Patents by Inventor Yi Sheng Lin

Yi Sheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11121028
    Abstract: Semiconductor devices and methods of forming are provided. In some embodiments the semiconductor device includes a substrate, and a dielectric layer over the substrate. A first conductive feature is included in the dielectric layer, the first conductive feature comprising a first number of material layers. A second conductive feature is included in the dielectric layer, the second conductive feature comprising a second number of material layers, where the second number is higher than the first number. A first electrical connector is included overlying the first conductive feature.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: September 14, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin, Ting-Hsun Chang, Chia-Wei Ho, Liang-Guang Chen
  • Publication number: 20210280577
    Abstract: A method includes forming an isolation region extending into a semiconductor substrate, etching a top portion of the isolation region to form a recess in the isolation region, and forming a gate stack extending into the recess and overlapping a lower portion of the isolation region. A source region and a drain region are formed on opposite sides of the gate stack. The gate stack, the source region, and the drain region are parts of a Metal-Oxide-Semiconductor (MOS) device.
    Type: Application
    Filed: May 10, 2021
    Publication date: September 9, 2021
    Inventors: Yi-Huan Chen, Kong-Beng Thei, Fu-Jier Fan, Ker-Hsiao Huo, Kau-Chu Lin, Li-Hsuan Yeh, Szu-Hsien Liu, Yi-Sheng Chen
  • Patent number: 11112639
    Abstract: A method for sensing a biometric object using an electronic device includes the steps of: (a) emitting a sensing light from a backlight unit upon the biometric object contacting a sensing region on a display surface, and allowing the sensing light to pass through a color filter unit and then reach and be reflected by the biometric object to return as a reflected light; and (b) controlling arrangement of liquid crystal molecules located in a first region of a liquid crystal layer to define a first light path, and allowing the reflected light having predetermined wavelengths to pass through the color filter unit and the first light path to reach and be detected by the optical sensing unit.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: September 7, 2021
    Assignee: MACROBLOCK, INC.
    Inventor: Yi-Sheng Lin
  • Patent number: 11114339
    Abstract: A method of manufacturing a device includes exposing at least one of a source/drain contact plug or a gate contact plug to a metal ion source solution during a manufacturing process, wherein a constituent metal of a metal ion in the metal ion source solution and the at least one source/drain contact plug or gate contact plug is the same. If the source/drain contact plug or the gate contact plug is formed of cobalt, the metal ion source solution includes a cobalt ion source solution. If the source/drain contact plug or the gate contact plug is formed of tungsten, the metal ion source solution includes a tungsten ion source solution.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: September 7, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ling-Fu Nieh, Chun-Wei Hsu, Pinlei Edmund Chu, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Publication number: 20210271620
    Abstract: A connection interface conversion chip, a connection interface conversion device and an operation method are provided. The connection interface conversion chip includes a USB interface circuit, a DP interface circuit, a USB core circuit and a switching circuit. The USB interface circuit is suitable for coupling to a USB connector. The DP interface circuit is suitable for coupling to a DP connector. In a first operation mode, at least one USB signal pair received by the USB connector is transmitted to the USB core circuit through the USB interface circuit. The USB core circuit decodes the USB signal pair and generates DP data. The DP data is transmitted to the DP connector by the DP interface circuit. In a second operation mode, the DP data received by the USB connector is transmitted to the DP connector through the USB interface circuit, the switching circuit and the DP interface circuit.
    Type: Application
    Filed: December 3, 2020
    Publication date: September 2, 2021
    Applicant: VIA LABS, INC.
    Inventors: Cheng-Chung Lin, Hsiao-Chyi Lin, Yi-Shing Lin, Chien-Sheng Chen
  • Publication number: 20210272818
    Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 2, 2021
    Inventors: Yi-Sheng LIN, Chi-Jen LIU, Chi-Hsiang SHEN, Te-Ming KUNG, Chun-Wei HSU, Chia-Wei HO, Yang-Chun CHENG, William Weilun HONG, Liang-Guang CHEN, Kei-Wei CHEN
  • Publication number: 20210256685
    Abstract: A method of building a model of defect inspection for a light-emitting diode (LED) display is adapted to be implemented by a model-building system. The model-building system stores captured images respectively of LED displays that were displaying images. Each of the captured images corresponds to a status tag that indicates a status of the image being displayed by the respective one of the LED displays. The method includes: performing data preprocessing on the captured images to result in pieces of pre-processed data that respectively correspond to the captured images; and building a model of defect inspection by using an algorithm of machine learning based on the pieces of pre-processed data and the status tags.
