Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.

Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Abstract: Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.

Abstract: An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.

Abstract: A downhole tool having a mandrel, and a bottom slip disposed around the mandrel. The bottom slip includes a circular body having a one-piece configuration characterized by a plurality of slip segments by at least partial material connectivity therearound. The bottom slip is made of a filament wound composite material, which means the bottom slip has a plurality of layers joined by respective interface layers. An outer slip surface of at least one of the plurality of slip segments is defined in cross-section by a plane P that intersects a longitudinal axis of the downhole tool at an angle a1 when the bottom slip is in an unset position.

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: Compounds, pharmaceutical formulations, and methods of treating bacterial infections are disclosed.

Abstract: A data store system includes an array of persistent storage devices configured to store a plurality of data store tables. The data store system includes a processor in communication with the storage device. The processor may receive a query comprising an aggregate function and identify structure of an argument of the aggregate function. The subset of data store tables may be associated with the argument. The processor may partially-execute the aggregate function on each data store table in the subset involved in the argument of the aggregate function to create partially-executed results for each data store table of the subset of data store tables. The processor may join the partially-executed results based on join conditions contained in the aggregate function. The processor may complete execution of the aggregate function on the partially-executed results to generate a final result of the aggregate function. A method and computer-readable medium are also disclosed.

Abstract: A downhole tool having a mandrel, and a bottom slip disposed around the mandrel. The bottom slip includes a circular body having a one-piece configuration characterized by a plurality of slip segments by at least partial material connectivity therearound. The bottom slip is made of a filament wound composite material, which means the bottom slip has a plurality of layers joined by respective interface layers. An outer slip surface of at least one of the plurality of slip segments is defined in cross-section by a plane P that intersects a longitudinal axis of the downhole tool at an angle a1 in a range of 10 degrees to 20 degrees when the bottom slip is in an unset position.

Abstract: An entangled, spatially distributed, quantum sensor network enhanced by quantum repeaters includes a probe-state generator for generating M entangled light fields, where M is an integer greater than one. The quantum sensor network also includes M spatially distributed sensor modules that communicate with the probe-state generator to receive the M entangled light fields, respectively, and conduct a measurement therewith. The quantum sensor network also includes one or more quantum repeaters, each of which is (a) located in a propagation channel of a respective one of the entangled light fields to its corresponding sensor module from the probe-state generator, and (b) includes a plurality of quantum scissors to amplify the entangled light field to at least partly compensate for loss in the propagation channel.

Abstract: The present invention relates to the treatment of a tumor selected from the group consisting of pancreatic cancer, liver cancer, melanoma, colon cancer, glioblastoma, osteosarcoma, prostate cancer and breast cancer, more particularly pancreatic cancer. The inventors found a novel family compounds of formula (I) able to treat a variety of cancers by inhibiting NUPR1, a stress-inducible 82-amino-acid-long, intrinsically disordered member of the AT-hook family of chromatin proteins. Thus, the present invention relates to a compound of formula (I) for its use in the treatment of a tumor selected from the group consisting of pancreatic cancer, liver cancer, melanoma, colon cancer, glioblastoma, osteosarcoma, prostate cancer and breast cancer. In particular, the inventors tested compounds of formula (I) on four well characterized primary pancreatic cancer-derived cells 02.

Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption.

Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

Abstract: Compounds, pharmaceutical formulations, and methods of treating bacterial infections are disclosed.

Abstract: Embodiments of the invention relate to virtual link aggregation. One embodiment includes forming one or more virtual links using physical links connecting a first networking element, a second networking element and a third networking element. A first trigger status indication is used for blocking network traffic for avoiding traffic loops occurring over the one or more virtual links.

Abstract: The present invention provides a microwave-based high-throughput material processing device with a concentric rotary chassis. The device includes a microwave source generator, a microwave reaction chamber, and a temperature acquisition device. The microwave reaction chamber is provided with a rotary table, a thermal insulation barrel and a crucible die. The thermal insulation barrel is disposed on the rotary table, and the crucible die is disposed in the thermal insulation barrel. The crucible die is provided with a plurality of first grooves, and the first grooves are evenly distributed on a first circumference. A plurality of first fixing holes are disposed on a top of the thermal insulation barrel, and the first fixing holes are disposed corresponding to the first grooves. A first acquisition hole is disposed on the top of the microwave reaction chamber, and the first acquisition hole is located right above the first circumference.

Abstract: The present disclosure relates to, inter alia, systems and methods for measuring contact-line mobility of a liquid on a solid substrate. The system includes a motion-generation component, a motion-measurement component, and a computer component. The motion-generation component can include an actuator and a controller, the actuator being adapted to mount a solid substrate and effective to impart periodic forcing to the solid substrate when a test droplet of the liquid is deposited thereon, and the controller being adapted to tune frequency and amplitude of the forcing to induce measurable contact-line displacement of the test droplet on the solid substrate. The motion-measurement component includes an image acquisition device adapted for capturing images of the test droplet.

Abstract: A plurality of objects associated with respective footnote reference information within a document are generated. An overflow object associated with overflow footnote reference information corresponding to a previous footnote marker appearing on a previous page is invoked to lay out the overflow footnote reference information, generating overflow layout data. A current page object associated with current page footnote reference information that corresponds to a current page footnote marker appearing on the page is invoked to lay out the current page footnote reference information, generating current page footnote reference information layout data, if an available footnote height is sufficient to lay out the current page footnote reference information. The page is displayed based on the overflow layout data and the current page footnote reference information layout data.

Abstract: Compounds, pharmaceutical formulations, and methods of treating bacterial infections are disclosed.

Abstract: Compounds, pharmaceutical formulations, and methods of treating bacterial infections are disclosed.