Patents by Inventor Yi Qiang

Yi Qiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160381786
    Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.
    Type: Application
    Filed: September 18, 2015
    Publication date: December 29, 2016
    Inventors: XIAN-QIN HU, FU-YUN SHEN, MING-JAAN HO, YI-QIANG ZHUANG
  • Patent number: 9485859
    Abstract: A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: November 1, 2016
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Xian-Qin Hu, Fu-Yun Shen, Jian Luo, Ming-Jaan Ho, Yi-Qiang Zhuang
  • Publication number: 20160286629
    Abstract: The invention provides a light management information system for an outdoor lighting network system, having a plurality of outdoor light units each including at least one sensor type, where each of the light units communicates with at least one other light unit, at least one user input/output device in communication with at one or more of said outdoor light units, a central management system in communication with light units, said central management system sends control commands and/or information to one or more of said outdoor light units, in response to received outdoor light unit status/sensor information from one or more of said outdoor light units or received user information requests from said user input/output device, a resource server in communication with said central management system, wherein the central management system uses the light unit status/sensor information and resources from the resource server to provide information to the user input/output device and/or reconfigure one or more of the l
    Type: Application
    Filed: March 12, 2014
    Publication date: September 29, 2016
    Inventors: HONGXIN CHEN, DAVE ALBERTO TAVARES CAVALCANTI, KIRAN SRINIVAS CHALLAPALI, SANAE CHRAIBI, LIANG JIA, ANDREW ULRICH RUTGERS, YONG YANG, MICHAEL ALEX VAN HARTSKAMP, DZMITRY VIKTOROVICH ALIAKSEYEU, HUI LI, QING LI, FULONG MA, JONATHAN DAVID MASON, BERENT WILLEM MEERBEEK, JOHN BREAN MILLS, TALMAI BRANDÃO DE OLIVEIRA, DANIEL J. PIOTROWSKI, YUAN SHU, NEVEEN SHLAYAN, MARCIN KRZYSZTOF SZCZODRAK, YI QIANG YU, ZHONG HUANG, MARTIN ELIXMANN, QIN ZHAO, XIANNENG PENG, JIANFENG WANG, DAN JIANG
  • Publication number: 20160286627
    Abstract: The invention provides a light management information system for an outdoor lighting network system, having a plurality of outdoor light units each including at least one sensor type, where each of the light units communicates with at least one other light unit, at least one user input/output device in communication with at one or more of said outdoor light units, a central management system in communication with light units, said central management system sends control commands and/or information to one or more of said outdoor light units, in response to received outdoor light unit status/sensor information from one or more of said outdoor light units or received user information requests from said user input/output device, a resource server in communication with said central management system, wherein the central management system uses the light unit status/sensor information and resources from the resource server to provide information to the user input/output device and/or reconfigure one or more of the l
    Type: Application
    Filed: March 10, 2014
    Publication date: September 29, 2016
    Inventors: HONGXIN CHEN, DAVE ALBERTO TAVARES CAVALCANTI, MARCIN GRAMZA, LIANG JIA, QING LI, DANIEL J. PIOTROWSKI, MAREK ZBIGNIEW SZCZERBA, MARCIN KRZYSZTOF SZCZODRAK, QIN ZHAO, HONGQIANG ZHAI, MICHAEL ALEX VAN HARTSKAMP, MARTIN ELIXMANN, ZHONG HUANG, FULONG MA, XIANNENG PENG, JIANFENG WANG, YI QIANG YU, KIRAN SRINIVAS CHALLAPALI
  • Publication number: 20160183357
    Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.
    Type: Application
    Filed: October 30, 2015
    Publication date: June 23, 2016
    Inventors: Ming-Jaan HO, Xian-Qin HU, Yi-Qiang ZHUANG, Fu-Wei ZHONG
  • Publication number: 20160150622
    Abstract: The invention provides A light management system for an outdoor lighting network system, comprising a plurality of outdoor light units wherein at least one light unit includes at least one sensor type, a central management system in communication with light units, said central management system sends control commands to one or more of said outdoor light units, in response to received outdoor light unit status/sensor information from one or more of said outdoor light units and implement a lighting strategy relating to the lighting characteristics of the plurality of outdoor light units, wherein the central management system uses the light unit status/sensor information to form a user's behavior analyses, and determine or estimate or predict the user's motion trajectory and/or position and a change in a user-controlled light use and/or ambient light, and determine whether to modify the lighting strategy and/or reconfigure one or more of the lights units.
    Type: Application
    Filed: April 17, 2014
    Publication date: May 26, 2016
    Inventors: Ingrid Christian Maria FLINSENBERG, Alexandre Georgevich SINITSYN, Leszek HOLENDERSKI, Yuan SHU, YI Qiang YU
  • Patent number: 9277640
    Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: March 1, 2016
    Assignees: FuKui Precison Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen, Yi-Qiang Zhuang
  • Publication number: 20150319829
    Abstract: A computing unit (10) and a method are provided. The method comprises obtaining data being indicative of operational statuses and geographic positions of a plurality of street devices (11), and obtaining region description data for a region in which the street devices are located. Further, the geographic positions and operational statuses of the street devices are correlated with the region description data.
    Type: Application
    Filed: December 2, 2013
    Publication date: November 5, 2015
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventors: YUAN SHU, ALEXANDRE GEORGIEVICH SINITSYN, INGRID CHRISTINA MARIA FLINSENBERG, YI QIANG YU
  • Publication number: 20150189738
    Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.