    Type: Application
    Filed: January 28, 2021
    Publication date: August 19, 2021
    Applicant: MACROBLOCK, INC.
    Inventor: Yi-Sheng Lin
  • Publication number: 20210257222
    Abstract: A method for packaging an integrated circuit chip includes the steps of: a) providing a plurality of dies and a lead frame which includes a plurality of bonding parts each having a die pad, a plurality of leads each having an end region disposed on and connected to the die pad, and a plurality of bumps each disposed on the end region of a respective one of the leads; b) transferring each of the dies to the die pad of a respective one of the bonding parts to permit each of the dies to be flipped on the respective bonding part; and c) hot pressing each of the dies and the die pad of a respective one of the bonding parts to permit each of the dies to be bonded to the bumps of the respective bonding part.
    Type: Application
    Filed: January 22, 2021
    Publication date: August 19, 2021
    Applicant: MACROBLOCK. INC.
    Inventors: Li-Chang YANG, Yi-Sheng LIN
  • Publication number: 20210257520
    Abstract: A display device includes a carrier, a substrate unit, a plurality of light emitting elements and a circuit unit. The carrier has a top surface and a bottom surface opposite to each other, and a peripheral surface interconnecting the top and bottom surfaces. The substrate unit is disposed on one side of the peripheral surface of the carrier. The light emitting elements are spacedly disposed on the top surface of the carrier. The circuit unit includes a plurality of circuit modules that are disposed on the substrate unit and that are electrically connected to the light emitting elements. Each of the circuit modules includes a switch control circuit and a driving circuit that are configured to control the light emitting elements.
    Type: Application
    Filed: January 28, 2021
    Publication date: August 19, 2021
    Applicant: MACROBLOCK, INC.
    Inventor: Yi-Sheng Lin
  • Patent number: 11079062
    Abstract: A display device includes a monitor and a support module including a base frame, a support frame and a driving unit. The base frame includes a base seat and a rotating seat connected to the base seat and rotatable about an axis. The support frame includes a connecting mechanism connected to the monitor, and a support member connected co-rotatably to the rotating seat and connected to the connecting mechanism. The driving unit includes a drive subunit co-rotatably secured to the rotating seat, and a control subunit mounted to the base seat, connected to the drive subunit, and being operable to drive rotation of the rotating seat about the axis via the drive subunit, thereby rotating the monitor about the axis.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: August 3, 2021
    Assignee: TOP VICTORY INVESTMENTS LIMITED
    Inventors: Yi-Sheng Lin, Chia-Yu Liu, Tung-Jung Hsueh
  • Publication number: 20210223830
    Abstract: An enclosure for a computer proofed against being accidentally opened includes a cabinet and a cover plate, the cabinet defines a first chute, the cover plate includes a first hook structure, the first hook structure cooperates with the first chute to cover the cover plate on the cabinet. The cabinet defines a groove in the first chute, the first hook structure comprises a locking portion, and the locking portion is used to engage with the groove.
    Type: Application
    Filed: July 2, 2020
    Publication date: July 22, 2021
    Inventors: YI-SHENG LIN, DING CHEN
  • Publication number: 20210180741
    Abstract: A display device includes a monitor and a support module including a base frame, a support frame and a driving unit. The base frame includes a base seat and a rotating seat connected to the base seat and rotatable about an axis. The support frame includes a connecting mechanism connected to the monitor, and a support member connected co-rotatably to the rotating seat and connected to the connecting mechanism. The driving unit includes a drive subunit co-rotatably secured to the rotating seat, and a control subunit mounted to the base seat, connected to the drive subunit, and being operable to drive rotation of the rotating seat about the axis via the drive subunit, thereby rotating the monitor about the axis.
