Patents by Inventor Yi Shi
Yi Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12045595Abstract: Methods, systems, and computer-readable storage media for receiving, by an application studio, user input indicating two or more artifacts of an enterprise application developed using the application studio, generating, by an enterprise application artifact composer of the application studio, an enterprise application artifact as a universal tag that provides an abstract representation of the enterprise application, and during deployment of the enterprise application: retrieving the enterprise application artifact, determining a target runtime that the enterprise application is to be deployed to, determining a set of dependencies for each artifact of the enterprise application, and for any dependency in the set of dependencies that is absent from the target runtime, retrieving binary code of the dependency from a library to deploy the dependency to the target runtime.Type: GrantFiled: June 14, 2022Date of Patent: July 23, 2024Assignee: SAP SEInventors: Yi Quan Zhou, Qiu Shi Wang
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Patent number: 12026760Abstract: A method for transacting a resource flow is provided. The method is applied to a blockchain server, and includes: acquiring initial transaction information for associating a requester client with a provider client, and sending the initial transaction information to other blockchain servers, to store the initial transaction information in respective corresponding blockchain database; acquiring certificate information indicative of a status of a resource flow usage of the requester client; and determining a first value indicative of a value added by the requester client to an account of the provider client based on the initial transaction information and the certificate information, and sending the first value to the other blockchain servers. An apparatus for transacting a resource flow, a computer equipment, and a computer-readable medium are further provided.Type: GrantFiled: October 11, 2018Date of Patent: July 2, 2024Assignee: Hefei Dappworks Technology Co., Ltd.Inventors: Yi Shi, Yang Zhang
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Publication number: 20240158206Abstract: An elevator car door locking device and elevator equipment. The car door locking device includes a vane base provided with a first and a second rotation center; a vane assembly provided with a clamping vane or an expanding vane; and a vane drive assembly having a driving member, a transmission member, an unlocking member and a car door locking hook. The driving member, the transmission member and the vane assembly are hinged to the first rotation center, the car door locking hook is hinged to the second rotation center, the transmission member is hinged with the vane assembly through a connecting shaft, and the unlocking member is hinged to a third rotation center on the driving member and is provided with a limiting part for limiting the connecting shaft.Type: ApplicationFiled: July 27, 2023Publication date: May 16, 2024Inventors: Chong Chen, Haiping Pan, Xiu Jian, Haiyun Qian, Qiguo Li, Zhijia Zheng, Yi Shi
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Patent number: 11977537Abstract: A method of processing data for a blockchain, wherein a blockchain network has a bottom blockchain network and an upper blockchain network, the bottom blockchain network has a plurality of bottom blockchain nodes, the upper blockchain network has a plurality of upper blockchain nodes, and the method is applied to the upper blockchain nodes, and the method includes: transmitting block data in a current node belonging to an upper blockchain of the upper blockchain network to a bottom blockchain node, so that each bottom blockchain node stores the block data into a bottom blockchain of the bottom blockchain network by using a consensus verification. The present disclosure also proposes a device of processing data for a blockchain, a blockchain system, a computer device and a computer readable medium.Type: GrantFiled: December 28, 2018Date of Patent: May 7, 2024Assignee: HEFEI DAPPWORKS TECHNOLOGY CO., LTD.Inventors: Yan Zhang, Yi Shi
