Patents by Inventor Yi Shi

Yi Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250210392
    Abstract: Various aspects may provide a handling assembly. The handling assembly may include a body with a component-handling surface. The component-handling surface may include a first component-handling region configured to accommodate a first semiconductor component arrangement and a second component-handling region configured to accommodate a second semiconductor component arrangement. The handling assembly may further include an electrode arrangement disposed at the body in a manner so as to be capable of independently toggling each of the first component-handling region and the second component-handling region between an active state and an inactive state. In the active state the electrode arrangement may provide an electrostatic retention force over the component-handling region, configured to retain a corresponding semiconductor component arrangement on the component-handling region.
    Type: Application
    Filed: December 22, 2023
    Publication date: June 26, 2025
    Inventors: Bhaskar Jyoti KRISHNATREYA, Michael J. BAKER, Feras EID, Wenhao LI, Veronica STRONG, Thomas SOUNART, Adel A. ELSHERBINI, Johanna M. SWAN, Kimin JUN, Yi SHI, Xavier BRUN, Shawna M. LIFF, Edison Chien-An CHEN
  • Patent number: 12329754
    Abstract: The present invention provides use of berbamine dihydrochloride in preparation of an Ebola virus inhibitor. In the present invention, the primed glycoprotein of the Ebola virus (EBOV-GPcl) is taken as a target site, and an antiviral active compound with the capability of binding to the EBOV-GPcl, i.e., berbamine dihydrochloride, is obtained through structure-based virtual screening. Berbamine dihydrochloride can specifically inhibit the entry of an Ebola recombinant virus by binding to the target protein EBOV-GPcl, thereby achieving the effect of anti-Ebola virus infection. The half-maximum effect concentration (EC50) of berbamine dihydrochloride against EBOV is 0.49 ?M, which indicates that berbamine dihydrochloride has a strong inhibition effect on EBOV.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: June 17, 2025
    Assignee: Institute of Medicinal Biotechnology, Chinese Academy of Medical Sciences
    Inventors: Shan Cen, Quanjie Li, Dongrong Yi, Yi Shi, Han Wang, Jinming Zhou
  • Publication number: 20250192247
    Abstract: A battery of a vehicle is provided, including an interface part, a power part, and an operation part. The interface part includes a first interface surface and a second interface surface. The power part includes a battery body and is connected with the interface part. The operation part is connected with the power part. The interface part includes: a first battery interface adapted to a first peripheral interface, where the first battery interface is mounted on the first interface surface and electrically connected with the battery body; and a second battery interface adapted to a second peripheral interface, where the second battery interface is mounted on the second interface surface and electrically connected with the battery body. The first battery interface is coupled and electrically connected with the first peripheral interface in a battery compartment after the battery is inserted into the battery compartment.
    Type: Application
    Filed: February 10, 2025
    Publication date: June 12, 2025
    Applicant: Guangzhou Tufa network technology Co., LTD
    Inventors: Yi SHI, Shiyang ZHANG
  • Patent number: 12319693
    Abstract: Crystalline forms of Compound I: pharmaceutically acceptable salts thereof, and solvates and hydrates thereof are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.
    Type: Grant
    Filed: October 24, 2023
    Date of Patent: June 3, 2025
    Assignee: Vertex Pharmaceuticals Incorporated
    Inventors: Yi Shi, Kevin J. Gagnon, Jicong Li, Jennifer Lu, Ales Medek, Muna Shrestha, Michael Waldo, Beili Zhang, Carl L Zwicker, Corey Don Anderson, Jeremy J. Clemens, Thomas Cleveland, Timothy Richard Coon, Bryan Frieman, Peter Grootenhuis, Sara Sabina Hadida Ruah, Jason McCartney, Mark Thomas Miller, Prasuna Paraselli, Fabrice Pierre, Sara E. Swift, Jinglan Zhou
  • Publication number: 20250154037
    Abstract: An integrated synchronous nitrogen and sulfur removal device and a wastewater treatment method includes a reactor. A partition plate is horizontally arranged in the reactor to divide the reactor into a first reaction area and a second reaction area which are arranged up and down. An annular baffle plate with a height is arranged in the first reaction area to divide the first reaction area into a first reaction chamber and a second reaction chamber, and a hollow columnar carrier is arranged in the first reaction chamber, so that a third reaction chamber is formed in the first reaction chamber, and the hollow columnar carrier is made of biological stuffing. A water inlet of the reactor is arranged above the first reaction chamber, an anode and a cathode are arranged in the third reaction chamber.
