Abstract: A method of manufacturing a device includes exposing at least one of a source/drain contact plug or a gate contact plug to a metal ion source solution during a manufacturing process, wherein a constituent metal of a metal ion in the metal ion source solution and the at least one source/drain contact plug or gate contact plug is the same. If the source/drain contact plug or the gate contact plug is formed of cobalt, the metal ion source solution includes a cobalt ion source solution. If the source/drain contact plug or the gate contact plug is formed of tungsten, the metal ion source solution includes a tungsten ion source solution.

Abstract: Semiconductor devices and methods of forming are provided. In some embodiments the semiconductor device includes a substrate, and a dielectric layer over the substrate. A first conductive feature is included in the dielectric layer, the first conductive feature comprising a first number of material layers. A second conductive feature is included in the dielectric layer, the second conductive feature comprising a second number of material layers, where the second number is higher than the first number. A first electrical connector is included overlying the first conductive feature.

Abstract: A chassis includes a frame and a fixing bracket for fixing an expansion card to the frame. The frame defines at least one card hole and includes a side hook. The fixing bracket includes a bracket body, at least one rotating hook fixed to the bracket body and a movable hook fixed to the bracket body. The rotating hook and the movable hook are not in the same plane. When the at least rotating hook is inserted into the at least one card hole and the bracket body is rotated in a first direction to a predetermined position, the rotating hook is locked in the card hole, and the movable hook is hooked on the side hook to make the bracket body fix an expansion card to the frame.

Abstract: A method of manufacturing a device includes exposing at least one of a source/drain contact plug or a gate contact plug to a metal ion source solution during a manufacturing process, wherein a constituent metal of a metal ion in the metal ion source solution and the at least one source/drain contact plug or gate contact plug is the same. If the source/drain contact plug or the gate contact plug is formed of cobalt, the metal ion source solution includes a cobalt ion source solution. If the source/drain contact plug or the gate contact plug is formed of tungsten, the metal ion source solution includes a tungsten ion source solution.

Abstract: A shock absorbing screw includes a locking member, a friction member sleeved on the locking member, and a connecting frame sleeved on the friction member. The shock absorbing screw is connected to a hard disk by a connecting portion of the shock absorbing screw. An abutting portion of the shock absorbing screw is connected to the friction member. The connecting portion is passed through a second through hole defined in the friction member. A first end of the connecting frame includes a first clamping portion, a second end of the connecting frame includes a second clamping portion, and a second groove is defined between the first clamping portion and the second clamping portion. The shock absorbing screw is connected to a hard disk frame in the second groove. The friction member is connected to the connecting frame through a first through hole defined in the connecting frame.

Abstract: A method for cultivating Cordyceps militaris fruiting body capable of improving C. militaris fruiting body morphology is provided, wherein rice absorbed with a tea liquid is used as a solid-state culture medium. In comparison to using rice absorbed with water as a solid-state culture medium, the C. militaris fruiting body cultivated by using the solid-state culture medium of the present invention under the same cultivation condition are significantly more robust.

Abstract: A foldable display device includes a display panel having two flat portions and a bend portion between the two flat portions; a hinge substantially aligned with and beneath the bend portion of the display panel; a plurality of slidable platforms between the hinge and a bottom surface of the bend portion of the display panel; and a repeatable adhering component between one of the slidable platforms and the bottom surface of the bend portion of the display panel, wherein the repeatable adhering component comprises a self-adhesive pad or a weak adhesive.

Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

Abstract: A computer chassis capable of receiving multiple motherboards includes a shell and a first motherboard received in the shell. The shell includes a plurality of grooves and a pressing column. The computer chassis further includes a motherboard module, the motherboard module includes a bracket and a second motherboard received in the bracket. The bracket includes an operation member and a plurality of guide rails. The guide rails are inserted into the grooves, the operation member is rotated to drive the bracket to the first motherboard, until the motherboard module is slidably rotated in the shell. The second motherboard is thereby electrically connected with the first motherboard.

Abstract: A flexible electronic device has a display region and a package region surrounding the display region. The flexible electronic device includes a substrate, a first protection film, a first adhesive layer, a display medium layer, and a flexible auxiliary layer. The first protection film is disposed to be opposite to the substrate. The first adhesive layer is disposed between the substrate and the first protection film, and at least located within the package region. The display medium layer is disposed between the substrate and the first protection film, and located within the display region. The flexible auxiliary layer is disposed on a surface of the first protection film, and located within the package region, wherein the flexible auxiliary layer overlaps the first adhesive layer in a thickness direction.

