Abstract: Package structures and methods for forming the same are provided. The package structure includes an integrated circuit die and a package layer surrounding the integrated circuit die. The package structure also includes a redistribution structure over the package layer and electrically connected to the integrated circuit die. The redistribution structure includes a passivation layer and a conductive layer formed in the passivation layer. The integrated circuit die further includes a connector formed over the conductive layer and covered a top surface of the passivation layer. In addition, a bottom surface of the connector and a top surface of the connector are both wider than a neck portion of the connector.

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.

Abstract: The disclosure provides an electromagnetic wave adjustment apparatus includes a control circuit, a transistor circuit die and an electronic assembly. The transistor circuit die receives a control signal from the control circuit and drives the electronic assembly.

Abstract: A phase retardation film is applied to an organic light-emitting diode display device and includes a biaxially stretched polymer substrate and a liquid crystal layer. The polymer substrate has a positive wavelength dispersion characteristic. A thickness of the polymer substrate is between 5 ?m and 100 ?m. The liquid crystal layer is directly coated on the polymer substrate by a full coating process, and there is no adhesion layer between the liquid crystal layer and the polymer substrate. A thickness of the liquid crystal layer is between 0.4 ?m and 5 ?m. One of the polymer substrate and the liquid crystal layer has a phase retardation of ?/2, and the other has a phase retardation of ?/4. A compensation film using the phase retardation film is also provided.

Abstract: A soft-switching power converter includes a main switch, an energy-releasing switch, and an inductive coupled unit. The main switch is a controllable switch. The energy-releasing switch is coupled to the main switch. The inductive coupled unit is coupled to the main switch and the energy-releasing switch. The inductive coupled unit includes a first inductance, a second inductance coupled to the first inductance, and an auxiliary switch unit. The auxiliary switch unit is coupled to the second inductance to form a closed loop. The main switch and the energy-releasing switch are alternately turned on and turned off. The auxiliary switch unit is controlled to start turning on before the main switch is turned on so as to provide at least one current path.

Abstract: An isolated conversion apparatus with magnetic bias balance control includes an isolated converter, a controller, and a magnetic bias balance circuit. The isolated converter includes a transformer, and a primary side of the transformer includes a primary-side winding and at least one switch bridge arm. The controller is coupled to the at least one switch bridge arm, and provides a pulse width modulation (PWM) signal group to control the at least one switch bridge arm. The magnetic bias balance circuit is coupled to two ends of the primary-side winding and the controller, and provides a compensation voltage to the controller according to an average voltage of a winding voltage across the two ends of the primary-side winding. The controller adjusts a duty cycle of the PWM signal group according to the compensation voltage to correct the magnetic bias.

Abstract: A compound of Formula (I): or a pharmaceutically acceptable salt thereof, in which Ring X is a 3 to 7 membered monocyclic ring, at least one of R1, R2, R3, and R4 is OR5 or CH2OR5 and the other R1, R2, R3, and R4 each independently are halogen, OH, OR5, CH2OR5, CO2H, OC?OR6, (C?O)R6, R6, C1-10 alkyl, C2-10 alkenyl, C2-10 alkynyl, H, or absent. Also provided herein are therapeutic uses of the compound of Formula (I).

Abstract: A method of treating coronavirus infection, comprising administering to a subject in need thereof an effective amount of a composition, wherein the composition comprises one or more compounds of Formula (I): or a pharmaceutically acceptable salt thereof.

Abstract: An antenna structure includes a patch antenna including two opposite edges, a microstrip line connected to the patch antenna, two first radiation assemblies respectively disposed on two sides of the patch antenna, two second radiation assemblies disposed under the two first radiation assemblies, a liquid crystal layer disposed between a first plane and a second plane, and a ground plane disposed under the two second radiation assemblies. The patch antenna, the microstrip line, and the two first radiation assemblies are located on the first plane, and each of the first radiation assemblies includes multiple separated first conductors. The two second radiation assemblies are located on the second plane, and each of the second radiation assemblies includes multiple separated second conductors. A projection of the two second radiation assemblies on the first plane, the two first radiation assemblies, and the two edges of the patch antenna collectively form two loops.

Abstract: A method for operating a power factor correction (PFC) circuit of an uninterruptible power supply (UPS) apparatus is provided. The PFC circuit includes two T-type converters, and each of the T-type converters includes four switching tubes. The method includes: converting AC input voltage into a positive bus voltage across a first capacitor and a negative bus voltage across a second capacitor that is connected in series with the first capacitor when the UPS apparatus is operated under a normal supply mode; and controlling conduction states of the switching tubes of the T-type converters to balance the positive bus voltage and the negative bus voltage when the UPS apparatus is operated under a battery supply mode.

Abstract: A method of manufacturing a semiconductor structure includes providing a mask including a first substrate; a first mask layer disposed over the first substrate, including a plurality of first recesses extended through the first mask layer; a second mask layer disposed over the first mask layer and including a plurality of second recesses extended through the second mask layer; providing a second substrate including a photoresist disposed over the second substrate; and projecting a predetermined electromagnetic radiation through the mask towards the photoresist, wherein the first mask layer is at least partially transparent to the predetermined electromagnetic radiation, the second mask layer is opaque to the predetermined electromagnetic radiation, and at least a portion of the second mask layer is disposed between two of the plurality of second recesses.

