Patents by Inventor Yi Liu

Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190256695
    Abstract: A polymer composition comprising a base resin is disclosed herein. The base resin includes a first high molecular weight component, a low molecular weight component and a second high molecular weight component. The weight average molecular weight of the second high molecular weight component differs from the first high molecular weight component. The ratio of the weight and number average molecular weight of the first high molecular weight component is greater than 5. The first high molecular weight component has a density of equal or less than 930 kg/m3, and an intrinsic viscosity of equal or less than 15 dl/g, The base resin has a melt flow rate MFR5 of equal or less than 0.40 g/10 min and the composition has a viscosity at a shear stress of 747 Pa (eta747) of more than 700 kPas. Also a process for the production of a polymer composition is disclosed herein.
    Type: Application
    Filed: June 20, 2017
    Publication date: August 22, 2019
    Inventors: Yi Liu, Qizheng Dou, Victor Sumerin, Jani Aho, Jarmo Kela, Thomas Hjertberg, Anna HjÀrtfors
  • Patent number: 10390260
    Abstract: Embodiments of the present invention disclose a frame transmission method for a wireless local area network and a wireless local area network apparatus, and relate to the field of communications technologies. According to the present invention, in a frame transmission process in a WLAN, a frame sent by a wireless local area network WLAN apparatus is received, and the frame of a particular standard is recognized by detecting a user common signal field included in the frame, so that backward compatibility of a WLAN apparatus is implemented, and hybrid networking of WLAN apparatuses of different standards can be supported, thereby improving flexibility of network deployment, and reducing complexity of networking.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 20, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Le Liu, Yi Luo, Guido Montorsi, Sergio Benedetto
  • Publication number: 20190252283
    Abstract: A system and method for providing a conductive line is provided. In an embodiment the conductive line is formed by forming two passivation layers, wherein each passivation layer is independently patterned. Once formed, a seed layer is deposited into the two passivation layers, and a conductive material is deposited to fill and overfill the patterns within the two passivation layers. A planarization process such as a chemical mechanical polish may then be utilized in order to remove excess conductive material and form the conductive lines within the two passivation layers.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Yu Yi Huang, Hung-Jui Kuo, Chung-Shi Liu
  • Publication number: 20190248185
    Abstract: A method of using a corrugated zero-degree belt to manufacture a tire. A belt ply structure includes a No. 1 belt ply, No. 2 belt ply, No. 3 belt ply, corrugated zero-degree belt, and shoulder wedge. In a belt ply structure of an all-steel radial tire, a zero-degree belt has a halved density and is wound in two turns, thus a strength problem of a joint portion is solved. The upper and lower ply are arranged in a staggered manner, thereby forming a single belt. The belt ply structure realizes restraining and fastening functions of a zero-degree belt ply while reducing costs and weight of a tire. The entire belt ply is flat and smooth and has consistent thickness. The belt ply structure can improve high-speed performance and abrasion resistance of a tire. Circumferential distribution of framework material is more uniform, thereby enhancing uniformity of the tire and driving comfort.
    Type: Application
    Filed: April 17, 2017
    Publication date: August 15, 2019
    Applicant: SHANDONG LINGLONG TYRE CO., LTD.
