Patents by Inventor Yi Shi

Yi Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250042878
    Abstract: The disclosure provides at least one entity chosen from compounds of formula (I), solid state forms of the same, compositions comprising the same, and methods of using the same, including use in treating focal segmental glomerulosclerosis (FSGS) and/or non-diabetic kidney disease (NDKD).
    Type: Application
    Filed: June 17, 2024
    Publication date: February 6, 2025
    Inventors: Jingrong CAO, Jon H. COME, Leslie A. DAKIN, Francois DENIS, Warren A. DORSCH, Anne FORTIER, Martine HAMEL, Elaine B. KRUEGER, Brian LEDFORD, Suganthini S. NANTHAKUMAR, Olivier NICOLAS, Camil SAYEGH, Timothy J. SENTER, Tiansheng WANG, Michael BRODNEY, Kan-Nian HU, Peter ROSE, Kevin GAGNON, Yi SHI, Muna SHRESTHA, Ales MEDEK, Faith WITKOS
  • Publication number: 20250002563
    Abstract: Disclosed herein are coronavirus neutralizing antibodies and uses thereof for treating and/or preventing a coronavirus infection in a subject.
    Type: Application
    Filed: September 12, 2022
    Publication date: January 2, 2025
    Inventors: Yi SHI, Yufei XIANG
  • Publication number: 20240429199
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to self-align batch pick and place die bonding. Disclosed is an apparatus comprising a fluid dispensing assembly to dispense first amounts of water onto first hydrophilic regions of a first semiconductor wafer at a first point in time, the first hydrophilic regions having a first arrangement, and dispense second amounts of water onto second hydrophilic regions of a second semiconductor wafer at a second point in time, the second hydrophilic regions having a second arrangement, and a pick-and-place assembly to simultaneously position, at the first point in time, a first batch of dies corresponding to the first arrangement onto the first amounts of water dispensed on the first semiconductor wafer, and simultaneously position, at the second point in time, a second batch of dies corresponding to the second arrangement onto the second amounts of water dispensed on the second semiconductor wafer.
    Type: Application
    Filed: June 23, 2023
    Publication date: December 26, 2024
    Inventors: Yi Shi, Bhaskar Jyoti Krishnatreya, Feras Eid, Xavier Brun, Johanna Swan
  • Publication number: 20240394430
    Abstract: Disclosed are a method, an apparatus and a storage medium for measuring the quality of a built environment.
    Type: Application
    Filed: December 8, 2022
    Publication date: November 28, 2024
    Applicant: SOUTHEAST UNIVERSITY
    Inventors: Xiao HAN, Zhe LI, Liya WANG, Jie LI, Qixin ZHANG, Mingjing DONG, Shuang WU, Mingchen XU, Haini CHEN, Yi SHI, Qiaochu WANG, Mengyao YU
  • Patent number: 12125266
    Abstract: An anchor-free object detection method based on ultraviolet image includes: obtaining a ground-truth label of object detection, two label boxes corresponding to the two labels; obtaining a masked label based on the two labels and the two label boxes in the train set, and performing a same enhancement processing on the train set and the masked label; constructing an anchor-free object detection model including an encoding part, a decoding part and a detection head part including three detection heads, namely two anchor-free detection heads and one anchor-free dual-head detection head, and the dual-head of the anchor-free box dual-head detection head is an anchor-free detection head and an auxiliary detection head, respectively; training the model based on the enhanced train set and the enhanced masked label; and inputting the ultraviolet image data to be detected into the final anchor-free object detection model, to obtain an object detection result.
    Type: Grant
    Filed: July 12, 2024
    Date of Patent: October 22, 2024
    Assignees: State Grid Hubei Extra High Voltage Company, Hubei Superenergic Electric Power Co., Ltd.
