionized water respectively for 10 min to remove titanium oxide nanoparticles attached to the surface, to obtain a glass sample with the microstructure.Type: GrantFiled: December 28, 2019Date of Patent: April 9, 2024Assignee: SHANDONG UNIVERSITYInventors: Yukui Cai, Zhanqiang Liu, Xichun Luo, Yiping Tang, Yi Wan, Qinghua Song, Bing Wang
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Patent number: 11953795Abstract: An embodiment of the present application discloses a pixel unit of a display panel and a display panel, wherein data lines are covered with a light shielding matrix element, two light shielding strips of the light shielding matrix element shield the two data lines respectively. Each light shielding strip comprises a first light shielding section and a second light shielding section in different widths overlap side edges of the main pixel electrode portion and side edges of the sub-pixel electrode portion respectively to effectively shield light leakage regions between the data lines and the pixel electrode, which solves the technical issue of the conventional pixel unit of a display panel forming light leakage regions between data lines and the pixel electrode, causing light leakage in a dark state, and resulting lowered display quality of the display panel and improves display quality.Type: GrantFiled: October 28, 2021Date of Patent: April 9, 2024Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Chengcai Dong, Ding Li, Yi Liu
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Patent number: 11955442Abstract: In an embodiment, a structure includes a core substrate, a redistribution structure coupled, the redistribution structure including a plurality of redistribution layers, the plurality of redistribution layers comprising a dielectric layer and a metallization layer, a first local interconnect component embedded in a first redistribution layer of the plurality of redistribution layers, the first local interconnect component comprising conductive connectors, the conductive connectors being bonded to a metallization pattern of the first redistribution layer, the dielectric layer of the first redistribution layer encapsulating the first local interconnect component, a first integrated circuit die coupled to the redistribution structure, a second integrated circuit die coupled to the redistribution structure, an interconnect structure of the first local interconnect component electrically coupling the first integrated circuit die to the second integrated circuit die, and a set of conductive connectors coupled to aType: GrantFiled: February 27, 2023Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu
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Patent number: 11953740Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.Type: GrantFiled: May 14, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 11953774Abstract: A display substrate includes: a base substrate (100); a plurality of sub-pixels (R, G, B) located on the base substrate (100), every two rows of sub-pixels (R, G, B) constituting a pixel group; a plurality of first gate lines (Gate1) located at first row gaps between the pixel groups, two first gate lines (Gate1) being arranged at each first row gap; and a plurality of photosensors (101), the orthographic projection of each row of photosensors (101) on the base substrate (100) completely covering a second row gap in the pixel group and partially overlapping with the orthographic projections of the sub-pixels (R, G, B), thereby avoiding the bright and dark difference between adjacent rows and ensuring the aperture ratio.Type: GrantFiled: June 8, 2021Date of Patent: April 9, 2024Assignees: Beijing BOE Display Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Xinlan Yang, Wenkai Mu, Yi Liu, Jun Fan, Bo Feng, Yang Wang, Zhan Wei, Tengfei Ding, Shijun Wang, Chengfu Xu
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Patent number: 11957064Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.Type: GrantFiled: October 18, 2022Date of Patent: April 9, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
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Patent number: 11955536Abstract: A semiconductor transistor structure includes a substrate with a first conductivity type, a fin structure grown on the substrate, and a gate on the fin structure. The fin structure includes a first epitaxial layer having a second conductivity type opposite to the first conductivity type, a second epitaxial layer on the first epitaxial layer, and a third epitaxial layer having the second conductivity type on the second epitaxial layer.Type: GrantFiled: July 15, 2021Date of Patent: April 9, 2024Assignee: United Semiconductor (Xiamen) Co., Ltd.Inventors: Sheng-Hsu Liu, Shih-Hsien Huang, Wen Yi Tan
