Abstract: The present disclosure provides a cover panel for a vehicle stem and a vehicle, where the cover panel is configured to cover the vehicle stem and connected with the vehicle stem. A shape of an internal surface of the cover panel matches a shape of an external surface of the vehicle stem. An external surface of the connected cover panel is engaged with the exposed external surface of the vehicle stem. The cover panel and the vehicle provided have the following advantages: threaded connecting pieces on the vehicle stem can be covered to improve appearance and safety, and the external surface of the mounted cover panel is engaged with and in smooth transition with the external surface of the vehicle stem to further improve the appearance.

Abstract: This disclosure provides a vehicle suspension system. Actuating elements disposed on two sides of a vehicle body provide acting forces for the vehicle body, so that the vehicle body is in an equilibrium position. When the vehicle body deviates from the equilibrium position, a resultant force generated by the two actuating elements causes the vehicle body to return to the equilibrium position. The vehicle suspension system can overcome the problems that a vehicle body is easy to shake and difficult to balance due to a high degree of freedom of wheels in a suspension system connected by a linkage mechanism.

Abstract: The present disclosure provides a storage box and a vehicle. The storage box includes a box body, a box cover, and a cover opening structure. The cover opening structure is configured to guide the box cover to switch from a closed state to an opening state in which an accommodating cavity is opened, or guiding the box cover to switch from the opening state to the closed state. The cover opening structure for guiding the box cover to switch between the opening state and the closed state is disposed in the accommodating cavity such that the opening of the storage box is not affected by an external environment. Moreover, the cover opening structure does not occupy the original space of the vehicle such that the storage box is suitable for use in the vehicle.

Abstract: This disclosure provides a device fixing bracket and a vehicle, including a first member, a second member, a first clamping portion, a second clamping portion, and a pull-back structure. The first member and the second member are constructed to be capable of moving toward or moving away from each other along a target direction. When the device fixing bracket is in operation, the second clamping portion and the first clamping portion clamp a target device under a pull-back force. When the device fixing bracket is not in operation, at least a part of the second member is covered by the first member under the pull-back force. The device fixing bracket in this disclosure is small in size, and convenient and safe to use.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. One or both of an integrated circuit (IC) die hybrid bonding region and a base substrate hybrid bonding region are surrounded by superhydrophobic structures that have a contact angle not less than 150 degrees. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. The liquid droplet is pinned to the hybrid bonding regions by the superhydrophobic structures. A hybrid bond is formed by evaporating the droplet and a subsequent anneal.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die and a surface of a substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hydrophobic structures include non-vertical inward sloping sidewalls or similar features to contain a liquid droplet that is applied to the die or substrate hybrid bonding region. After the hybrid bonding regions are brought together, capillary forces cause the die to self-align, and a hybrid bond is formed by evaporating the liquid and subsequent anneal. IC structures including the IC die and portions of the substrate are segmented and assembled.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die backside surface and a surface of a structural substrate each include bonding regions surrounded by hydrophobic structures. A liquid droplet is applied to the die or structural substrate bonding region and the die is placed on the bonding region of the structural substrate. Capillary forces cause the die to self-align to the bonding region, and a bond is formed by evaporating the liquid and subsequent anneal. A hybrid bond is then formed between the opposing active surface of the die and a base substrate using wafer-to-wafer bonding. IC structures including the IC die and portions of the structural substrate and base substrate are segmented from the bonded wafers and assembled.

Abstract: Hybrid bonded multi-level die stacks, related apparatuses, systems, and methods of fabrication are disclosed. First-level integrated circuit (IC) dies and a base substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet followed by anneal. Hybrid bonding regions of second-level IC dies are similarly bonded to hybrid bonding regions on backsides of the first-level IC dies. This is repeated for any number of subsequent levels of IC dies. IC structures including the bonded IC dies and portions of the base substrate are segmented and assembled.