    Inventors: Shenli Wang, Song Xie, Yong Du, Jiang Liu, Jun Wu, Yi Shi, Wei Zhao, Qian Wang
  • Publication number: 20240347501
    Abstract: Methods and apparatus for die shape modification bonding are disclosed. A disclosed apparatus to adjust a die for bonding to a target includes interface circuitry, machine-readable instructions, and at least one processor circuit to be programmed by the machine-readable instructions to determine a shape profile of the die, determine an adjustment of the shape profile with respect to the bonding of the die to the target, and cause at least one of (i) an actuator or (ii) a vacuum device of a placer that carries the die to adjust the shape profile based on the determined adjustment.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Inventors: Haris Khan Niazi, Yi Shi, Bhaskar Jyoti Krishnatreya, Xavier F. Brun
  • Publication number: 20240336614
    Abstract: The disclosure provides compounds useful for treating alpha-1 antitrypsin deficiency (AATD), according to formula (I): tautomers thereof, pharmaceutically acceptable salts of the compounds, pharmaceutically acceptable salts of the tautomers, deuterated derivatives of the compounds, deuterated derivatives of the tautomers, and deuterated derivatives of the salts, solid forms of those compounds and processes for making those compounds.
    Type: Application
    Filed: October 16, 2023
    Publication date: October 10, 2024
    Inventors: Upul Keerthi BANDARAGE, Cavan McKeon BLIGH, Diane BOUCHER, Michael John BOYD, Michael Aaron BRODNEY, Michael Philip CLARK, Veronique DAMAGNEZ, Lev Tyler Dewey FANNING, Robert Francis FIMOGNARI, Gabrielle Simone FLEMING, Kevin James GAGNON, Pedro Manuel GARCIA BARRANTES, Robert Daniel GIACOMETTI, Simon GIROUX, Ronald Lee GREY, JR., Samantha GUIDO, Amy Beth HALL, Sarah Carol HOOD, Dennis James HURLEY, Mac Arthur JOHNSON, JR., Peter Jones, Sarathy KESAVAN, Mei-Hsiu LAI, Siying LIU, Adam LOOKER, Brad MAXWELL, John Patrick MAXWELL, Ales MEDEK, Philippe Marcel NUHANT, Kirk Alan OVERHOFF, Setu RODAY, Stefanie ROEPER, Steven M. RONKIN, Rupa SAWANT, Yi SHI, Muna SHRESTHA, Marisa SPOSATO, Kathy STAVROPOULOS, Rebecca Jane SWETT, Timothy Lewis TAPLEY, Qing TANG, Stephen THOMSON, Jinwang XU, Mariam ZAKY, Kevin Michael COTTRELL
  • Publication number: 20240279838
    Abstract: Disclosed in an embodiment of the present invention is an electroplating device, comprising an electroplating tank, a clamp, a positioning cylinder and an anode, wherein the positioning cylinder is located in the electroplating tank; the positioning cylinder is open at one end; the anode is located inside the positioning cylinder, and the positioning cylinder comes in contact with the anode in a sealing manner; and in the entire surface region of the anode, only a first surface comes in contact with an electroplating solution, and the first surface is parallel and opposite to a substrate, with the center of the first surface being aligned with the center of the substrate, and the size of the first surface being similar to that of an effective electroplating region of the substrate.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 22, 2024
    Applicant: ACM RESEARCH (SHANGHAI), INC.
    Inventors: Hui Wang, Hongchao Yang, Jian Wang, Yinuo Jin, Yi Shi, Zheng Zhang
  • Publication number: 20240272207
    Abstract: Disclosed in the present application are an AC current sensor and a wireless charging chip. The AC current sensor includes an integrator circuit, a differentiator circuit, and a calibration circuit. The integrator circuit is configured to perform integration on a voltage on which filter processing is performed across an inductor in a TX coil. The differentiator circuit is configured to perform differentiation on a voltage on which filter processing is performed across a capacitor in the TX coil. The calibration circuit is configured to sample and compare output signals of the integrator circuit and the differentiator circuit, and adjust output results of the integrator circuit and the differentiator circuit until the output results are the same. In this case, the output result of the differentiator circuit may be used to calculation for a current flowing through the TX coil.
