Patents by Inventor Yi Xia
Yi Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230135823Abstract: Techniques are disclosed that relate to manipulating a chain of database objects without locking the chain. A computer system may maintain a chain that orders a set of database objects stored in a cache of the computer system. The computer system may receive a set of requests to perform database transactions. Based on those received set of requests, the computer system may determine to perform a plurality of chain operations that involve modifying the chain. The computer system may perform two or more of the plurality of chain operations at least partially in parallel using a set of atomic operations without acquiring a lock on the chain.Type: ApplicationFiled: October 29, 2021Publication date: May 4, 2023Inventors: Rui Zhang, Prateek Swamy, Yi Xia, Punit B. Shah, Rama K. Korlapati
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Patent number: 11634958Abstract: A downhole tool having a mandrel, and a bottom slip disposed around the mandrel. The bottom slip includes a circular body having a one-piece configuration characterized by a plurality of slip segments by at least partial material connectivity therearound. The bottom slip is made of a filament wound composite material, which means the bottom slip has a plurality of layers joined by respective interface layers. An outer slip surface of at least one of the plurality of slip segments is defined in cross-section by a plane P that intersects a longitudinal axis of the downhole tool at an angle a1 when the bottom slip is in an unset position.Type: GrantFiled: June 24, 2021Date of Patent: April 25, 2023Assignee: The WellBoss Company, LLCInventors: Evan Lloyd Davies, Yi Xia, Luis Miguel Avila, David Hughes, Gabriel Slup, Ashton E. Diaz
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Patent number: 11571676Abstract: The present disclosure provides an opening-closing type microwave catalytic reaction apparatus, including a microwave system, a microwave cavity, a protective cover, a cooling system, and a vertical furnace tube, where two ends of the furnace tube are respectively stretched out of the microwave cavity, the microwave system includes a plurality of microwave transmitting units, and the microwave transmitting unit includes a microwave transmitter; the furnace tube is provided with a gas inlet on a top and a gas outlet on a bottom; a compression hinge and a cavity cover capable of being opened or closed are arranged on the microwave cavity, a convex edge plate is disposed at an edge of the cavity cover, the compression hinge can compress the cavity cover such that the convex edge plate is tightly attached to a concave edge plate on the microwave cavity, and the protective cover can cover the entire cavity cover.Type: GrantFiled: October 1, 2021Date of Patent: February 7, 2023Assignee: KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Lei Xu, Libo Zhang, Hang Li, Zhaohui Han, Jianhua Liu, Junwen Zhou, Hongying Xia, Xiangxian Liu, Yi Xia, Xinpei Li
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Publication number: 20230025369Abstract: Methods and apparatus for an autonomous stage-switching multi-stage cooling device are disclosed are disclosed. A disclosed example coolant distribution unit (CDU) includes an enclosure, an inlet and an outlet of the CDU to be fluidly coupled to a cooling block associated with a heat generating source, at least one sensor to measure a first temperature corresponding to the inlet and a second temperature corresponding to the outlet, and a plurality of valves to be controlled by a controller to control a flow of fluid from the inlet to at least one of an ambient cooler or a sub-ambient cooler based on: (i) a comparison of the first temperature to an ambient temperature and (ii) a comparison of the second temperature to a target temperature.Type: ApplicationFiled: September 29, 2022Publication date: January 26, 2023Inventors: Prabhakar Subrahmanyam, Tong Chao, Yi Xia, Ying-Feng Pang, Victor Polyanko, Arunima Panigrahy, Mark Bianco
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Patent number: 11468061Abstract: Techniques for improving complex database queries are provided. A determination is made whether to adopt a static or dynamic query execution plan for a received database query based on metrics. When a dynamic query execution plan is adopted, the database query is separated into query fragments. A plan fragment is generated for each query fragment and executed to generate feedback for the plan fragment. The feedback from the execution of each plan fragment is used to initiate query rewrite rules to simplify the corresponding query fragments. The rewritten query fragments are combined to generate the dynamic query plan.Type: GrantFiled: December 12, 2018Date of Patent: October 11, 2022Assignee: Teradata US, Inc.Inventors: Bin Cao, Yi Xia, Sanjib Mishra, Rama Krishna Korlapati, Tri Minh Tran, Mohammed Al-Kateb, Paul Laurence Sinclair, Chengyang Zhang