    Type: Application
    Filed: April 16, 2024
    Publication date: May 15, 2025
    Inventors: You-Peng CHEN, Bin-Hao ZHU, Peng YAN, Yu SHEN, Hui-Min FU, Man-Yi SHI
  • Publication number: 20250112185
    Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. One or both of an integrated circuit (IC) die hybrid bonding region and a base substrate hybrid bonding region are surrounded by superhydrophobic structures that have a contact angle not less than 150 degrees. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. The liquid droplet is pinned to the hybrid bonding regions by the superhydrophobic structures. A hybrid bond is formed by evaporating the droplet and a subsequent anneal.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Thomas Sounart, Michael Baker, Seyed Hadi Zandavi, Yi Shi, Feras Eid
  • Publication number: 20250108873
    Abstract: This disclosure provides a device fixing bracket and a vehicle, including a first member, a second member, a first clamping portion, a second clamping portion, and a pull-back structure. The first member and the second member are constructed to be capable of moving toward or moving away from each other along a target direction. When the device fixing bracket is in operation, the second clamping portion and the first clamping portion clamp a target device under a pull-back force. When the device fixing bracket is not in operation, at least a part of the second member is covered by the first member under the pull-back force. The device fixing bracket in this disclosure is small in size, and convenient and safe to use.
    Type: Application
    Filed: December 4, 2024
    Publication date: April 3, 2025
    Applicant: Guangzhou Tufa network technology Co., LTD
    Inventors: Xiajun WANG, Yi SHI
  • Publication number: 20250108768
    Abstract: The present disclosure provides a cover panel for a vehicle stem and a vehicle, where the cover panel is configured to cover the vehicle stem and connected with the vehicle stem. A shape of an internal surface of the cover panel matches a shape of an external surface of the vehicle stem. An external surface of the connected cover panel is engaged with the exposed external surface of the vehicle stem. The cover panel and the vehicle provided have the following advantages: threaded connecting pieces on the vehicle stem can be covered to improve appearance and safety, and the external surface of the mounted cover panel is engaged with and in smooth transition with the external surface of the vehicle stem to further improve the appearance.
    Type: Application
    Filed: December 8, 2024
    Publication date: April 3, 2025
    Applicant: Guangzhou Tufa network technology Co., LTD
    Inventors: Qibiao WANG, Yi SHI, Ziqiu XIAO
  • Publication number: 20250108962
    Abstract: The present disclosure provides a storage box and a vehicle. The storage box includes a box body, a box cover, and a cover opening structure. The cover opening structure is configured to guide the box cover to switch from a closed state to an opening state in which an accommodating cavity is opened, or guiding the box cover to switch from the opening state to the closed state. The cover opening structure for guiding the box cover to switch between the opening state and the closed state is disposed in the accommodating cavity such that the opening of the storage box is not affected by an external environment. Moreover, the cover opening structure does not occupy the original space of the vehicle such that the storage box is suitable for use in the vehicle.
    Type: Application
    Filed: December 8, 2024
    Publication date: April 3, 2025
    Applicant: Guangzhou Tufa network technology Co., LTD
    Inventors: He YANG, Yi SHI
  • Publication number: 20250112181
    Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die and a surface of a substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hydrophobic structures include non-vertical inward sloping sidewalls or similar features to contain a liquid droplet that is applied to the die or substrate hybrid bonding region. After the hybrid bonding regions are brought together, capillary forces cause the die to self-align, and a hybrid bond is formed by evaporating the liquid and subsequent anneal. IC structures including the IC die and portions of the substrate are segmented and assembled.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Feras Eid, Yi Shi, Kimin Jun, Adel Elsherbini, Thomas Sounart, Wenhao Li, Xavier Brun
  • Publication number: 20250112173
    Abstract: A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Kimin Jun, Feras Eid, Adel Elsherbini, Thomas Sounart, Yi Shi, Wenhao Li
  • Publication number: 20250112200
    Abstract: A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Adel Elsherbini, Kimin Jun, Feras Eid, Thomas Sounart, Yi Shi, Shawna Liff, Johanna Swan, Michael Baker, Bhaskar Jyoti Krishnatreya, Chien-An Chen
  • Publication number: 20250112187
    Abstract: A surface of an integrated circuit (IC) die structure or a host structure to which the IC die structure is to be bonded includes a biphilic surface for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. Hydrophobic regions can be self-aligned to hydrophilic regions of the biphilic surface by forming precursor metallization features within the hydrophobic regions concurrently with the formation of metallization features within the hydrophilic regions. Metallization features within the hydrophobic regions may then be at least partially removed as sacrificial to facilitate the formation of a hydrophobic surface. Metallization features within the hydrophilic regions may be retained and ultimately bonded to complementary features of another IC die structure or substrate structure.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Kimin Jun, Feras Eid, Adel Elsherbini, Thomas Sounart, YI Shi
  • Publication number: 20250108877
    Abstract: This disclosure provides a vehicle suspension system. Actuating elements disposed on two sides of a vehicle body provide acting forces for the vehicle body, so that the vehicle body is in an equilibrium position. When the vehicle body deviates from the equilibrium position, a resultant force generated by the two actuating elements causes the vehicle body to return to the equilibrium position. The vehicle suspension system can overcome the problems that a vehicle body is easy to shake and difficult to balance due to a high degree of freedom of wheels in a suspension system connected by a linkage mechanism.
