Patents by Inventor Yi Shi

Yi Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240063178
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die and a through-dielectric via (TDV) surrounded by a dielectric material in a first layer, where the TDV has a greater width at a first surface and a smaller width at an opposing second surface of the first layer; a second die, surrounded by the dielectric material, in a second layer on the first layer, where the first die is coupled to the second die by interconnects having a pitch of less than 10 microns, and the dielectric material around the second die has an interface seam extending from a second surface of the second layer towards an opposing first surface of the second layer with an angle of less than 90 degrees relative to the second surface; and a substrate on and coupled to the second layer.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Intel Corporation
    Inventors: Jimin Yao, Adel A. Elsherbini, Xavier Francois Brun, Kimin Jun, Shawna M. Liff, Johanna M. Swan, Yi Shi, Tushar Talukdar, Feras Eid, Mohammad Enamul Kabir, Omkar G. Karhade, Bhaskar Jyoti Krishnatreya
  • Publication number: 20240043505
    Abstract: Disclosed herein are coronavirus neutralizing antibodies and uses thereof for treating and preventing a coronavirus infection in a subject.
    Type: Application
    Filed: August 19, 2021
    Publication date: February 8, 2024
    Inventors: Yi SHI, I, Yufei XIANG
  • Patent number: 11884672
    Abstract: The disclosure provides compounds useful for treating alpha-1 antitrypsin deficiency (AATD), according to formula (I): tautomers thereof, pharmaceutically acceptable salts of the compounds, pharmaceutically acceptable salts of the tautomers, deuterated derivatives of the compounds, deuterated derivatives of the tautomers, and deuterated derivatives of the salts, solid forms of those compounds and processes for making those compounds.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: January 30, 2024
    Assignee: Vertex Pharmaceuticals Incorporated
    Inventors: Upul Keerthi Bandarage, Cavan McKeon Bligh, Diane Boucher, Michael John Boyd, Michael Aaron Brodney, Michael Philip Clark, Veronique Damagnez, Lev Tyler Dewey Fanning, Robert Francis Fimognari, Gabrielle Simone Fleming, Kevin James Gagnon, Pedro Manuel Garcia Barrantes, Robert Daniel Giacometti, Simon Giroux, Ronald Lee Grey, Jr., Samantha Guido, Amy Beth Hall, Sarah Carol Hood, Dennis James Hurley, Mac Arthur Johnson, Jr., Peter Jones, Sarathy Kesavan, Mei-Hsiu Lai, Siying Liu, Adam Looker, Brad Maxwell, John Patrick Maxwell, Ales Medek, Philippe Marcel Nuhant, Kirk Alan Overhoff, Setu Roday, Stefanie Roeper, Steven M. Ronkin, Rupa Sawant, Yi Shi, Muna Shrestha, Marisa Sposato, Kathy Stavropoulos, Rebecca Jane Swett, Timothy Lewis Tapley, Qing Tang, Stephen Thomson, Jinwang Xu, Mariam Zaky, Kevin Michael Cottrell
  • Patent number: 11873300
    Abstract: Crystalline forms of Compound I: pharmaceutically acceptable salts thereof, and solvates and hydrates thereof are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: January 16, 2024
    Assignee: Vertex Pharmaceuticals Incorporated
    Inventors: Yi Shi, Kevin J. Gagnon, Jicong Li, Jennifer Lu, Ales Medek, Muna Shrestha, Michael Waldo, Beili Zhang, Carl L. Zwicker, Corey Don Anderson, Jeremy J. Clemens, Thomas Cleveland, Timothy Richard Coon, Bryan Frieman, Peter Grootenhuis, Sara Sabina Hadida Ruah, Jason McCartney, Mark Thomas Miller, Prasuna Paraselli, Fabrice Pierre, Sara E. Swift, Jinglan Zhou
  • Publication number: 20240006358
    Abstract: Bonding pedestals on substrates, and their manufacture, for direct bonding integrated circuit (IC) dies onto substrates. The electrical interconnections of one or more IC dies and a substrate are bonded together with the IC dies on and overhanging the pedestals. A bonding pedestal may be formed by etching down the substrate around the interconnections. A system may include one or more such pedestals above and adjacent a recessed surface on a substrate with IC dies overhanging the pedestals. Such a system may be coupled to a host component, such as a board, and a power supply via the host component.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Applicant: Intel Corporation
    Inventors: Zhihua Zou, Omkar Karhade, Botao Zhang, Julia Chiu, Vivek Chidambaram, Yi Shi, Mohit Bhatia, Mostafa Aghazadeh
  • Publication number: 20240002386
    Abstract: Solid forms of 4-(5-(4-fluorophenyl)-6-(tetrahydro-2H-pyran-4-yl)-1,5-dihydropyrrolo[2,3-f]indazol-7-yl)benzoic acid (Compound 1) capable of modulating alpha-1 antitrypsin (AAT) activity and methods of treating alpha-1 antitrypsin deficiency (AATD) by administering one or more such forms, and methods of using and preparing the same for treatment of alpha-1 antitrypsin deficiency (AATD).
