Patents by Inventor Yi Xia

Yi Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230422389
    Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.
    Type: Application
    Filed: June 29, 2023
    Publication date: December 28, 2023
    Inventors: Prabhakar Subrahmanyam, Tejas J. Shah, Yi Xia, Ying-Feng Pang, Mark Lawrence Bianco, Vishnu Prasadh Sugumar, Vikas Kundapura Rao, Srinivasa Rao Damaraju, Ridvan Amir Sahan, Emad Shehadeh Al-Momani, Rahima Khatun Mohammed, Mirui Wang, Devdatta Prakash Kulkarni
  • Publication number: 20230420338
    Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.
    Type: Application
    Filed: March 6, 2021
    Publication date: December 28, 2023
    Inventors: Prabhakar SUBRAHMANYAM, Tong Wa CHAO, Ying-Feng PANG, Yi XIA, Rahima K. MOHAMMED, Victor P. POLYANKO, Ridvan A. SAHAN, Guangying ZHANG, Guoliang YING, Chuanlou WANG, Jun LU, Liguang DU, Peng WEI, Xiang QUE
  • Publication number: 20230271770
    Abstract: The present disclosure generally pertains to a medical device and more particularly, a metered-dose inhaler (“MDI”) actuator capable of a targeted delivery of fine API particles having particle diameters of about 1.1 ?m or less to a portion of a patient's lungs where alveoli are located.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 31, 2023
    Inventors: Jack Yongfeng Zhang, Mary Zi-ping Luo, Ying Wang, Yi Xia, Jie Fei Ding, Selina Su, Qingxia Han
  • Publication number: 20230205760
    Abstract: Techniques are disclosed relating to implementing multiple index scans. A computer system may store a database table comprising fields and indexes corresponding to those fields. The computer system may receive a request to access records based on a Boolean expression that affects a selection of records from the database table and that comprises clauses, at least two of which are joined by an AND operation. The computer system may access the requested records. The accessing may include, for a given one of the at least two clauses, performing an index scan on an index that corresponds to the given clause to identify records that satisfy that clause. The computer system may update a hash table based on the identified records and then identify the requested records based on the hash table. The Boolean expression may include clauses joined by an OR operation that are processed using multiple index scans.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 29, 2023
    Inventors: Colm McHugh, Rama K. Korlapati, Yi Xia
  • Publication number: 20230169216
    Abstract: A data integrity protection method is applied to an electronic device, and the electronic device stores vendor data and first verification information. The first verification information is stored in a first storage area of the electronic device and is used to perform integrity verification on the vendor data. The method includes: First data is obtained. Digital signature is performed on the first data to generate second data and second verification information. The second data and the second verification information are stored, where the second verification information is stored in a second storage area of the electronic device. According to the data integrity protection method provided in this embodiment of this application, firmware or software customized by a third-party integrator is supported in being reloaded to a system for running, thereby simplifying a process and improving integrated development efficiency of an electronic device.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 1, 2023
    Inventors: Xuehong Zeng, Yi Xia, Heng Cai, Yongjin Cai
  • Publication number: 20230135823
    Abstract: Techniques are disclosed that relate to manipulating a chain of database objects without locking the chain. A computer system may maintain a chain that orders a set of database objects stored in a cache of the computer system. The computer system may receive a set of requests to perform database transactions. Based on those received set of requests, the computer system may determine to perform a plurality of chain operations that involve modifying the chain. The computer system may perform two or more of the plurality of chain operations at least partially in parallel using a set of atomic operations without acquiring a lock on the chain.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 4, 2023
    Inventors: Rui Zhang, Prateek Swamy, Yi Xia, Punit B. Shah, Rama K. Korlapati
  • Patent number: 11634958