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Patent number: 11954415Abstract: An early warning method for safety production risk of tailings pond based on risk ranking is provided. The early warning method includes: monitoring and collecting internal basic data of a tailings pond in real-time, and performing a basic monitoring and a basic early warning; collecting geographical location data, meteorological data, and historical geological disaster data of an area where the tailings pond is located; performing risk ranking on a safety production risk of the tailings pond, thereby obtaining a risk level of the tailings pond; and collecting case data of global tailings pond accidents and hazard degree data thereof, acquiring accident solution strategies for the global tailings pond accidents, performing management and monitoring on the tailings pond, setting parameters in a process of the basic monitoring, and performing a ranked early warning on the safety production risk of the tailings pond based on the risk level.Type: GrantFiled: November 9, 2023Date of Patent: April 9, 2024Assignees: China Academy of Safety Science and Technology, Jiangxi Emergency Management Science Research InstituteInventors: Youliang Chen, Haigang Li, Shigen Fu, Yanyu Chu, Qing Wang, Shouyin Wang, Zhentao Li, Yi Liu, Xiangliang Tian, Tao Chen, Jia Li, Xiaolong Zheng, Pangfeng Guo, Shuang Chen
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Patent number: 11957033Abstract: Provided are a display panel, a manufacturing method thereof, and a display device. The display panel includes an alignment mark region arranged within a flat region of a peripheral region of the display panel. The peripheral region is a region of the display panel other than an active area of the display panel. An alignment mark pattern is arranged within the alignment mark region, and/or at least one film layer within the alignment mark region is hollowed out.Type: GrantFiled: May 9, 2020Date of Patent: April 9, 2024Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Huijuan Yang, Tingliang Liu, Tinghua Shang, Yang Zhou, Pengfei Yu, Yi Zhang, Junxi Wang
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Patent number: 11953119Abstract: A micro-metering device with a constant flow rate, including a rotary shear valve, a mounting seat, a rotation drive assembly, an injection drive assembly and a controller. The rotary shear valve includes a valve main body and a valve spool. The valve main body is provided with a main flow channel and a plurality of branch flow channels. The valve spool is rotatably arranged inside the valve main body, and is configured to communicate the main flow channel with different branch flow channels. A pressure sensor is provided inside the valve main body, and is communicated with the main flow channel. The pressure sensor is configured for detecting a pressure inside the main flow channel. Whether the switching of the liquid path is correct is determined according to the pressure in the main flow channel.Type: GrantFiled: September 26, 2023Date of Patent: April 9, 2024Assignee: SHENZHEN KEYTO FLUID TECHNOLOGY CO., LTDInventors: Cheng Zhang, Xiyuan Xiao, Jin Liu, Yi Wu
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Publication number: 20240114736Abstract: A display substrate and a display device are provided. The display substrate includes a base substrate, a pixel circuit layer and an anode layer; the pixel circuit layer includes a plurality of pixel driving circuits, the anode layer includes a plurality of anode groups, each of the plurality of anode groups includes a first anode and a second anode which are oppositely arranged, the first anode includes a first main body portion and a first connection portion, the first anode further includes an extension portion and an anode compensation portion, an orthographic projection of the anode compensation portion on the base substrate covers one thin film transistor in the pixel driving circuit connected to the first connection portion.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Lulu YANG, Tinghua SHANG, Guomeng ZHANG, Yu WANG, Xiaofeng JIANG, Xin ZHANG, Yupeng HE, Yi QU, Biao LIU, Mengmeng DU, Xiangdan DONG, Hongwei MA
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Publication number: 20240113032Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.Type: ApplicationFiled: April 25, 2023Publication date: April 4, 2024Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