    Type: Application
    Filed: November 17, 2021
    Publication date: January 4, 2024
    Inventors: Yi SHI, Mei-Hsiu LAI, Ales MEDEK, Kan-Nian HU, Zhengtian SONG, Elisa A. TORRICO GUZMAN, Kathleen Paige SOKOLOWSKY, Simon GIROUX, Siying LIU, Kirk Alan OVERHOFF, Setu RODAY, Rupa SAWANT, Marisa SPOSATO
  • Publication number: 20240006332
    Abstract: An integrated circuit (IC) device comprises a host component and an IC die directly bonded to the host component. The IC die comprises a substrate material layer and a die metallization level between the substrate material layer and host component. The IC die includes an upper die alignment fiducial between the die metallization level and host component. The upper die alignment fiducial at least partially overlaps one or more metallization features within the die metallization level. In embodiments, at least two orthogonal edges of the upper die alignment fiducial do not overlap any of the metallization features within the die metallization level. In embodiments, the IC die includes a lower die alignment fiducial between the substrate material layer and the die metallization level. The lower die alignment fiducial may at least partially overlap one or more second metallization features within a second die metallization level of the IC die.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 4, 2024
    Applicant: Intel Corporation
    Inventors: Dimitrios Antartis, Nitin A. Deshpande, Siyan Dong, Omkar Karhade, Gwang-soo Kim, Shawna Liff, Siddhartha Mal, Debendra Mallik, Khant Minn, Haris Khan Niazi, Arnab Sarkar, Yi Shi, Botao Zhang
  • Publication number: 20230357191
    Abstract: Compounds of Formula (I): pharmaceutically acceptable salts thereof, deuterated derivatives of any of the foregoing, and metabolites of any of the foregoing are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed. Also disclosed are solid state forms of Compound 1 and salts and solvates thereof.
    Type: Application
    Filed: August 4, 2022
    Publication date: November 9, 2023
    Inventors: Alexander Russell Abela, Timothy Alcacio, Corey Anderson, Paul Timothy Angell, Minson Baek, Jeremy J. Clemens, Thomas Cleveland, Lori Ann Ferris, Peter Diederik Jan Grootenhuis, Raymond Stanley Gross, Anton V. Gulevich, Sara Sabina Hadida Ruah, Clara Kuang-Ju Hsia, Robert M. Hughes, Pramod Virupax Joshi, Ping Kang, Ali Keshavarz-Shokri, Haripada Khatuya, Paul John Krenitsky, Jason McCartney, Mark Thomas Miller, Prasuna Paraselli, Fabrice Jean Denis Pierre, Yi Shi, Muna Shrestha, David Andrew Siesel, Kathy Stavropoulos, Andreas P. Termin, Fredrick F. Van Goor, Johnny Uy, Timothy John Young, Jinglan Zhou
  • Patent number: 11799630
    Abstract: A method for blockchain nodes, the method including: sending security data of an Internet of Things system to other blockchain nodes, so that each blockchain node stores the security data in a blockchain database for that blockchain node; and obtaining one or more pieces of security data of the Internet of Things system from a blockchain database for a current blockchain node, and performing a corresponding operation on the Internet of Things system based on the obtained security data. There is also provided a device, a computer system and a computer readable medium for blockchain nodes.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: October 24, 2023
    Assignee: HEFEI DAPPWORKS TECHNOLOGY CO., LTD.
