Patents by Inventor Yi Liu

Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240103286
    Abstract: The present disclosure provides a head-mounted virtual reality apparatus. The head-mounted virtual reality apparatus includes a first strap and a second strap, a second end of the first strap and a second end of the second strap are both laminated within a housing, a portion of the wire is gathered on a first side of the housing, and the second end of the second strap has an open slot that forms a second chute, the open slot is opposite to the wire and the open slot is in a direction consistent with a direction of movement of the second strap.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 28, 2024
    Inventors: An ZHANG, Yi LAI, Guanghui LIU, Yuluo WEN
  • Publication number: 20240104236
    Abstract: A method may include determining an threshold user tolerance level associated with one or more sensitive content classifications. The method may include receiving a request to generate a first user account. The method may include receiving one or more instances of first user account data, wherein the one or more instances of first user account data include at least an indication of the first user's age. The method may include generating, based at least in part on the one or more instances of first user account data, the first user account. The method may include configuring, based at least in part on determining that the first user's age fails to satisfy a sensitive content age threshold, one or more first user account settings to restrict sensitive content at or above the threshold user tolerance level.
    Type: Application
    Filed: December 22, 2022
    Publication date: March 28, 2024
    Inventors: Robin Dsouza, Kayla Marie Schulz, Yi Liu, Kripashankar Mohan, Ashish Upadhyay
  • Publication number: 20240104285
    Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin CHUANG, Shi-Wen TAN, Song LIU, Shih-Yao LIN, Wen-Yuan FANG
  • Patent number: 11941711
    Abstract: Disclosed is a centralized cloud energy storage system for massive and distributed users and a transaction settlement method thereof, a storage medium, and a terminal. The system includes: a centralized energy storage facility invested and operated by a cloud energy storage service provider; the massive and distributed users; and a power network and a user energy management system connecting the centralized energy storage facility with the massive and distributed users. A user sends a charging and discharging request to the cloud energy storage service provider through the user energy management system, and the cloud energy storage service provider issues a charging and discharging instruction to the centralized cloud energy storage system.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 26, 2024
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Ning Zhang, Jingkun Liu, Yi Wang, Chongqing Kang
  • Patent number: 11943983
    Abstract: A display substrate, a method for manufacturing the display substrate, and a display device. In the display substrate, the first sub-pixel and the second sub-pixel each include: a power signal line pattern, at least part of the power signal line pattern extends along the second direction; and a power compensation pattern, at least part of the power compensation pattern extends along the first direction, the power signal line pattern and the power compensation pattern are both located on a side of the first data line pattern and the second data line pattern close to the substrate; the power compensation pattern is electrically connected to the power signal line pattern and a power signal line pattern in an adjacent sub-pixel along the first direction.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: March 26, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Tinghua Shang, Haigang Qing, Yi Zhang, Tingliang Liu, Yu Wang, Yang Zhou
  • Patent number: 11941065
    Abstract: Systems and methods are described for generating record clusters. The methods comprise receiving a plurality of records from data sources and providing at least a subset of the records to a scoring model that determines scores for various pairings of the records, a score for a given pair of the records representing a probability that the given pair of records contain data elements about the same entity. The method further comprises generating a graph data structure that includes a plurality of nodes, individual nodes representing a different record from the records. The method also comprises assigning a different unique identifier to individual clusters of the final clusters and responding to a request for data regarding a given entity by providing aggregated data elements from those records of the records associated with a cluster of the final clusters having an identifier that represents the given entity.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: March 26, 2024
    Assignee: Experian Information Solutions, Inc.
    Inventors: Hua Li, Sophie Liu, Yi He, Zhixuan Wang, Chi Zhang, Kevin Chen, Shanji Xiong, Christer Dichiara, Mason Carpenter, Mark Hirn, Julian Yarkony
  • Patent number: 11942398
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Publication number: 20240092910
    Abstract: The present invention provides a B7-H3 nanobody, the preparation method and use thereof. The B7-H3 nanobody comprises framework regions 1-4 (FR 1-4) and complementarity determining regions 1-3 (CDR 1-3), can specifically bind to B7-H3, and can be used for detecting B7-H3 molecules, and be used for the treatment of various malignant tumors with abnormal expression of B7-H3 molecule.
    Type: Application
    Filed: October 9, 2020
    Publication date: March 21, 2024
    Applicants: Dartsbio Pharmaceuticals Ltd., Shanghai Mabstone Biotechnology Ltd., Shenzhen Innovastone Biopharma Ltd.