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Publication number: 20220314190Abstract: The present disclosure provides an opening-closing type microwave catalytic reaction apparatus, including a microwave system, a microwave cavity, a protective cover, a cooling system, and a vertical furnace tube, where two ends of the furnace tube are respectively stretched out of the microwave cavity, the microwave system includes a plurality of microwave transmitting units, and the microwave transmitting unit includes a microwave transmitter; the furnace tube is provided with a gas inlet on a top and a gas outlet on a bottom; a compression hinge and a cavity cover capable of being opened or closed are arranged on the microwave cavity, a convex edge plate is disposed at an edge of the cavity cover, the compression hinge can compress the cavity cover such that the convex edge plate is tightly attached to a concave edge plate on the microwave cavity, and the protective cover can cover the entire cavity cover.Type: ApplicationFiled: October 1, 2021Publication date: October 6, 2022Inventors: Lei XU, Libo ZHANG, Hang LI, Zhaohui HAN, Jianhua LIU, Junwen ZHOU, Hongying XIA, Xiangxian LIU, Yi XIA, Xinpei LI
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Patent number: 11445580Abstract: The present invention provides a microwave-based high-throughput material processing device with a concentric rotary chassis. The device includes a microwave source generator, a microwave reaction chamber, and a temperature acquisition device. The microwave reaction chamber is provided with a rotary table, a thermal insulation barrel and a crucible die. The thermal insulation barrel is disposed on the rotary table, and the crucible die is disposed in the thermal insulation barrel. The crucible die is provided with a plurality of first grooves, and the first grooves are evenly distributed on a first circumference. A plurality of first fixing holes are disposed on a top of the thermal insulation barrel, and the first fixing holes are disposed corresponding to the first grooves. A first acquisition hole is disposed on the top of the microwave reaction chamber, and the first acquisition hole is located right above the first circumference.Type: GrantFiled: April 3, 2020Date of Patent: September 13, 2022Assignee: KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Lei Xu, Jinhui Peng, Shenghui Guo, Libo Zhang, Zhaohui Han, Yi Xia, Shaohua Ju, Shanju Zheng, Shiwei Li, Zemin Wang, Zhang Xu
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Publication number: 20220225542Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.Type: ApplicationFiled: March 31, 2022Publication date: July 14, 2022Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Tong Wa CHAO, Mark BIANCO, Yanbing SUN, Ming ZHANG, Guixiang TAN, Devdatta P. KULKARNI, Guocheng ZHANG, Hao ZHOU
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Publication number: 20220196507Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.Type: ApplicationFiled: December 23, 2020Publication date: June 23, 2022Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Victor POLYANKO, Mark BIANCO, Bijoyraj SAHU, Minh T.D. LE, Carlos ALVIZO FLORES, Javier AVALOS GARCIA, Adriana LOPEZ INIGUEZ, Luz Karine SANDOVAL GRANADOS, Michael BERKTOLD, Damion SEARLS, Jin YANG, David SHIA, Samer MELHEM, Jeffrey Ryan CONNER, Hemant DESAI, John RAATZ, Richard DISCHLER, Bergen ANDERSON, Eric W. BUDDRIUS, Kenan ARIK, Barrett M. FANEUF, Lianchang DU, Yuehong FAN, Shengzhen ZHANG, Yuyang XIA, Jun ZHANG, Yuan Li, Catharina BIBER, Kristin L. WELDON, Brendan T. PAVELEK
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Publication number: 20220117112Abstract: Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.Type: ApplicationFiled: October 12, 2020Publication date: April 14, 2022Inventors: Prabhakar SUBRAHMANYAM, Ying-Feng PANG, Yi XIA, Muhammad AHMAD
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Publication number: 20220077023Abstract: An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.Type: ApplicationFiled: November 12, 2021Publication date: March 10, 2022Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Ridvan A. SAHAN
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Publication number: 20210317717Abstract: A downhole tool having a mandrel, and a bottom slip disposed around the mandrel. The bottom slip includes a circular body having a one-piece configuration characterized by a plurality of slip segments by at least partial material connectivity therearound. The bottom slip is made of a filament wound composite material, which means the bottom slip has a plurality of layers joined by respective interface layers. An outer slip surface of at least one of the plurality of slip segments is defined in cross-section by a plane P that intersects a longitudinal axis of the downhole tool at an angle a1 when the bottom slip is in an unset position.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Inventors: Evan Lloyd Davies, Yi Xia, Luis Miguel Avila, David Hughes, Gabriel Slup, Ashton E. Diaz
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Publication number: 20210289659Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.Type: ApplicationFiled: April 27, 2020Publication date: September 16, 2021Applicant: Intel CorporationInventors: Prabhakar SUBRAHMANYAM, Casey WINKEL, Yingqiong BU, Ming ZHANG, Yuehong FAN, Yi XIA, Ying-Feng PANG