Abstract: A surface of an integrated circuit (IC) die structure or a host structure to which the IC die structure is to be bonded includes a biphilic surface for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. Hydrophobic regions can be self-aligned to hydrophilic regions of the biphilic surface by forming precursor metallization features within the hydrophobic regions concurrently with the formation of metallization features within the hydrophilic regions. Metallization features within the hydrophobic regions may then be at least partially removed as sacrificial to facilitate the formation of a hydrophobic surface. Metallization features within the hydrophilic regions may be retained and ultimately bonded to complementary features of another IC die structure or substrate structure.

Abstract: A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.

Abstract: A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.

Abstract: The invention relates to a pouch for storing a fluid product, in particular cosmetic product, comprising: a sachet defining an inner volume in which the fluid product is contained; a spout attached to the sachet in a sealing manner and defining a channel leading into the inner volume of the sachet, the channel having an inlet end toward the inner volume of the sachet and an outlet end opposite the inlet end; a closure comprising a body having a first segment with a first radial dimension and a second segment with a second radial dimension larger than the first radial dimension, wherein the second segment is located on a side of the first segment toward the inner volume of the sachet; wherein the closure is configured to prevent air from entering the inner volume of the sachet through the channel in a sealing position, wherein the closure is at least partially disposed in the channel and engages the spout when arranged in the sealing position; and wherein the closure can be displaced away from the sealing posi

Abstract: The invention relates to a hybrid power drive system, comprising: an internal combustion engine having a crankshaft; a first electric motor (14), wherein the first electric motor (14) is an outer rotor electric motor, and comprises an outer rotor (14.2) that is rigidly connected to the crankshaft and rotates together with the crankshaft; a transmission (15) comprising an input shaft (20); and a clutch (18) that is provided between the first electric motor (14) and the transmission (15), and is connected to the input shaft (20) of the transmission. The clutch (18) is configured to be capable of switching between the following positions: an engagement position where the clutch (18) is engaged with the outer rotor (14.2); and a separation position where the clutch (18) is separated from the outer rotor (14.2). The present system is simple in structure, high in efficiency, and low in manufacturing and maintenance costs.

Abstract: Crystalline forms of Compound I: pharmaceutically acceptable salts thereof, and solvates and hydrates thereof are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.

Abstract: A self-acting dredging and drainage structure for a plain river network irrigation area is provided. The structure includes a first tube body, a water inlet end side of the first tube body is provided with a trash rack, a partition body is provided in the first tube body, and a water outlet end side of the first tube body is provided with a contraction and diversion device. The contraction and diversion device divides a water outlet end of the first tube body into an upper water outlet side and a lower water outlet side, and the contraction and diversion device includes no less than one arranged contraction and diversion pipe; and the upper water outlet side has first water outlets and second water outlets.

Abstract: The disclosure provides at least one entity chosen from compounds of formula (I), solid state forms of the same, compositions comprising the same, and methods of using the same, including use in treating focal segmental glomerulosclerosis (FSGS) and/or non-diabetic kidney disease (NDKD).

Abstract: Disclosed herein are coronavirus neutralizing antibodies and uses thereof for treating and/or preventing a coronavirus infection in a subject.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to self-align batch pick and place die bonding. Disclosed is an apparatus comprising a fluid dispensing assembly to dispense first amounts of water onto first hydrophilic regions of a first semiconductor wafer at a first point in time, the first hydrophilic regions having a first arrangement, and dispense second amounts of water onto second hydrophilic regions of a second semiconductor wafer at a second point in time, the second hydrophilic regions having a second arrangement, and a pick-and-place assembly to simultaneously position, at the first point in time, a first batch of dies corresponding to the first arrangement onto the first amounts of water dispensed on the first semiconductor wafer, and simultaneously position, at the second point in time, a second batch of dies corresponding to the second arrangement onto the second amounts of water dispensed on the second semiconductor wafer.

Abstract: Disclosed are a method, an apparatus and a storage medium for measuring the quality of a built environment.