    Inventors: Feng WANG, Lianbo LIU, Yi JIANG, Guixia LIU, Xiaowei WEN, Shaojing WANG
  • Publication number: 20190252209
    Abstract: A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai, Hao-Yi Tsai
  • Publication number: 20190251321
    Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 10377679
    Abstract: A kitchen waste treatment device in environment-protection-device field comprises a main fermentation barrel comprising a barrel body mounted on supporting brackets and including a feed inlet, a discharge outlet and a material chamber, push plates located within the material chamber to push materials therein to move along barrel body axial direction and further a gas inlet system having gas inlets located at same barrel body end as the discharge outlet and a gas-exhaust system having gas-exhaust ports located at same barrel body end as the feed inlet; a feeding apparatus whose feed end communicates with the feed inlet; and a power apparatus driving the barrel body to rotate around its axis. The gas inlets/gas-exhaust ports communicate with the material chamber. The treatment device has simple compact structure and small occupied area and realizes material horizontal propulsion and repeated rotational-stirring in the barrel body by barrel body rotation, achieving material-degrading-and-fermenting object.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: August 13, 2019
    Assignee: ENVIRONMENTAL PROTECTION SCIENCE AND TECHNOLOGY CO. LTD., XIFU, GUANGDONG
    Inventors: Zongcai Huang, Taiping Zhang, Huageng Hu, Nengwu Zhu, Xinghong Jin, Jian Wang, Tingting Yang, Yi Liu, Manying Chen
  • Patent number: 10377743
    Abstract: Compounds having activity as inhibitors of G12C mutant KRAS protein are provided. The compounds have the following structure (I): or a pharmaceutically acceptable salt, stereoisomer or prodrug thereof, wherein A, B, R?, Q, W, X, Y, Z, n1, n2 and are as defined herein. Methods associated with preparation and use of such compounds, pharmaceutical compositions comprising such compounds and methods to modulate the activity of G12C mutant KRAS protein for treatment of disorders, such as cancer, are also provided.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: August 13, 2019
    Assignee: Araxes Pharma LLC
    Inventors: Liansheng Li, Jun Feng, Yuan Liu, Pingda Ren, Yi Liu, Tao Wu, Yi Wang
  • Patent number: 10378200
    Abstract: The present disclosure provides apparatuses, methods and systems operable to provide transformable living spaces. The system includes a chassis and a configurable unit movably coupled to the chassis for at least one of translation and rotation with respect to the chassis. The system also includes at least one drivetrain assembly movably coupling the configurable unit to the chassis. The system includes at least one actuator coupled to the configurable unit by the at least one drivetrain assembly. The system also includes at least one robotic controller communicatively coupled to the at least one actuator.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: August 13, 2019
    Assignee: Ori Inc.
    Inventors: Hasier Larrea-tamayo, Ling Yi Liu, Kent Larson, William Lark, Jr.
  • Publication number: 20190244849
    Abstract: Etch uniformity is improved by providing a thermal pad between an insert ring and electrostatic chuck in an etching chamber. The thermal pad provides a continuous passive heat path to dissipate heat from the insert ring and wafer edge to the electrostatic chuck. The thermal pad helps to keep the temperature of the various components in contact with or near the wafer at a more consistent temperature. Because temperature may affect etch rate, such as with etching hard masks over dummy gate formations, a more consistent etch rate is attained. The thermal pad also provides for etch rate uniformity across the whole wafer and not just at the edge. The thermal pad may be used in an etch process to perform gate replacement by removing hard mask layer(s) over a dummy gate electrode.
    Type: Application
    Filed: February 4, 2019
    Publication date: August 8, 2019
    Inventors: Chin-Huei Chiu, Tsung Fan Yin, Chen-Yi Liu, Hua-Li Hung, Xi-Zong Chen, Yi-Wei Chiu
  • Publication number: 20190244161
    Abstract: The discussion relates to inventory control. One example can analyze data from sensors to identify items and users in an inventory control environment. The example can detect co-location of an individual user and an individual item at a first location in the inventory control environment at a first time and at a second location in the inventory control environment at a second time.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 8, 2019
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Abhishek ABHISHEK, Rouzbeh AMINPOUR, Yasser B. ASMI, Zhengyou ZHANG, Ali DALLOUL, Jie LIU, Di WANG, Dimitrios LYMBEROPOULOS, Michel GORACZKO, Yi LU, William THOMAS
  • Publication number: 20190244004
    Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 8, 2019
    Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20190241430
    Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 8, 2019
    Inventors: Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng
  • Publication number: 20190244950