    Type: Application
    Filed: December 5, 2024
    Publication date: April 3, 2025
    Applicant: Guangzhou Tufa network technology Co., LTD
    Inventors: Bowen WANG, Yi SHI
  • Publication number: 20250112177
    Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die backside surface and a surface of a structural substrate each include bonding regions surrounded by hydrophobic structures. A liquid droplet is applied to the die or structural substrate bonding region and the die is placed on the bonding region of the structural substrate. Capillary forces cause the die to self-align to the bonding region, and a bond is formed by evaporating the liquid and subsequent anneal. A hybrid bond is then formed between the opposing active surface of the die and a base substrate using wafer-to-wafer bonding. IC structures including the IC die and portions of the structural substrate and base substrate are segmented from the bonded wafers and assembled.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Feras Eid, Thomas Sounart, Yi Shi, Michael Baker, Adel Elsherbini, Kimin Jun, Xavier Brun, Wenhao Li
  • Publication number: 20250112199
    Abstract: Hybrid bonded multi-level die stacks, related apparatuses, systems, and methods of fabrication are disclosed. First-level integrated circuit (IC) dies and a base substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet followed by anneal. Hybrid bonding regions of second-level IC dies are similarly bonded to hybrid bonding regions on backsides of the first-level IC dies. This is repeated for any number of subsequent levels of IC dies. IC structures including the bonded IC dies and portions of the base substrate are segmented and assembled.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Thomas Sounart, Feras Eid, Adel Elsherbini, Yi Shi, Michael Baker, Kimin Jun, Wenhao Li
  • Publication number: 20250083883
    Abstract: The invention relates to a pouch for storing a fluid product, in particular cosmetic product, comprising: a sachet defining an inner volume in which the fluid product is contained; a spout attached to the sachet in a sealing manner and defining a channel leading into the inner volume of the sachet, the channel having an inlet end toward the inner volume of the sachet and an outlet end opposite the inlet end; a closure comprising a body having a first segment with a first radial dimension and a second segment with a second radial dimension larger than the first radial dimension, wherein the second segment is located on a side of the first segment toward the inner volume of the sachet; wherein the closure is configured to prevent air from entering the inner volume of the sachet through the channel in a sealing position, wherein the closure is at least partially disposed in the channel and engages the spout when arranged in the sealing position; and wherein the closure can be displaced away from the sealing posi
    Type: Application
    Filed: December 1, 2022
    Publication date: March 13, 2025
    Applicant: L'OREAL
    Inventors: JinSeok KIM, Chunjie LI, Yi SHI, Emeric RENAUDIN, Gonghao XUE
  • Patent number: 12227076
    Abstract: The invention relates to a hybrid power drive system, comprising: an internal combustion engine having a crankshaft; a first electric motor (14), wherein the first electric motor (14) is an outer rotor electric motor, and comprises an outer rotor (14.2) that is rigidly connected to the crankshaft and rotates together with the crankshaft; a transmission (15) comprising an input shaft (20); and a clutch (18) that is provided between the first electric motor (14) and the transmission (15), and is connected to the input shaft (20) of the transmission. The clutch (18) is configured to be capable of switching between the following positions: an engagement position where the clutch (18) is engaged with the outer rotor (14.2); and a separation position where the clutch (18) is separated from the outer rotor (14.2). The present system is simple in structure, high in efficiency, and low in manufacturing and maintenance costs.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: February 18, 2025
    Assignee: BorgWarner US Technologies LLC
    Inventors: Xiangdong Xu, Jie Gu, Yi Shi, Lin Fan, Jiancheng Xin
  • Publication number: 20250051326
    Abstract: Crystalline forms of Compound I: pharmaceutically acceptable salts thereof, and solvates and hydrates thereof are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 13, 2025
    Inventors: Yi Shi, Kevin J. Gagnon, Jicong Li, Jennifer Lu, Ales Medek, Muna Shrestha, Michael Waldo, Beili Zhang, Carl L. Zwicker, Corey Don Anderson, Jeremy J. Clemens, Thomas Cleveland, Timothy Richard Coon, Bryan Frieman, Peter Grootenhuis, Sara Sabina Hadida Ruah, Jason McCartney, Mark Thomas Miller, Prasuna Paraselli, Fabrice Pierre, Sara E. Swift, Jinglan Zhou
  • Patent number: 12221756
    Abstract: A self-acting dredging and drainage structure for a plain river network irrigation area is provided. The structure includes a first tube body, a water inlet end side of the first tube body is provided with a trash rack, a partition body is provided in the first tube body, and a water outlet end side of the first tube body is provided with a contraction and diversion device. The contraction and diversion device divides a water outlet end of the first tube body into an upper water outlet side and a lower water outlet side, and the contraction and diversion device includes no less than one arranged contraction and diversion pipe; and the upper water outlet side has first water outlets and second water outlets.
    Type: Grant
    Filed: September 20, 2024
    Date of Patent: February 11, 2025
    Assignee: Zhejiang Institute of Hydraulics & Estuary(Zhejiang Institute of Marine Planning and Design)
    Inventors: Longqiang Su, Jinhua Wen, Shuiping Yao, Shang Gao, Chenbin Jiang, Helong Wang, Yi Shi, Caiming Chen, Qifeng Li, Ming Wen