    Abstract: A downhole tool having a mandrel, and a bottom slip disposed around the mandrel. The bottom slip includes a circular body having a one-piece configuration characterized by a plurality of slip segments by at least partial material connectivity therearound. The bottom slip is made of a filament wound composite material, which means the bottom slip has a plurality of layers joined by respective interface layers. An outer slip surface of at least one of the plurality of slip segments is defined in cross-section by a plane P that intersects a longitudinal axis of the downhole tool at an angle a1 when the bottom slip is in an unset position.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: April 25, 2023
    Assignee: The WellBoss Company, LLC
    Inventors: Evan Lloyd Davies, Yi Xia, Luis Miguel Avila, David Hughes, Gabriel Slup, Ashton E. Diaz
  • Patent number: 11571676
    Abstract: The present disclosure provides an opening-closing type microwave catalytic reaction apparatus, including a microwave system, a microwave cavity, a protective cover, a cooling system, and a vertical furnace tube, where two ends of the furnace tube are respectively stretched out of the microwave cavity, the microwave system includes a plurality of microwave transmitting units, and the microwave transmitting unit includes a microwave transmitter; the furnace tube is provided with a gas inlet on a top and a gas outlet on a bottom; a compression hinge and a cavity cover capable of being opened or closed are arranged on the microwave cavity, a convex edge plate is disposed at an edge of the cavity cover, the compression hinge can compress the cavity cover such that the convex edge plate is tightly attached to a concave edge plate on the microwave cavity, and the protective cover can cover the entire cavity cover.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: February 7, 2023
    Assignee: KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Lei Xu, Libo Zhang, Hang Li, Zhaohui Han, Jianhua Liu, Junwen Zhou, Hongying Xia, Xiangxian Liu, Yi Xia, Xinpei Li
  • Publication number: 20230025369
    Abstract: Methods and apparatus for an autonomous stage-switching multi-stage cooling device are disclosed are disclosed. A disclosed example coolant distribution unit (CDU) includes an enclosure, an inlet and an outlet of the CDU to be fluidly coupled to a cooling block associated with a heat generating source, at least one sensor to measure a first temperature corresponding to the inlet and a second temperature corresponding to the outlet, and a plurality of valves to be controlled by a controller to control a flow of fluid from the inlet to at least one of an ambient cooler or a sub-ambient cooler based on: (i) a comparison of the first temperature to an ambient temperature and (ii) a comparison of the second temperature to a target temperature.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 26, 2023
    Inventors: Prabhakar Subrahmanyam, Tong Chao, Yi Xia, Ying-Feng Pang, Victor Polyanko, Arunima Panigrahy, Mark Bianco
  • Patent number: 11468061
    Abstract: Techniques for improving complex database queries are provided. A determination is made whether to adopt a static or dynamic query execution plan for a received database query based on metrics. When a dynamic query execution plan is adopted, the database query is separated into query fragments. A plan fragment is generated for each query fragment and executed to generate feedback for the plan fragment. The feedback from the execution of each plan fragment is used to initiate query rewrite rules to simplify the corresponding query fragments. The rewritten query fragments are combined to generate the dynamic query plan.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 11, 2022
    Assignee: Teradata US, Inc.
    Inventors: Bin Cao, Yi Xia, Sanjib Mishra, Rama Krishna Korlapati, Tri Minh Tran, Mohammed Al-Kateb, Paul Laurence Sinclair, Chengyang Zhang
  • Publication number: 20220314190
    Abstract: The present disclosure provides an opening-closing type microwave catalytic reaction apparatus, including a microwave system, a microwave cavity, a protective cover, a cooling system, and a vertical furnace tube, where two ends of the furnace tube are respectively stretched out of the microwave cavity, the microwave system includes a plurality of microwave transmitting units, and the microwave transmitting unit includes a microwave transmitter; the furnace tube is provided with a gas inlet on a top and a gas outlet on a bottom; a compression hinge and a cavity cover capable of being opened or closed are arranged on the microwave cavity, a convex edge plate is disposed at an edge of the cavity cover, the compression hinge can compress the cavity cover such that the convex edge plate is tightly attached to a concave edge plate on the microwave cavity, and the protective cover can cover the entire cavity cover.