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Publication number: 20240105821Abstract: A structure of a two-dimensional material-based device having an air-gap and a method for preparing same comprises a substrate, a gate, an dielectric, a two-dimensional material-based film, and source and drain electrodes; the air-gap is formed between the two-dimensional material-based film and the side wall of the dielectric on the gate, or the air-gap is formed between the dielectric and the gate; two-dimensional material-based devices of the above structure utilize the ductility and flexibility of two-dimensional materials to reduce the coupling between the gate and the source/drain electrodes, thereby reducing the parasitic capacitance and the circuit delay; also, the structure ensures that a part of the contact region of the source and drain electrodes with the two-dimensional material can be controlled by the gate, and can thus avoid the reduction in electrical properties and keep a low resistance of the device.Type: ApplicationFiled: November 9, 2023Publication date: March 28, 2024Applicant: NANJING UNIVERSITYInventors: Xinran Wang, Dongxu Fan, Weisheng Li, Hao Qiu, Yi Shi
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Publication number: 20240063142Abstract: Multi-die packages including IC die crack mitigation features. Prior to the bonding of IC dies to a host substrate, the IC dies may be shaped, for example with a corner radius or chamfer. After bonding the shaped IC dies, a fill comprising at least one inorganic material may be deposited over the IC dies, for example to backfill a space between adjacent IC dies. With the benefit of a greater IC die sidewall slope and/or smoother surface topology associated with the shaping process, occurrences of stress cracking within the fill and concomitant damage to the IC dies may be reduced. Prior to depositing a fill, a barrier layer may be deposited over the IC die to prevent cracks that might form in the fill material from propagating into the IC die.Type: ApplicationFiled: August 19, 2022Publication date: February 22, 2024Applicant: Intel CorporationInventors: Adel Elsherbini, Wenhao Li, Bhaskar Jyoti Krishnatreya, Tushar Talukdar, Botao Zhang, Yi Shi, Haris Khan Niazi, Feras Eid, Nagatoshi Tsunoda, Xavier Brun, Mohammad Enamul Kabir, Omkar Karhade, Shawna Liff, Jiraporn Seangatith
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Publication number: 20240063066Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die having a surface; a template structure having a first surface and an opposing second surface, wherein the first surface of the template structure is coupled to the surface of the first die, and wherein the template structure includes a cavity at the first surface and a through-template opening extending from a top surface of the cavity to the second surface of the template structure; and a second die within the cavity of the template structure and electrically coupled to the surface of the first die by interconnects having a pitch of less than 10 microns between adjacent interconnects.Type: ApplicationFiled: August 19, 2022Publication date: February 22, 2024Applicant: Intel CorporationInventors: Omkar G. Karhade, Tomita Yoshihiro, Adel A. Elsherbini, Bhaskar Jyoti Krishnatreya, Tushar Talukdar, Haris Khan Niazi, Yi Shi, Batao Zhang, Wenhao Li, Feras Eid
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Publication number: 20240063178Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die and a through-dielectric via (TDV) surrounded by a dielectric material in a first layer, where the TDV has a greater width at a first surface and a smaller width at an opposing second surface of the first layer; a second die, surrounded by the dielectric material, in a second layer on the first layer, where the first die is coupled to the second die by interconnects having a pitch of less than 10 microns, and the dielectric material around the second die has an interface seam extending from a second surface of the second layer towards an opposing first surface of the second layer with an angle of less than 90 degrees relative to the second surface; and a substrate on and coupled to the second layer.Type: ApplicationFiled: August 19, 2022Publication date: February 22, 2024Applicant: Intel CorporationInventors: Jimin Yao, Adel A. Elsherbini, Xavier Francois Brun, Kimin Jun, Shawna M. Liff, Johanna M. Swan, Yi Shi, Tushar Talukdar, Feras Eid, Mohammad Enamul Kabir, Omkar G. Karhade, Bhaskar Jyoti Krishnatreya
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Publication number: 20240063136Abstract: An integrated circuit (IC) device comprises an array comprising rows and columns of conductive interconnect pads. At least one optical alignment fiducial region is distinct from the array and comprises a fiducial pattern, wherein the fiducial pattern comprises a first group of pads contiguous to a second group of pads, and wherein a width of a space between nearest pads of the first and second groups is wider than the spaces between pads within each group.Type: ApplicationFiled: August 19, 2022Publication date: February 22, 2024Applicant: Intel CorporationInventors: Haris Khan Niazi, Yi Shi, Adel Elsherbini, Xavier Brun, Georgios Dogiamis, Thomas Brown, Omkar Karhade