    Inventors: Yan Zhang, Yi Shi
  • Publication number: 20230321079
    Abstract: The present invention provides use of berbamine dihydrochloride in preparation of an Ebola virus inhibitor. In the present invention, the primed glycoprotein of the Ebola virus (EBOV-GPcl) is taken as a target site, and an antiviral active compound with the capability of binding to the EBOV-GPcl, i.e., berbamine dihydrochloride, is obtained through structure-based virtual screening. Berbamine dihydrochloride can specifically inhibit the entry of an Ebola recombinant virus by binding to the target protein EBOV-GPcl, thereby achieving the effect of anti-Ebola virus infection. The half-maximum effect concentration (EC50) of berbamine dihydrochloride against EBOV is 0.49 ?M, which indicates that berbamine dihydrochloride has a strong inhibition effect on EBOV.
    Type: Application
    Filed: April 10, 2023
    Publication date: October 12, 2023
    Inventors: Shan Cen, Quanjie Li, Dongrong Yi, Yi Shi, Han Wang, Jinming Zhou
  • Publication number: 20230303589
    Abstract: Crystalline forms of salts of Compound I are disclosed. Pharmaceutical compositions comprising the same, methods of treating cystic fibrosis using the same, and methods for making the same are also disclosed.
    Type: Application
    Filed: August 12, 2021
    Publication date: September 28, 2023
    Inventors: Satish Kumar IYEMPERUMAL, Andrey PERESYPKIN, Yi SHI, Muna SHRESTHA
  • Publication number: 20230271945
    Abstract: The disclosure provides at least one entity chosen from compounds of formula (I), solid state forms of the same, compositions comprising the same, and methods of using the same, including use in treating focal segmental glomerulosclerosis (FSGS) and/or non-diabetic kidney disease (NDKD).
    Type: Application
    Filed: February 7, 2023
    Publication date: August 31, 2023
    Inventors: Jingrong CAO, Jon H. COME, Leslie A. DAKIN, Francois DENIS, Warren A. DORSCH, Anne FORTIER, Martine HAMEL, Elaine B. KRUEGER, Brian LEDFORD, Suganthini S. NANTHAKUMAR, Olivier NICOLAS, Camil SAYEGH, Timothy J. SENTER, Tiansheng WANG, Michael BRODNEY, Kan-Nian HU, Peter ROSE, Kevin GAGNON, Yi SHI, Muna SHRESTHA, Ales MEDEK, Faith WITKOS
  • Publication number: 20230265080
    Abstract: Novel compounds, compositions, and methods of using and preparing the same, which may be useful for treating alpha-1 antitrypsin deficiency (AATD).
    Type: Application
    Filed: February 9, 2023
    Publication date: August 24, 2023
    Inventors: Upul Keerthi BANDARAGE, Cavan McKeon BLIGH, Michael John BOYD, Diane M. BOUCHER, Michael Aaron BRODNEY, Veronique DAMAGNEZ, Lev Tyler DEWEY FANNING, Mary Elizabeth ECCLES, Robert Francis FIMOGNARI, JR., Kevin James GAGNON, Pedro M. GARCIA BARRANTES, Simon GIROUX, Ronald Lee GREY, JR., Amy Beth HALL, Sarah Carol HOOD, Dennis James HURLEY, Joshua Kennedy HUSSEY, Mac Arthur JOHNSON, JR., Peter JONES, Sarathy KESAVAN, Adam LOOKER, Brad D. MAXWELL, John Patrick MAXWELL, Ales MEDEK, Mettachit NAVAMAL, Philippe Marcel NUHANT, Setu RODAY, Stefanie ROEPER, Rupa SAWANT, Yi SHI, Rebecca Jane SWETT, Qing TANG, Timothy Lewis TAPLEY, Stephen A. THOMSON, Michael WALDO, Jinwang XU, Kevin Michael COTTRELL
  • Publication number: 20230255547
    Abstract: A method determining a scalp type of a user is provided. A value indicative of a humidity level of a region of the scalp of the user and a value indicative of a sebum level in the region of the scalp of the user are obtained. The set comprising both values is compared to reference groups of scalp hydration and sebum levels, the reference groups forming at least five scalp types. Each scalp type is associated with a humidity level range and a sebum level range, and with a corresponding category of skin and/or hair care compositions and/or skin and/or hair care treatments compatible with said humidity level range and sebum level range. Based on the comparison, the scalp type of the user is identified and then outputted.