    Type: Application
    Filed: December 31, 2014
    Publication date: July 2, 2015
    Inventors: MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, YI-QIANG ZHUANG
  • Publication number: 20140024462
    Abstract: Software at a MMO game website creates a team to perform a collaborative game task in the MMO game. Each player on the team is assigned from a queue of players who share one or more attributes. The collaborative game task is composed of a plurality of individual game tasks. Each player on a team is assigned an individual game task by the software. The software provides a game reward to a player after the player has satisfactorily completed less than all of the individual game task assigned to the player. The software determines that a team has satisfactorily completed the collaborative game task, according to game mechanics associated with the collaborative game task. Then the software provides a game reward to each player on the team.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 23, 2014
    Applicant: Zynga Inc.
    Inventors: Yi Qiang, Tatung Mei, John Osvald, David Richey, Cesario Julation, Kyle Sampson
  • Publication number: 20140024461
    Abstract: Software at an MMO game website creates a team to perform a collaborative game task in an MMO game. The collaborative game task is composed of a plurality of individual game tasks. Each player on the team is assigned an individual game task by the software. The software removes an existing player from the team, if the existing player is not participating, and the software assigns a new player to a team. The software determines that the team has satisfactorily completed the collaborative game task associated with the team, according to game mechanics associated with the collaborative game task. Then the software terminates provides a game reward to each player on the team.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 23, 2014
    Applicant: Zynga Inc.
    Inventors: Jeff Rodkey, Tatung Mei, Kyle Sampson, Cesario Julation, Yi Qiang
  • Publication number: 20130333216
    Abstract: An exemplary method for manufacturing a heat dissipation device includes the following steps. First, providing fins spaced from each other. Then, providing an electric conductor extending through the fins and being electrically connected to the fins. Next, immersing the combination of the fins and the electric conductor into an electrolyte of an electrolytic cell. After that, connecting an anode of the electrolytic cell with the electric conductor in an electric conductive relationship. Finally, providing the anode with electrical power to form metal oxide films over surfaces of the fins and the electric conductor.
    Type: Application
    Filed: August 21, 2013
    Publication date: December 19, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: WEI LI, YI-QIANG WU, CHUN-CHI CHEN
  • Patent number: 8584736
    Abstract: An exemplary heat sink assembly includes a base plate, a number of fins, a heat spreader and a heat pipe. The fins are mounted on and thermally connect with the base plate for dissipating heat of the base plate. A bottom one of the fins has a body parallel to the base plate and a number of supporting tabs extending downwardly from the body. The supporting tabs engage with a top surface of the base plate to support the fins onto the base plate and reinforce a whole strength of the heat sink assembly. The heat spreader is mounted below the base plate. The heat pipe includes a horizontal evaporating portion sandwiched between the heat spreader and the base plate and a vertical condensing portion extending from a free end of the evaporation portion and passing through the fins.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: November 19, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu
  • Patent number: 8544530
    Abstract: A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: October 1, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu, Chun-Chi Chen
  • Patent number: 8453714
    Abstract: An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: June 4, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu, Chun-Chi Chen
  • Publication number: 20130000880
    Abstract: A heat dissipation device for a heat-generating component includes a heat dissipation fin group and a side plate. The heat dissipation fin group comprises a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprises a base plate and a fold extending vertically from a side of the base plate. The folds of the heat dissipation fins located at a common side are combined with each other to form a side surface. The side plate covers the side surface of the heat dissipation fin group, and an exposed surface of the side plate includes a plurality of strips formed thereon.
    Type: Application
    Filed: September 21, 2011
    Publication date: January 3, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: YI-QIANG WU, XUE-WEN PENG, CHUN-CHI CHEN
  • Publication number: 20120278471
    Abstract: Disclosed are a communication device and a method of a communication device that includes processing by the controller a first scan for shared drives and folders on a wide local area network in accordance with a CIFS Protocol and then processing a second scan for shared drives and folders of a local wide area network in accordance with an Address Resolution Protocol. An Address Resolution Protocol (ARP) is a computer network host's link layer or hardware address when only it's Internet Layer (IP) or Network Layer address is known. An ARP port scan is a low level request and answer protocol that uses a simple message format that contains one address resolution request or response. IP addresses are the result of an ARP port scan. In this way, user can be provided with the opportunity to connect to all available local servers.
    Type: Application
    Filed: April 26, 2011
    Publication date: November 1, 2012
    Applicant: Motorola Mobility, Inc.
    Inventors: Michael P. Labowicz, Bin Li, Ping-Yan Su, Yi-Qiang Zhai
  • Patent number: 8225847
    Abstract: A heat dissipation device cooling an electronic device includes a conductive plate, a heat spreader received in the conductive plate and contacting the electronic device, a heat pipe connecting the conductive plate and the heat spreader, and an elastic member mounted on the conductive plate and pushing the heat spreader and the heat pipe in the heat spreader downwardly toward the electronic device.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: July 24, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu
  • Patent number: 8220528
    Abstract: A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: July 17, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu, Chun-Chi Chen
  • Patent number: 8162038
    Abstract: A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket includes a mounting portion secured on the base and a pair of supporting arms extending from the mounting portion and fixed to the fan. Four screws extend through the fan to threadedly engage with the fin group. Lower two of the screws also extend through the supporting arms of the supporting bracket whereby the supporting bracket also connects with the fan.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: April 24, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Qiang Wu, Chun-Chi Chen