    Type: Application
    Filed: April 2, 2020
    Publication date: June 17, 2021
    Inventors: Yi-Sheng LIN, Chia-Yu LIU, Tung-Jung HSUEH
  • Publication number: 20210183688
    Abstract: Methods of forming a slurry and methods of performing a chemical mechanical polishing (CMP) process utilized in manufacturing semiconductor devices, as described herein, may be performed on semiconductor devices including integrated contact structures with ruthenium (Ru) plug contacts down to a semiconductor substrate. The slurry may be formed by mixing a first abrasive, a second abrasive, and a reactant with a solvent. The first abrasive may include a first particulate including titanium dioxide (TiO2) particles and the second abrasive may include a second particulate that is different from the first particulate. The slurry may be used in a CMP process for removing ruthenium (Ru) materials and dielectric materials from a surface of a workpiece resulting in better WiD loading and planarization of the surface for a flat profile.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Inventors: Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu, Jian-Ci Lin, Chi-Jen Liu, Yi-Sheng Lin, Yang-Chun Cheng, Liang-Guang Chen, Kuo-Hsiu Wei, Kei-Wei Chen
  • Patent number: 11037799
    Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: June 15, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Yi-Sheng Lin, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Te-Ming Kung, William Weilun Hong, Chi-Hsiang Shen, Chia-Wei Ho, Chun-Wei Hsu, Yang-Chun Cheng
  • Publication number: 20210163859
    Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
    Type: Application
    Filed: February 10, 2021
    Publication date: June 3, 2021
    Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Publication number: 20210126047
    Abstract: A metal-oxide semiconductor module includes multiple metal-oxide semiconductor components separated from one another by at least one first trench. Each of the metal-oxide semiconductor components includes a heavily doped semiconductor layer which includes a drain region, an epitaxial layer which is formed with an indentation such that the drain region is partially exposed from the epitaxial layer, and a metallic patterned contact unit. The epitaxial layer also includes a source region and a gate region that are spaced-apart formed therein. The metallic patterned contact unit includes source, gate, and drain patterned contacts which are electrically connected to the source, gate, and drain regions, respectively. A light-emitting diode display device including the metal-oxide semiconductor module is also disclosed.
    Type: Application
    Filed: October 23, 2020
    Publication date: April 29, 2021
    Applicants: MACROBLOCK, INC., FORCE MOS TECHNOLOGY CO., LTD.
    Inventors: Kao-Way Tu, Yuan-Shun Chang, Li-Chang Yang, Yi-Sheng Lin
  • Patent number: 10978894
    Abstract: The invention discloses a clamping activation method, applicable to an electric clamping device with wireless charging, the electric clamping device comprising a body and a wireless charging module, a control unit, and an electric clamping assembly, all disposed inside the body. The clamping activation method comprises: the control unit receiving a signal generated by the wireless charging module; the control unit activating the electric clamping assembly to clamp the electronic device according to the signal; and the control unit activating the wireless charging module to charge the electronic device. As such, the electric clamping device can automatically clamp the electronic device without installing additional sensing elements or switches.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: April 13, 2021
    Inventor: Yi Sheng Lin
  • Patent number: 10961487
    Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Publication number: 20210078129
    Abstract: A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 18, 2021
    Inventors: Yi-Sheng LIN, Chi-Hsiang SHEN, Chi-Jen LIU, Chun-Wei Hsu, Yang-Chun CHENG, Kei-Wei CHEN
  • Publication number: 20210080794
    Abstract: An electronic apparatus includes a flexible display device and a roller. The flexible display device includes a driving substrate, a display layer on the driving substrate, and a front protective layer covering the display layer. The flexible display device has an end portion fixed to the roller. The roller includes a holding groove, a receiving slot, and a retraction assembly. The holding groove is recessed from an external surface of the roller. The end portion is in the holding groove. The flexible display device further includes a main body portion outside the holding groove. A thickness of the end portion is less than a thickness of the main body portion. The receiving slot is recessed from the external surface. The retraction assembly is disposed in the receiving slot. When the retraction assembly abuts against the flexible display device, the retraction assembly is pressed into the receiving slot.
    Type: Application
    Filed: August 31, 2020
    Publication date: March 18, 2021
    Inventors: Hsing-Kai WANG, Chen-Chu TSAI, Chia-Chun YEH, Yi-Sheng LIN