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Publication number: 20240043505Abstract: Disclosed herein are coronavirus neutralizing antibodies and uses thereof for treating and preventing a coronavirus infection in a subject.Type: ApplicationFiled: August 19, 2021Publication date: February 8, 2024Inventors: Yi SHI, I, Yufei XIANG
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Patent number: 11884672Abstract: The disclosure provides compounds useful for treating alpha-1 antitrypsin deficiency (AATD), according to formula (I): tautomers thereof, pharmaceutically acceptable salts of the compounds, pharmaceutically acceptable salts of the tautomers, deuterated derivatives of the compounds, deuterated derivatives of the tautomers, and deuterated derivatives of the salts, solid forms of those compounds and processes for making those compounds.Type: GrantFiled: May 13, 2020Date of Patent: January 30, 2024Assignee: Vertex Pharmaceuticals IncorporatedInventors: Upul Keerthi Bandarage, Cavan McKeon Bligh, Diane Boucher, Michael John Boyd, Michael Aaron Brodney, Michael Philip Clark, Veronique Damagnez, Lev Tyler Dewey Fanning, Robert Francis Fimognari, Gabrielle Simone Fleming, Kevin James Gagnon, Pedro Manuel Garcia Barrantes, Robert Daniel Giacometti, Simon Giroux, Ronald Lee Grey, Jr., Samantha Guido, Amy Beth Hall, Sarah Carol Hood, Dennis James Hurley, Mac Arthur Johnson, Jr., Peter Jones, Sarathy Kesavan, Mei-Hsiu Lai, Siying Liu, Adam Looker, Brad Maxwell, John Patrick Maxwell, Ales Medek, Philippe Marcel Nuhant, Kirk Alan Overhoff, Setu Roday, Stefanie Roeper, Steven M. Ronkin, Rupa Sawant, Yi Shi, Muna Shrestha, Marisa Sposato, Kathy Stavropoulos, Rebecca Jane Swett, Timothy Lewis Tapley, Qing Tang, Stephen Thomson, Jinwang Xu, Mariam Zaky, Kevin Michael Cottrell
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Patent number: 11873300Abstract: Crystalline forms of Compound I: pharmaceutically acceptable salts thereof, and solvates and hydrates thereof are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.Type: GrantFiled: August 13, 2020Date of Patent: January 16, 2024Assignee: Vertex Pharmaceuticals IncorporatedInventors: Yi Shi, Kevin J. Gagnon, Jicong Li, Jennifer Lu, Ales Medek, Muna Shrestha, Michael Waldo, Beili Zhang, Carl L. Zwicker, Corey Don Anderson, Jeremy J. Clemens, Thomas Cleveland, Timothy Richard Coon, Bryan Frieman, Peter Grootenhuis, Sara Sabina Hadida Ruah, Jason McCartney, Mark Thomas Miller, Prasuna Paraselli, Fabrice Pierre, Sara E. Swift, Jinglan Zhou
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Publication number: 20240002386Abstract: Solid forms of 4-(5-(4-fluorophenyl)-6-(tetrahydro-2H-pyran-4-yl)-1,5-dihydropyrrolo[2,3-f]indazol-7-yl)benzoic acid (Compound 1) capable of modulating alpha-1 antitrypsin (AAT) activity and methods of treating alpha-1 antitrypsin deficiency (AATD) by administering one or more such forms, and methods of using and preparing the same for treatment of alpha-1 antitrypsin deficiency (AATD).Type: ApplicationFiled: November 17, 2021Publication date: January 4, 2024Inventors: Yi SHI, Mei-Hsiu LAI, Ales MEDEK, Kan-Nian HU, Zhengtian SONG, Elisa A. TORRICO GUZMAN, Kathleen Paige SOKOLOWSKY, Simon GIROUX, Siying LIU, Kirk Alan OVERHOFF, Setu RODAY, Rupa SAWANT, Marisa SPOSATO
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Publication number: 20240006358Abstract: Bonding pedestals on substrates, and their manufacture, for direct bonding integrated circuit (IC) dies onto substrates. The electrical interconnections of one or more IC dies and a substrate are bonded together with the IC dies on and overhanging the pedestals. A bonding pedestal may be formed by etching down the substrate around the interconnections. A system may include one or more such pedestals above and adjacent a recessed surface on a substrate with IC dies overhanging the pedestals. Such a system may be coupled to a host component, such as a board, and a power supply via the host component.Type: ApplicationFiled: June 30, 2022Publication date: January 4, 2024Applicant: Intel CorporationInventors: Zhihua Zou, Omkar Karhade, Botao Zhang, Julia Chiu, Vivek Chidambaram, Yi Shi, Mohit Bhatia, Mostafa Aghazadeh
