Abstract: A system for controlling fan noise includes a fin, a fan, a sensor, a signal processing unit, and a speaker. The fin has a front side and a rear side opposite to the front side. The fan is disposed adjacent to the front side and has an airflow outlet, and the airflow outlet faces the front side. The sensor is disposed adjacent to the rear side and is used for receiving a sound signal made by the fan. After the signal processing unit receives the sound signal sent by the sensor, the signal processing unit provides an inversed phase signal by analysis and computation. The speaker is disposed adjacent to the rear side, for receiving and outputting the inversed phase signal provided by the signal processing unit, so as to offset the noise made by the fan.

Abstract: An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source. The heat dissipation device includes a casing having a heat dissipation material. The heat dissipation material includes 15 to 30 volume percent of multiple copper materials, 50 to 85 volume percent of a phase change material, and 15 to 20 volume percent of air. The casing has a surface being in thermal contact with the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area and a geometric midpoint of the surface are overlapped. The heat dissipation device absorbs heat generated by the heat source located in the central area through thermal conduction.

Abstract: An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction.

Abstract: A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.

Abstract: A method for a case for an electronic device is provided. The method includes two steps. More specifically, in the method, a first plastic layer is formed by injection molding. Subsequently, a PCM microcapsule layer is formed on one side of the first plastic layer by injection molding.

Abstract: One embodiment of the disclosure provides a method for manufacturing a thermally insulating housing and the method includes the following step. First, a plastic housing is formed by a Gas-Assisted Injection Molding (GAIM) process, and the plastic housing includes at least one air-tight chamber. Therefore, the thermally insulating housing enhances the thermally insulating effect.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: A fan blade structure includes a hub, an annular partition surrounding the hub, a first blade group and a second blade group. The hub has a top surface and a flank connected to the top surface. The first blade group, disposed on one side of the annular partition, includes two blade arrays having multiple first and second blades respectively. The clearance between the two adjacent first blades is less than that between the two adjacent second blades. The second blade group, disposed on another side of the annular partition, includes another two blade arrays having a plurality of third and fourth blades respectively. The clearance between the two adjacent third blades is less than that between the two fourth blades adjacent to each other.

Abstract: An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source. The heat dissipation device includes a casing having a heat dissipation material. The heat dissipation material includes 15 to 30 volume percent of multiple copper materials, 50 to 85 volume percent of a phase change material, and 15 to 20 volume percent of air. The casing has a surface being in thermal contact with the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area and a geometric midpoint of the surface are overlapped. The heat dissipation device absorbs heat generated by the heat source located in the central area through thermal conduction.

Abstract: An electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case. The radiator is disposed on the case and the radiator is kept away from the heat source at a distance. The radiator comprises a case body. A plurality of cellular compartments formed by a plurality of partition plates is disposed inside the case body. The cellular compartments are filled with a heat dissipation material. The radiator absorbs the heat of the heat source through thermal radiation.

Abstract: A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.

Abstract: A dust removal method of an electronic device is provided that the electronic device includes a first body, a heat dissipation module and a cover plate. The first body includes a heat dissipation opening. The heat dissipation module comprises a fan and a fin assembly. The fan has a fan case body and a blade assembly. The fan case body includes an air inlet, an air outlet and a dust collecting opening. The air outlet and the heat dissipation opening are connected with each other. The cover plate is installed in the fan case body and adjacent to the dust collecting opening. The blade assembly turns and the cover plate covers the dust collecting opening. An air current flows in from the air inlet and flows out from the air outlet.

Abstract: An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The heat dissipation device has a surface facing the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. An orthographic projection region on the surface is in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal radiation.

Abstract: An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source. The heat dissipation device includes a casing having a heat dissipation material including 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The casing has a surface facing the heat source. A central area and an outer ring area are defined on the surface. A geometric midpoint of the central area overlaps a geometric midpoint of the surface. An orthographic projection region of the heat source to the surface is located in the central area. The heat dissipation device absorbs heat generated by the heat source through thermal radiation.

Abstract: An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction.

Abstract: A fan includes a casing and a fan blade. The casing has at least one air inlet and an air outlet. The fan blade is disposed in the casing. An air flow compression area is defined in the casing. An auxiliary air inlet is disposed on the casing at the air flow compression area. Furthermore, another fan includes a casing and a fan blade. The casing has an upper casing, a lower casing and a side casing located between the upper casing and the lower casing. The upper casing or the lower casing has at least one air inlet, and the side casing has an air outlet. The fan blade is disposed in the casing. An internal space of the casing is defined as an air flow compression area. An auxiliary air inlet is disposed on the casing at the air flow compression area.

Abstract: An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.

Abstract: An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.

Abstract: A heat conduction element comprises a pressing portion and extending portions. A pressing side of the pressing portion is in thermal contact with a heat generating element. Each of the extending portions has a first end connected to the pressing portion and a second end away from the pressing portion. Each of the extending portions has a first surface facing the direction same as that of the pressing side and an oppositely disposed second surface. Each of the second ends has a fixing portion. At least one slot is formed between each of the extending portions and the pressing portion. The slot penetrates the first surface and the second surface. The shortest straight distance between each of the fixing portions and the pressing portion is smaller than or equal to the length extended from the first end to the second end of the extending portion.

Abstract: A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.