    Type: Application
    Filed: October 1, 2021
    Publication date: October 6, 2022
    Inventors: Lei XU, Libo ZHANG, Hang LI, Zhaohui HAN, Jianhua LIU, Junwen ZHOU, Hongying XIA, Xiangxian LIU, Yi XIA, Xinpei LI
  • Patent number: 11445580
    Abstract: The present invention provides a microwave-based high-throughput material processing device with a concentric rotary chassis. The device includes a microwave source generator, a microwave reaction chamber, and a temperature acquisition device. The microwave reaction chamber is provided with a rotary table, a thermal insulation barrel and a crucible die. The thermal insulation barrel is disposed on the rotary table, and the crucible die is disposed in the thermal insulation barrel. The crucible die is provided with a plurality of first grooves, and the first grooves are evenly distributed on a first circumference. A plurality of first fixing holes are disposed on a top of the thermal insulation barrel, and the first fixing holes are disposed corresponding to the first grooves. A first acquisition hole is disposed on the top of the microwave reaction chamber, and the first acquisition hole is located right above the first circumference.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: September 13, 2022
    Assignee: KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Lei Xu, Jinhui Peng, Shenghui Guo, Libo Zhang, Zhaohui Han, Yi Xia, Shaohua Ju, Shanju Zheng, Shiwei Li, Zemin Wang, Zhang Xu
  • Publication number: 20220225542
    Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Tong Wa CHAO, Mark BIANCO, Yanbing SUN, Ming ZHANG, Guixiang TAN, Devdatta P. KULKARNI, Guocheng ZHANG, Hao ZHOU
  • Publication number: 20220196507
    Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Victor POLYANKO, Mark BIANCO, Bijoyraj SAHU, Minh T.D. LE, Carlos ALVIZO FLORES, Javier AVALOS GARCIA, Adriana LOPEZ INIGUEZ, Luz Karine SANDOVAL GRANADOS, Michael BERKTOLD, Damion SEARLS, Jin YANG, David SHIA, Samer MELHEM, Jeffrey Ryan CONNER, Hemant DESAI, John RAATZ, Richard DISCHLER, Bergen ANDERSON, Eric W. BUDDRIUS, Kenan ARIK, Barrett M. FANEUF, Lianchang DU, Yuehong FAN, Shengzhen ZHANG, Yuyang XIA, Jun ZHANG, Yuan Li, Catharina BIBER, Kristin L. WELDON, Brendan T. PAVELEK
  • Publication number: 20220117112
    Abstract: Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 14, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Ying-Feng PANG, Yi XIA, Muhammad AHMAD
  • Publication number: 20220077023
    Abstract: An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.
    Type: Application
    Filed: November 12, 2021
    Publication date: March 10, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Ridvan A. SAHAN
  • Publication number: 20210317717
    Abstract: A downhole tool having a mandrel, and a bottom slip disposed around the mandrel. The bottom slip includes a circular body having a one-piece configuration characterized by a plurality of slip segments by at least partial material connectivity therearound. The bottom slip is made of a filament wound composite material, which means the bottom slip has a plurality of layers joined by respective interface layers. An outer slip surface of at least one of the plurality of slip segments is defined in cross-section by a plane P that intersects a longitudinal axis of the downhole tool at an angle a1 when the bottom slip is in an unset position.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 14, 2021
    Inventors: Evan Lloyd Davies, Yi Xia, Luis Miguel Avila, David Hughes, Gabriel Slup, Ashton E. Diaz
  • Publication number: 20210289659
    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
    Type: Application
    Filed: April 27, 2020
    Publication date: September 16, 2021
    Applicant: Intel Corporation
    Inventors: Prabhakar SUBRAHMANYAM, Casey WINKEL, Yingqiong BU, Ming ZHANG, Yuehong FAN, Yi XIA, Ying-Feng PANG
  • Publication number: 20210261574
    Abstract: Compounds, pharmaceutical formulations, and methods of treating bacterial infections are disclosed.
    Type: Application
    Filed: February 12, 2021
    Publication date: August 26, 2021
    Applicant: Bill & Melinda Gates Foundation
    Inventors: Xianfeng LI, Christopher S. LUNDE, Robert T. JACOBS, Vincent S. HERNANDEZ, Yi XIA, Jacob J. PLATTNER, Kathy Jingyuan CAO, Yong-Kang ZHANG, Matthew PERRY
  • Patent number: 11086870
    Abstract: A data store system includes an array of persistent storage devices configured to store a plurality of data store tables. The data store system includes a processor in communication with the storage device. The processor may receive a query comprising an aggregate function and identify structure of an argument of the aggregate function. The subset of data store tables may be associated with the argument. The processor may partially-execute the aggregate function on each data store table in the subset involved in the argument of the aggregate function to create partially-executed results for each data store table of the subset of data store tables. The processor may join the partially-executed results based on join conditions contained in the aggregate function. The processor may complete execution of the aggregate function on the partially-executed results to generate a final result of the aggregate function. A method and computer-readable medium are also disclosed.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: August 10, 2021
    Assignee: Teradata US, Inc.
    Inventors: Anantha B. Subramanian, Sanjay Nair, Yi Xia, Grace Kwan-On Au, Kuorong Chiang