    Abstract: A conductive line structure includes two conductive lines in a layout. The two cut lines are over at least a part of the two conductive lines in the layout. The cut lines designate cut sections of the two conductive lines and the cut lines are spaced from each other within a fabrication process limit. The two cut lines are connected in the layout. The two conductive lines are patterned over a substrate in a physical integrated circuit using the two connected parallel cut lines. The two conductive lines are electrically conductive.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 8, 2019
    Inventors: Ru-Gun Liu, Tung-Heng Hsieh, Tsung-Chieh Tsai, Juing-Yi Wu, Liang-Yao Lee, Jyh-Kang Ting
  • Patent number: 10372743
    Abstract: Systems and methods are disclosed to identify entities that have a similar meaning, and may, in embodiments, be grouped into entity groups for knowledge base construction. In embodiments, the entity relations of similarity or non-similarity for an entity pair are predicted as a binary relationship. In embodiments, the prediction may be based upon similarity score between the entities and the entity features, which features are constructed using an entity feature or representation model. In embodiments, the prediction may be an iterative process involving minimum human checking and existing knowledge update. In embodiments, one or more entity groups are formed using graph search from the predicted entity pairs. In embodiments, a group centroid entity may be selected to represent each group based on one or more factors, such as its generality or popularity.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: August 6, 2019
    Assignee: Baidu USA LLC
    Inventors: Shulong Tan, Hongliang Fei, Yi Zhen, Yu Cao, Bocong Liu, Chaochun Liu, Richard Chun Ching Wang, Dawen Zhou, Wei Fan
  • Patent number: 10370386
    Abstract: Compounds having activity as inhibitors of G12C mutant KRAS protein are provided. The compounds have the following structure (I): or a pharmaceutically acceptable salt, tautomer, prodrug or stereoisomer thereof, wherein R1, R2a, R3a, R3b, R4a, R4b, G1, G2, L1, L2, m1, m2, A, B, W, X, Y, Z and E are as defined herein. Methods associated with preparation and use of such compounds, pharmaceutical compositions comprising such compounds and methods to modulate the activity of G12C mutant KRAS protein for treatment of disorders, such as cancer, are also provided.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: August 6, 2019
    Assignee: Araxes Pharma LLC
    Inventors: Liansheng Li, Jun Feng, Tao Wu, Pingda Ren, Yi Liu, Yuan Liu, Yun Oliver Long
  • Patent number: 10371446
    Abstract: A pot furnace for calcining petroleum coke at low temperature may include a pot, and a cooling water jacket and a flame path below the pot. The flame path may include eight layers. An inlet of a first flame path layer may be in communication with a volatile channel in the front wall, and is provided with a first flame path layer flashboard An eighth flame path layer may be in communication with a communication flue. Flue gas may be discharged out of the furnace body through a main flue. A furnace bottom cooling channel may be provided below the eighth flame path layer.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: August 6, 2019
    Assignee: CHINA ALUMINUM INTERNATIONAL ENGINEERING CORPORATION LIMITED
    Inventors: Chaodong Liu, Shanhong Zhou, Haifei Xu, Pai Lv, Yi Sun, Yinhe Cui
  • Patent number: 10372427
    Abstract: A method according to one embodiment includes importing a plurality of resources associated with an entity, receiving, from the entity, a request for an application that performs predetermined functionality, creating a functionality definition, utilizing the request, determining, from the plurality of resources associated with the entity, one or more necessary resources for implementing the functionality definition, constructing the application that performs the predetermined functionality, utilizing the one or more necessary resources, and implementing the application in an environment of the entity.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: August 6, 2019
    Assignee: HYDATA
    Inventors: Yicun Feng, Bai Yang, Yun Xia, Cheng Liu, Longhui Li, Yujie Zhang, Yuan Fan, Yi Xu
  • Patent number: 10371740
    Abstract: A method for determining a location of a disturbance in a power system is provided. The method includes receiving data from a plurality of sensors distributed across the power system; performing a recurrence quantification analysis on the received data to identify a predetermined number of sensors, from the plurality of sensors, that are closest to the disturbance; constructing a plurality of minimum-volume-enclosing ellipsoids based on and enclosing the data received from the identified sensors; extracting one or more parameters from the plurality of minimum-volume-enclosing ellipsoids; inputting the one or more parameters into a multivariate-random-forest regression algorithm to determine the location of the disturbance and a power mismatch corresponding to the disturbance; and presenting, on one or more display units, the determined location of the disturbance and the determined power mismatch.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: August 6, 2019
    Assignee: University of Tennessee Research Foundation
    Inventors: Yi Cui, Feifei Bai, Wenxuan Yao, Yong Liu, Ling Wu, Yilu Liu
  • Publication number: 20190236326
    Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.
    Type: Application
    Filed: January 30, 2018
    Publication date: August 1, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ying-Cheng Tseng