Abstract: The present application provides a culture medium for producing ?-glucan. The culture medium comprises: a carbon source, lecithin and an ascorbic acid. The present application further provides a method for producing ?-glucan, the method comprising culturing Aureobasidium pullulans in the culture medium for fermentation. The Aureobasidium pullulans is advantageous in producing no melanin; as a result, the yield of ?-glucan can be increased and the waste can be reduced with the improved culture medium composition and culturing method. A biological sample of the Aureobasidium pullulans described in the present specification is deposited at National Institute of Technology and Evaluation (NITE), NITE Patent Microorganisms Depositary (NPMD) on Oct. 19, 2016 under the access number NITE BP-02372.

Abstract: A hand-mountable mounting apparatus for hard disk drives (HDD) and storage devices using HDD includes a tray defining an installation space for the hard disk drive and a locking unit. The tray includes a hook. A bracket of the locking unit includes defines a first locking slot corresponding to the hook and a sliding plate defining a second locking slot corresponding to the hook and the first locking slot. The sliding plate is slidable between an unlock position, where the hook is free to withdraw, and a lock position, where the first locking slot and the second locking slot are not aligned and the hook is latched by the sliding plate.

Abstract: A small-volume push-push apparatus for mounting and demounting a hard disk includes a pressing member, a bracket, and an elastic rod. The bracket defines first to fourth sliding slots, and the elastic rod includes a sliding portion. The pressing member can drive the sliding portion to slide along the first to fourth sliding slots in sequence. When the sliding portion slides to an ending point of the first sliding slot and intersects with the second sliding slot, the bracket can move at a first direction. When the sliding portion slides to a starting point of the first sliding slot away from the fourth sliding slot, the bracket can move in a second direction opposite to the first direction.

Abstract: Semiconductor devices and methods of forming are provided. In some embodiments the method includes forming a dielectric layer over a substrate and patterning the dielectric layer to form a first recess. The method may also include depositing a first layer in the first recess and depositing a second layer over the first layer, the second layer being different than the first layer. The method may also include performing a first chemical mechanical polish (CMP) process on the second layer using a first oxidizer and performing a second CMP process on remaining portions of the second layer and the first layer using the first oxidizer. The method may also include forming a first conductive element over the remaining portions of the first layer after the second CMP polish is performed.

Abstract: A method of manufacturing a device includes exposing at least one of a source/drain contact plug or a gate contact plug to a metal ion source solution during a manufacturing process, wherein a constituent metal of a metal ion in the metal ion source solution and the at least one source/drain contact plug or gate contact plug is the same. If the source/drain contact plug or the gate contact plug is formed of cobalt, the metal ion source solution includes a cobalt ion source solution. If the source/drain contact plug or the gate contact plug is formed of tungsten, the metal ion source solution includes a tungsten ion source solution.

Abstract: A method for cultivating Cordyceps militaris fruiting body capable of improving C. militaris fruiting body morphology is provided, wherein rice absorbed with a tea liquid is used as a solid-state culture medium. In comparison to using rice absorbed with water as a solid-state culture medium, the C. militaris fruiting body cultivated by using the solid-state culture medium of the present invention under the same cultivation condition are significantly more robust.

Abstract: A foldable display device includes a holding structure and a flexible display panel. The holding structure includes a soft outer housing, a first inner housing, a second inner housing, a first supporting stage, a second supporting stage, a first hinge, a first spring element, a second hinge, and a second spring element. The first hinge is connected to a same side of the first inner housing and the first supporting stage. The first spring element is connected to another same side of the first inner housing and the first supporting stage. The second hinge is connected to a same side of the second inner housing and the second supporting stage. The second spring element is connected to another same side of the second inner housing and the second supporting stage. The flexible display panel is located on the first and second supporting stages.

Abstract: A foldable display device includes a display panel having two flat portions and a bend portion between the two flat portions; a hinge substantially aligned with and beneath the bend portion of the display panel; a plurality of slidable platforms between the hinge and a bottom surface of the bend portion of the display panel; and a repeatable adhering component between one of the slidable platforms and the bottom surface of the bend portion of the display panel, wherein the repeatable adhering component comprises a self-adhesive pad or a weak adhesive.

Abstract: Methods for forming semiconductor structures are provided. The method for forming a semiconductor structure includes forming a conductive material in the trench and over a top surface of the material layer and polishing the conductive material with a slurry to expose the top surface of the material layer and to form a conductive structure in the trench. The method for forming a semiconductor structure further includes forming a material layer over a substrate and forming a trench in the material layer. The method for forming a semiconductor structure further includes removing the slurry with a reducing solution. In addition, the reducing solution includes a reducing agent, and a standard electrode voltage of the conductive material is greater than a standard electrode voltage of the reducing agent.

Abstract: A flexible laminated structure includes a first protection layer, a second protection layer directly contacting the first protection layer and a flexible material layer. The second protection layer having a plurality of openings, which are used to expose a portion of the first protection layer. The flexible material layer is disposed on the second protection layer and extends into the openings, and directly contacts the first protection layer exposed by the openings. An adhesion between the flexible material layer and the first protection layer is greater than an adhesion between the second protection layer and the first protection layer.