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Publication number: 20240006332Abstract: An integrated circuit (IC) device comprises a host component and an IC die directly bonded to the host component. The IC die comprises a substrate material layer and a die metallization level between the substrate material layer and host component. The IC die includes an upper die alignment fiducial between the die metallization level and host component. The upper die alignment fiducial at least partially overlaps one or more metallization features within the die metallization level. In embodiments, at least two orthogonal edges of the upper die alignment fiducial do not overlap any of the metallization features within the die metallization level. In embodiments, the IC die includes a lower die alignment fiducial between the substrate material layer and the die metallization level. The lower die alignment fiducial may at least partially overlap one or more second metallization features within a second die metallization level of the IC die.Type: ApplicationFiled: July 1, 2022Publication date: January 4, 2024Applicant: Intel CorporationInventors: Dimitrios Antartis, Nitin A. Deshpande, Siyan Dong, Omkar Karhade, Gwang-soo Kim, Shawna Liff, Siddhartha Mal, Debendra Mallik, Khant Minn, Haris Khan Niazi, Arnab Sarkar, Yi Shi, Botao Zhang
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Publication number: 20230357191Abstract: Compounds of Formula (I): pharmaceutically acceptable salts thereof, deuterated derivatives of any of the foregoing, and metabolites of any of the foregoing are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed. Also disclosed are solid state forms of Compound 1 and salts and solvates thereof.Type: ApplicationFiled: August 4, 2022Publication date: November 9, 2023Inventors: Alexander Russell Abela, Timothy Alcacio, Corey Anderson, Paul Timothy Angell, Minson Baek, Jeremy J. Clemens, Thomas Cleveland, Lori Ann Ferris, Peter Diederik Jan Grootenhuis, Raymond Stanley Gross, Anton V. Gulevich, Sara Sabina Hadida Ruah, Clara Kuang-Ju Hsia, Robert M. Hughes, Pramod Virupax Joshi, Ping Kang, Ali Keshavarz-Shokri, Haripada Khatuya, Paul John Krenitsky, Jason McCartney, Mark Thomas Miller, Prasuna Paraselli, Fabrice Jean Denis Pierre, Yi Shi, Muna Shrestha, David Andrew Siesel, Kathy Stavropoulos, Andreas P. Termin, Fredrick F. Van Goor, Johnny Uy, Timothy John Young, Jinglan Zhou
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Patent number: 11799630Abstract: A method for blockchain nodes, the method including: sending security data of an Internet of Things system to other blockchain nodes, so that each blockchain node stores the security data in a blockchain database for that blockchain node; and obtaining one or more pieces of security data of the Internet of Things system from a blockchain database for a current blockchain node, and performing a corresponding operation on the Internet of Things system based on the obtained security data. There is also provided a device, a computer system and a computer readable medium for blockchain nodes.Type: GrantFiled: May 9, 2018Date of Patent: October 24, 2023Assignee: HEFEI DAPPWORKS TECHNOLOGY CO., LTD.Inventors: Yan Zhang, Yi Shi
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Publication number: 20230321079Abstract: The present invention provides use of berbamine dihydrochloride in preparation of an Ebola virus inhibitor. In the present invention, the primed glycoprotein of the Ebola virus (EBOV-GPcl) is taken as a target site, and an antiviral active compound with the capability of binding to the EBOV-GPcl, i.e., berbamine dihydrochloride, is obtained through structure-based virtual screening. Berbamine dihydrochloride can specifically inhibit the entry of an Ebola recombinant virus by binding to the target protein EBOV-GPcl, thereby achieving the effect of anti-Ebola virus infection. The half-maximum effect concentration (EC50) of berbamine dihydrochloride against EBOV is 0.49 ?M, which indicates that berbamine dihydrochloride has a strong inhibition effect on EBOV.Type: ApplicationFiled: April 10, 2023Publication date: October 12, 2023Inventors: Shan Cen, Quanjie Li, Dongrong Yi, Yi Shi, Han Wang, Jinming Zhou
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Publication number: 20230303589Abstract: Crystalline forms of salts of Compound I are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.Type: ApplicationFiled: August 12, 2021Publication date: September 28, 2023Inventors: Satish Kumar IYEMPERUMAL, Andrey PERESYPKIN, Yi SHI, Muna SHRESTHA
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Publication number: 20230271945Abstract: The disclosure provides at least one entity chosen from compounds of formula (I), solid state forms of the same, compositions comprising the same, and methods of using the same, including use in treating focal segmental glomerulosclerosis (FSGS) and/or non-diabetic kidney disease (NDKD).Type: ApplicationFiled: February 7, 2023Publication date: August 31, 2023Inventors: Jingrong CAO, Jon H. COME, Leslie A. DAKIN, Francois DENIS, Warren A. DORSCH, Anne FORTIER, Martine HAMEL, Elaine B. KRUEGER, Brian LEDFORD, Suganthini S. NANTHAKUMAR, Olivier NICOLAS, Camil SAYEGH, Timothy J. SENTER, Tiansheng WANG, Michael BRODNEY, Kan-Nian HU, Peter ROSE, Kevin GAGNON, Yi SHI, Muna SHRESTHA, Ales MEDEK, Faith WITKOS