    Inventors: Chunhe WANG, Yi-li CHEN, Xinyuan LIU, Weidong LUO, Guojian LIU, Huanhuan LI, Yijun LIN
  • Publication number: 20240095899
    Abstract: The present disclosure includes edge defect detection via image analytics. A method includes identifying an image of an edge of a susceptor pocket formed by a susceptor of a substrate processing system. The method further includes predicting, based on the image, whether property values of the edge of the susceptor meet threshold values. The method further includes, responsive to the property values of the edge meeting threshold values, causing performance of a corrective action associated with the susceptor.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Yash Chhabra, Abyaya Dhar, Joseph Liu, Yi Nung Wu, Boon Sen Chan, Sidda Reddy Kurakula, Chandrasekhar Roy
  • Publication number: 20240096812
    Abstract: A method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. Encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. Electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. Removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee
  • Publication number: 20240094343
    Abstract: A method, device, system, and storage medium for tracking a moving target are provided. The method uses three-dimensional radar observation data to construct a state vector and a motion model of the moving target, thereby to construct a state equation and an observation equation for achieving filtering and tracking within a linear Gaussian framework. The disclosure is also suitable for a moving target in a two-dimensional scene with a distance and an azimuth, and the disclosure use a two-dimensional observation vector to construct a dynamic system to achieving tracking of the moving target. The disclosure can be used in radar systems containing Doppler measurements, and tracking of moving targets can be implemented by performing dimension-expansion processing on observation equations.
    Type: Application
    Filed: August 16, 2023
    Publication date: March 21, 2024
    Inventors: XuanZhi Zhao, Wen Zhang, ZengLi Liu, Kang Liu, HaiYan Quan, Yi Peng, JingMin Tang, YaoLian Song, Zheng Chen
  • Publication number: 20240096342
    Abstract: A processing apparatus and a processing method of a sound signal are provided. In the method, the sound signal is received. A respirator type is identified. The sound signal is modified according to the respirator type. The respirator type is a type of a respirator corresponding to the sound signal. Accordingly, the distortion may be corrected and the accuracy of voice identification may be improved.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 21, 2024
    Applicant: Wistron Corporation
    Inventors: Han-Yi Liu, Chang-Hsin Lai
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240096121
    Abstract: Provided are a computer program product, system, and method for training and using a vector encoder to determine vectors for sub-images of text in an image to subject to optical character recognition. A vector encoder is trained to encode images representing text into vectors in a vector space. Vectors of images representing similar text have a high degree of cohesion in the vector space. Vectors of images representing dissimilar text have a low degree of cohesion in the vector space. An input image is processed to determine sub-images of the input image that bound text represented in the input image. The sub-images are inputted to the vector encoder to output sub-image vectors. The vector encoder generates a search vector for search text. Optical character recognition is applied to at least one region of the input image including the sub-images having sub-image vectors matching the search vector.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Zhong Fang YUAN, Tong LIU, Yi Chen ZHONG, Xiang Yu YANG, Guan Chao LI
  • Publication number: 20240099111
    Abstract: There is provided a display substrate, including: a base; light-emitting units on a side of the base; a flat light-shielding functional layer, including a black matrix and a first planarization layer, on a side of the light-emitting units away from the base, light outgoing openings being provided in the black matrix and being in one-to-one correspondence with the light-emitting units, and the first planarization layer at least filling the light outgoing openings; and a color filter layer, including color filter patterns in one-to-one correspondence with the light outgoing openings, on a side of the flat light-shielding functional layer away from the base, an orthographic projection of each color filter pattern on the base covering an orthographic projection of the light outgoing opening corresponding to the color filter pattern on the base. A method for manufacturing a display substrate, a display panel and a display apparatus are further provided.
    Type: Application
    Filed: July 1, 2022
    Publication date: March 21, 2024
    Inventors: Peng HOU, Yuan HE, Huaisen REN, Zhiliang SHAO, Pei LIU, Xiaoyi WANG, Chao YE, Yi PENG
  • Publication number: 20240098520
    Abstract: Methods and apparatuses for MAC CE based common beam indication are disclosed. In one embodiment, a method comprises receiving a higher layer parameter to enable MAC CE based common beam indication; receiving a common beam indication MAC CE; and determining a common beam according to the common beam indication MAC CE.
    Type: Application
    Filed: January 14, 2021
    Publication date: March 21, 2024
    Applicant: Lenovo (Beijing) Limited
    Inventors: Bingchao Liu, Chenxi Zhu, Wei Ling, Yi Zhang, Lingling Xiao
  • Patent number: 11935804
    Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
  • Patent number: 11932534
    Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng
  • Patent number: 11934060
    Abstract: Provided is an array substrate. The array substrate includes: a base substrate, and a plurality of gate lines, a plurality of data lines, a plurality of sub-pixels and a plurality of touch signal lines disposed on the base substrate. The data lines have a plurality of first extending parts and a plurality of second extending parts which are in an alternating arrangement. When the array substrate is used to prepare a liquid crystal display panel and the liquid crystal display panel is displaying, in each column of the sub-pixels, the voltage polarities of the two adjacent sub-pixels which respectively belong to two adjacent first pixel regions are opposite.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: March 19, 2024
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bo Feng, Shijun Wang, Yang Wang, Zhan Wei, Wenkai Mu, Yi Liu, Li Tian
  • Patent number: D1019916
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: March 26, 2024
    Inventors: Yi Liu, Huanlong Wu, Linjun Yu, Weirui Liu, Zhaoyang Wu, Luyao Han