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Publication number: 20210261574Abstract: Compounds, pharmaceutical formulations, and methods of treating bacterial infections are disclosed.Type: ApplicationFiled: February 12, 2021Publication date: August 26, 2021Applicant: Bill & Melinda Gates FoundationInventors: Xianfeng LI, Christopher S. LUNDE, Robert T. JACOBS, Vincent S. HERNANDEZ, Yi XIA, Jacob J. PLATTNER, Kathy Jingyuan CAO, Yong-Kang ZHANG, Matthew PERRY
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Patent number: 11086870Abstract: A data store system includes an array of persistent storage devices configured to store a plurality of data store tables. The data store system includes a processor in communication with the storage device. The processor may receive a query comprising an aggregate function and identify structure of an argument of the aggregate function. The subset of data store tables may be associated with the argument. The processor may partially-execute the aggregate function on each data store table in the subset involved in the argument of the aggregate function to create partially-executed results for each data store table of the subset of data store tables. The processor may join the partially-executed results based on join conditions contained in the aggregate function. The processor may complete execution of the aggregate function on the partially-executed results to generate a final result of the aggregate function. A method and computer-readable medium are also disclosed.Type: GrantFiled: December 30, 2015Date of Patent: August 10, 2021Assignee: Teradata US, Inc.Inventors: Anantha B. Subramanian, Sanjay Nair, Yi Xia, Grace Kwan-On Au, Kuorong Chiang
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Patent number: 11078739Abstract: A downhole tool having a mandrel, and a bottom slip disposed around the mandrel. The bottom slip includes a circular body having a one-piece configuration characterized by a plurality of slip segments by at least partial material connectivity therearound. The bottom slip is made of a filament wound composite material, which means the bottom slip has a plurality of layers joined by respective interface layers. An outer slip surface of at least one of the plurality of slip segments is defined in cross-section by a plane P that intersects a longitudinal axis of the downhole tool at an angle a1 in a range of 10 degrees to 20 degrees when the bottom slip is in an unset position.Type: GrantFiled: August 21, 2018Date of Patent: August 3, 2021Assignee: The WellBoss Company, LLCInventors: Evan Lloyd Davies, Yi Xia, Luis Miguel Avila, David Hughes, Gabriel Slup, Ashton E. Diaz
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Publication number: 20210159987Abstract: An entangled, spatially distributed, quantum sensor network enhanced by quantum repeaters includes a probe-state generator for generating M entangled light fields, where M is an integer greater than one. The quantum sensor network also includes M spatially distributed sensor modules that communicate with the probe-state generator to receive the M entangled light fields, respectively, and conduct a measurement therewith. The quantum sensor network also includes one or more quantum repeaters, each of which is (a) located in a propagation channel of a respective one of the entangled light fields to its corresponding sensor module from the probe-state generator, and (b) includes a plurality of quantum scissors to amplify the entangled light field to at least partly compensate for loss in the propagation channel.Type: ApplicationFiled: November 23, 2020Publication date: May 27, 2021Inventors: Zheshen Zhang, Yi Xia, Quntao Zhuang, William Clark
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Publication number: 20210137938Abstract: The present invention relates to the treatment of a tumor selected from the group consisting of pancreatic cancer, liver cancer, melanoma, colon cancer, glioblastoma, osteosarcoma, prostate cancer and breast cancer, more particularly pancreatic cancer. The inventors found a novel family compounds of formula (I) able to treat a variety of cancers by inhibiting NUPR1, a stress-inducible 82-amino-acid-long, intrinsically disordered member of the AT-hook family of chromatin proteins. Thus, the present invention relates to a compound of formula (I) for its use in the treatment of a tumor selected from the group consisting of pancreatic cancer, liver cancer, melanoma, colon cancer, glioblastoma, osteosarcoma, prostate cancer and breast cancer. In particular, the inventors tested compounds of formula (I) on four well characterized primary pancreatic cancer-derived cells 02.Type: ApplicationFiled: May 31, 2019Publication date: May 13, 2021Inventors: Olga ABIAN FRANCO, Patricia SANTOFIMIA, Yi XIA, Jose Luis NEIRA, Bruno RIZZUTI, Adrian VELAZQUEZ CAMPOY, Ling PENG, Juan IOVANNA
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Publication number: 20210120703Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption.Type: ApplicationFiled: December 26, 2020Publication date: April 22, 2021Inventors: Prabhakar SUBRAHMANYAM, Arun KRISHNAMOORTHY, Victor POLYANKO, Ying-Feng PANG, Yi XIA, Pooya TADAYON, Muhammad AHMAD, Rahima K. MOHAMMED
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Publication number: 20210116391Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.Type: ApplicationFiled: December 23, 2020Publication date: April 22, 2021Inventors: Prabhakar SUBRAHMANYAM, Ying-Feng PANG, Yi XIA, Mark BIANCO, Victor POLYANKO