    Type: Application
    Filed: September 12, 2023
    Publication date: August 15, 2024
    Applicant: NANJING UNIVERSITY
    Inventors: Hao QIU, Xusheng ZHANG, Yi SHI
  • Patent number: 12060346
    Abstract: The disclosure provides at least one entity chosen from compounds of formula (I), solid state forms of the same, compositions comprising the same, and methods of using the same, including use in treating focal segmental glomerulosclerosis (FSGS) and/or non-diabetic kidney disease (NDKD).
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: August 13, 2024
    Assignee: Vertex Pharmaceuticals Incorporated
    Inventors: Jingrong Cao, Jon H. Come, Leslie A. Dakin, Francois Denis, Warren A. Dorsch, Anne Fortier, Martine Hamel, Elaine B. Krueger, Brian Ledford, Suganthini S. Nanthakumar, Olivier Nicolas, Camil Sayegh, Timothy J. Senter, Tiansheng Wang, Michael Brodney, Kan-Nian Hu, Peter Rose, Kevin Gagnon, Yi Shi, Muna Shrestha, Ales Medek, Faith Witkos
  • Publication number: 20240260885
    Abstract: A street greening quality detection method based on physiological activation recognition is provided.
    Type: Application
    Filed: April 4, 2023
    Publication date: August 8, 2024
    Applicant: SOUTHEAST UNIVERSITY
    Inventors: Zhe LI, Liya WANG, Xiao HAN, Jie LI, Qixin ZHANG, Mingjing DONG, Mingchen XU, Shuang WU, Yi SHI, Haini CHEN, Qiaochu WANG
  • Patent number: 12048549
    Abstract: A street greening quality detection method based on physiological activation recognition is provided.
    Type: Grant
    Filed: April 4, 2023
    Date of Patent: July 30, 2024
    Assignee: SOUTHEAST UNIVERSITY
    Inventors: Zhe Li, Liya Wang, Xiao Han, Jie Li, Qixin Zhang, Mingjing Dong, Mingchen Xu, Shuang Wu, Yi Shi, Haini Chen, Qiaochu Wang
  • Patent number: 12026760
    Abstract: A method for transacting a resource flow is provided. The method is applied to a blockchain server, and includes: acquiring initial transaction information for associating a requester client with a provider client, and sending the initial transaction information to other blockchain servers, to store the initial transaction information in respective corresponding blockchain database; acquiring certificate information indicative of a status of a resource flow usage of the requester client; and determining a first value indicative of a value added by the requester client to an account of the provider client based on the initial transaction information and the certificate information, and sending the first value to the other blockchain servers. An apparatus for transacting a resource flow, a computer equipment, and a computer-readable medium are further provided.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: July 2, 2024
    Assignee: Hefei Dappworks Technology Co., Ltd.
    Inventors: Yi Shi, Yang Zhang
  • Publication number: 20240158206
    Abstract: An elevator car door locking device and elevator equipment. The car door locking device includes a vane base provided with a first and a second rotation center; a vane assembly provided with a clamping vane or an expanding vane; and a vane drive assembly having a driving member, a transmission member, an unlocking member and a car door locking hook. The driving member, the transmission member and the vane assembly are hinged to the first rotation center, the car door locking hook is hinged to the second rotation center, the transmission member is hinged with the vane assembly through a connecting shaft, and the unlocking member is hinged to a third rotation center on the driving member and is provided with a limiting part for limiting the connecting shaft.
    Type: Application
    Filed: July 27, 2023
    Publication date: May 16, 2024
    Inventors: Chong Chen, Haiping Pan, Xiu Jian, Haiyun Qian, Qiguo Li, Zhijia Zheng, Yi Shi
  • Patent number: 11977537
    Abstract: A method of processing data for a blockchain, wherein a blockchain network has a bottom blockchain network and an upper blockchain network, the bottom blockchain network has a plurality of bottom blockchain nodes, the upper blockchain network has a plurality of upper blockchain nodes, and the method is applied to the upper blockchain nodes, and the method includes: transmitting block data in a current node belonging to an upper blockchain of the upper blockchain network to a bottom blockchain node, so that each bottom blockchain node stores the block data into a bottom blockchain of the bottom blockchain network by using a consensus verification. The present disclosure also proposes a device of processing data for a blockchain, a blockchain system, a computer device and a computer readable medium.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: May 7, 2024
    Assignee: HEFEI DAPPWORKS TECHNOLOGY CO., LTD.