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Publication number: 20240113135Abstract: Disclosed are a light-emitting module and a display device. The light-emitting module includes a substrate, a first driving circuit layer and at least one first light-emitting unit group. At least one first groove is provided on a surface of the substrate. The first driving circuit layer is located on the substrate and includes at least one first signal line located in the first groove. The first light-emitting unit group is located on a side, where the first driving circuit layer is provided, of the substrate, and includes at least one first lamp bead, and the first lamp bead is connected in series on the first signal line. In the light-emitting module, the first signal line is arranged in the first groove of the substrate, which is equivalent to being embedded in the substrate.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Applicant: SHINE OPTOELECTRONICS (KUNSHAN) CO., LTD.Inventors: Sheng ZHANG, Lixiang LIU, Shicheng ZHANG, Yi HUANG, Xiujun WANG
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Publication number: 20240113071Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
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Publication number: 20240113758Abstract: The present disclosure relates to feedback methods and apparatuses. In one example method, a first communication apparatus may receive first information. The first information includes at least one of channel state information (CSI) measurement quantity indication information for channel variation calculation, a CSI type and a rule that are for the channel variation calculation, or a feedback suggestion parameter. The feedback suggestion parameter indicates a suggested feedback form. The first information is used to select a second communication apparatus. The first communication apparatus may determine, based on the first information, whether to trigger the second communication apparatus/apparatuses to send a feedback result. Correspondingly, the first communication apparatus receives the feedback result.Type: ApplicationFiled: December 8, 2023Publication date: April 4, 2024Inventors: Mengshi HU, Xiao HAN, Chenchen LIU, Rui DU, Yunbo LI, Yi LV, Xun YANG
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Patent number: 11944814Abstract: A wireless implant and associated system for motor function recovery after spinal cord injury, and more particularly a multi-channel wireless implant with small package size. The wireless implant can further be used in various medical applications, such as retinal prostheses, gastrointestinal implant, vagus nerve stimulation, and cortical neuromodulation. The system also includes a method and its implementation to acquire the impedance model of the electrode-tissue interface of the implant.Type: GrantFiled: August 27, 2021Date of Patent: April 2, 2024Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Yi-Kai Lo, Wentai Liu, Victor R. Edgerton, Chih-Wei Chang
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Patent number: 11946759Abstract: The present disclosure relates to an electronic device, a wireless communication method and a computer-readable storage medium. The electronic device for a vehicle according to the present disclosure comprises a processing circuit configured to: determine load information of the vehicle; generate vehicle information, with the vehicle information comprising the load information of the vehicle; and send the vehicle information to a server for the server to determine, according to the vehicle information, road planning information for the vehicle. By using the electronic device, the wireless communication method and the computer-readable storage medium according to the present disclosure, the load information of the vehicle can be taken into consideration during road planning and decision planning, thereby better managing the load of the vehicle and more rationally planning a road.Type: GrantFiled: October 26, 2020Date of Patent: April 2, 2024Assignee: SONY GROUP CORPORATIONInventors: Tao Cui, Chen Sun, Rui Lu, Yi Liu
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Patent number: 11945271Abstract: A rigid-flexible coupling multi-degree-of-freedom walking position-adjusting leg unit and a hybrid robot platform thereof is provided and includes a vertical rigid-flexible coupling multi-degree-of-freedom walking position-adjusting leg unit and a horizontal rigid-flexible coupling multi-degree-of-freedom walking position-adjusting leg unit, which both include a moving device, a moving drive, a steering frame, a lifting frame, a spring device and a driving differential wheel set, in combination with a frame, a driver set, a battery pack and a control box, forming a multi-degree-of-freedom parallel mechanism platform. The hybrid robot platform including the rigid-flexible coupling multi-degree-of-freedom walking position-adjusting leg unit as provided by the present disclosure has functions of a rigid position adjustment, an elastic suspension and a rigid-flexible coupling position adjustment, and can automatically adapt to a working condition of the uneven ground.Type: GrantFiled: August 24, 2021Date of Patent: April 2, 2024Assignee: YANSHAN UNIVERSITYInventors: Yulin Zhou, Shuyang Shi, Lihui Zhao, Xuesong Qiu, Zongqiang Feng, Yi Liu