Abstract: A conversion apparatus with a three-level switching circuit includes a DC conversion module, a three-level circuit, and a control unit. The three-level circuit includes a bridge arm assembly and a capacitor assembly. The capacitor assembly includes a first capacitor and a second capacitor connected to the first capacitor in series. The DC conversion module has a positive output end and a negative output end, and the positive output end and the negative output end are coupled to the bridge arm assembly. The control unit controls the switching of a second switch unit and a third switch unit to make the three-level circuit operate in a first state where the positive output end and the negative output end are connected to the first capacitor, and operate in a second state where the positive output end and the negative output end are connected to the second capacitor.

Abstract: A method of manufacturing a semiconductor structure includes providing a mask including a first substrate; a first mask layer disposed over the first substrate, including a plurality of first recesses extended through the first mask layer; a second mask layer disposed over the first mask layer and including a plurality of second recesses extended through the second mask layer; providing a second substrate including a photoresist disposed over the second substrate; and projecting a predetermined electromagnetic radiation through the mask towards the photoresist, wherein the first mask layer is at least partially transparent to the predetermined electromagnetic radiation, the second mask layer is opaque to the predetermined electromagnetic radiation, and at least a portion of the second mask layer is disposed between two of the plurality of second recesses.

Abstract: A power converter with a common DC power source includes a DC power source and at least two power modules. Each of the power modules is coupled with each other and coupled to the DC power source. Each of the power module includes a coupled inductive component coupled to the DC power source, a DC output conversion unit coupled to the coupled inductive component, and a capacitor group having a coupling point. By using the coupled inductive component, it is to solve the problem of return current between the power modules caused by coupling multiple coupling points to each other.

Abstract: An isolated converter with high boost ration includes a transformer, a first bridge arm, a second bridge arm, and a boost circuit. The transformer includes a secondary side having a secondary side first node and a secondary side second node. The first bridge arm includes a first diode and a second diode. The second bridge arm includes a third diode and a fourth diode. The boost circuit includes at least one fifth diode coupled between the first bridge arm and the secondary side second node, at least one sixth diode coupled between the second bridge arm and the secondary side first node, and at least two capacitors coupled to the secondary side first node and the secondary side second node.

Abstract: A method for operating a power factor correction (PFC) circuit of an uninterruptible power supply (UPS) apparatus is provided. The PFC circuit includes two T-type converters, and each of the T-type converters includes four switching tubes. The method includes: converting AC input voltage into a positive bus voltage across a first capacitor and a negative bus voltage across a second capacitor that is connected in series with the first capacitor when the UPS apparatus is operated under a normal supply mode; and controlling conduction states of the switching tubes of the T-type converters to balance the positive bus voltage and the negative bus voltage when the UPS apparatus is operated under a battery supply mode.

Abstract: An isolated converter with high boost ration includes a transformer, a first bridge arm, a second bridge arm, and a boost circuit. The transformer includes a secondary side having a secondary side first node and a secondary side second node. The first bridge arm includes a first diode and a second diode. The second bridge arm includes a third diode and a fourth diode. The boost circuit includes at least one fifth diode coupled between the first bridge arm and the secondary side second node, at least one sixth diode coupled between the second bridge arm and the secondary side first node, and at least two capacitors coupled to the secondary side first node and the secondary side second node.

Abstract: An isolated boost converter includes a transformer, a first bridge arm, a second bridge arm, and a boost circuit. The transformer includes a secondary side having a secondary side first contact and a secondary side second contact. The boost circuit includes two diodes—anodes of the two diodes are mutually coupled to a first contact and cathodes of the two diodes are coupled to a first bridge arm upper contact and a second bridge arm upper contact, two diodes—cathodes of the two diodes are mutually coupled to a second contact and anodes of the two diodes are coupled to a first bridge arm lower contact and a second bridge arm lower contact, the second contact is coupled to the first contact, and at least two capacitors are coupled to the secondary side first contact and the secondary side second contact.

Abstract: A bidirectional power factor correction (PFC) module is coupled to an AC power source, an energy storage unit, and a DC bus. The bidirectional PFC module includes a bridge arm assembly and a control unit. The bridge arm assembly includes a first bridge arm, a first inductor, a second inductor, and a second bridge arm. The control unit provides a plurality of control signals to control the first bridge arm and the second bridge arm to make the bidirectional PFC module operate in an AC power supply mode, a DC power supply mode, or a power feed mode.

Abstract: A bidirectional power factor correction (PFC) module is coupled to an AC power source, an energy storage unit, and a DC bus. The bidirectional PFC module includes a bridge arm assembly and a control unit. The bridge arm assembly includes a first bridge arm, a first inductor, a second inductor, and a second bridge arm. The control unit provides a plurality of control signals to control the first bridge arm and the second bridge arm to make the bidirectional PFC module operate in an AC power supply mode, a DC power supply mode, or a power feed mode.