    Type: Application
    Filed: June 30, 2020
    Publication date: August 17, 2023
    Applicant: Henkel AG & Co. KGaA
    Inventors: Yi SHI, Xiaowei CHANG
  • Publication number: 20230250087
    Abstract: The disclosure provides novel solid state forms of Compound I selected from ethanol solvate Form A, ethanol solvate Form B, citric acid cocrystal Form A, and Form B, compositions comprising the same, and methods of making and using the same, including use in treating APOL1 mediated kidney disease. (I).
    Type: Application
    Filed: June 11, 2021
    Publication date: August 10, 2023
    Inventors: Kevin James GAGNON, Jicong LI, Ales MEDEK, Jack Raphael MINCHOM, Yi SHI, Muna SHRESTHA, Faith WITKOS
  • Patent number: 11705943
    Abstract: A network control and rate optimization solution for multiuser multiple input multiple output (MU-MIMO) communications in wireless networks. This solution is decentralized and includes scheduling and routing of the MU-MIMO communication links that adapt to dynamic channel, interference, and traffic conditions. The ergodic sum rates of MIMO multiple access channel (MAC) and interference channel (IC) configurations are analyzed by considering the error, and overhead effects due to channel estimation (training) and quantization (feedback). By taking practical considerations such as channel estimation, quantization error and in-network interference into account, the rate gain is shown with an increasing number of antennas compared with single-input single-output (SISO) systems. A distributed channel access protocol to select and activate MU-MIMO configurations is presented with the maximum achievable sum rates using local information on channel, interference, and traffic conditions.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: July 18, 2023
    Assignee: INTELLIGENT AUTOMATION, LLC
    Inventors: Yalin Evren Sagduyu, Tugba Erpek, Yi Shi, Satya Ponnaluri
  • Publication number: 20230212270
    Abstract: Disclosed herein are compositions and methods for increasing the stability of recombinant nanobodies. Also disclosed herein are recombinant nanobodies comprising an IL-2 polypeptide that bind serum albumin and uses thereof for treating cancers.
    Type: Application
    Filed: March 5, 2021
    Publication date: July 6, 2023
    Inventors: Yi SHI, Zhuolun SHEN
  • Patent number: 11688826
    Abstract: A light emitting device, a method of fabricating a light emitting device and a method of controlling light emission. The light emitting device includes a plasmonic structure. The plasmonic structure is configured to have a plurality of localized surface plasmon resonances. The light emitting device also includes a broadband light emitting layer having an emission spectrum substantially overlapping wavelengths of the localized surface plasmon resonances. A spacer layer is disposed between the plasmonic structure and the broadband light emitting layer. A color of light emitted by the broadband light emitting layer is tunable by the localized surface plasmon resonances of the plasmonic structure.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 27, 2023
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Ee Jin Teo, Yi Shi, Chengyuan Yang, Qing Yang Steve Wu, Yin Thai Chan, Yang Xu, Chi Jin Darren Neo
  • Publication number: 20230192964
    Abstract: Disclosed herein are daisy chain polymers and methods of making daisy chain polymers under redox control employing an energy ratchet mechanism using a molecular-pump-containing monomer comprising a recognition site and a Coulombic barrier.
    Type: Application
    Filed: May 24, 2021
    Publication date: June 22, 2023
    Inventors: James Fraser Stoddart, Kang Cai, Yi Shi
  • Publication number: 20230197520
    Abstract: Embodiments herein relate to systems, apparatuses, or processes for attaching dummy dies to a wafer that includes a plurality of active dies, where the dummy dies are placed along or in dicing streets where the wafer is to be cut during singulation. In embodiments, the dummy dies may be attached to the wafer using a die attach film, or may be attached using hybrid bonding. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Inventors: Yi SHI, Omkar KARHADE, Shawna M. LIFF, Zhihua ZOU, Ryan MACKIEWICZ, Nitin A. DESHPANDE, Debendra MALLIK, Arnab SARKAR