    Inventors: Yan Zhang, Yi Shi
  • Publication number: 20240105821
    Abstract: A structure of a two-dimensional material-based device having an air-gap and a method for preparing same comprises a substrate, a gate, an dielectric, a two-dimensional material-based film, and source and drain electrodes; the air-gap is formed between the two-dimensional material-based film and the side wall of the dielectric on the gate, or the air-gap is formed between the dielectric and the gate; two-dimensional material-based devices of the above structure utilize the ductility and flexibility of two-dimensional materials to reduce the coupling between the gate and the source/drain electrodes, thereby reducing the parasitic capacitance and the circuit delay; also, the structure ensures that a part of the contact region of the source and drain electrodes with the two-dimensional material can be controlled by the gate, and can thus avoid the reduction in electrical properties and keep a low resistance of the device.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 28, 2024
    Applicant: NANJING UNIVERSITY
    Inventors: Xinran Wang, Dongxu Fan, Weisheng Li, Hao Qiu, Yi Shi
  • Publication number: 20240063066
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die having a surface; a template structure having a first surface and an opposing second surface, wherein the first surface of the template structure is coupled to the surface of the first die, and wherein the template structure includes a cavity at the first surface and a through-template opening extending from a top surface of the cavity to the second surface of the template structure; and a second die within the cavity of the template structure and electrically coupled to the surface of the first die by interconnects having a pitch of less than 10 microns between adjacent interconnects.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Omkar G. Karhade, Tomita Yoshihiro, Adel A. Elsherbini, Bhaskar Jyoti Krishnatreya, Tushar Talukdar, Haris Khan Niazi, Yi Shi, Batao Zhang, Wenhao Li, Feras Eid
  • Publication number: 20240063142
    Abstract: Multi-die packages including IC die crack mitigation features. Prior to the bonding of IC dies to a host substrate, the IC dies may be shaped, for example with a corner radius or chamfer. After bonding the shaped IC dies, a fill comprising at least one inorganic material may be deposited over the IC dies, for example to backfill a space between adjacent IC dies. With the benefit of a greater IC die sidewall slope and/or smoother surface topology associated with the shaping process, occurrences of stress cracking within the fill and concomitant damage to the IC dies may be reduced. Prior to depositing a fill, a barrier layer may be deposited over the IC die to prevent cracks that might form in the fill material from propagating into the IC die.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Adel Elsherbini, Wenhao Li, Bhaskar Jyoti Krishnatreya, Tushar Talukdar, Botao Zhang, Yi Shi, Haris Khan Niazi, Feras Eid, Nagatoshi Tsunoda, Xavier Brun, Mohammad Enamul Kabir, Omkar Karhade, Shawna Liff, Jiraporn Seangatith
  • Publication number: 20240063136
    Abstract: An integrated circuit (IC) device comprises an array comprising rows and columns of conductive interconnect pads. At least one optical alignment fiducial region is distinct from the array and comprises a fiducial pattern, wherein the fiducial pattern comprises a first group of pads contiguous to a second group of pads, and wherein a width of a space between nearest pads of the first and second groups is wider than the spaces between pads within each group.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Haris Khan Niazi, Yi Shi, Adel Elsherbini, Xavier Brun, Georgios Dogiamis, Thomas Brown, Omkar Karhade
  • Patent number: D1049246
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: October 29, 2024
    Assignee: Neutron Holdings, Inc.
    Inventors: Jonathan Oxford, Kyler Steele, Meng Zheng, Yueqian Jia, Suraj Shroff, Yi Shi