Patents by Inventor Yi Yan

Yi Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260154475
    Abstract: Provided is a method and system for predicting building heating and cooling electrical loads. The method includes: obtaining actual and simulated heating and cooling electrical data of a plurality of source domain buildings as well as simulated heating and cooling electrical load data of a target domain building; calculating temporal errors of heating and cooling electrical data of the plurality of source domain buildings; calculating correlation of the target domain building with the plurality of source domain buildings, and on this basis, calculating weighted errors; transferring the weighted errors to the simulated heating and cooling electrical load data of the target domain building, using heating and cooling electrical load data after the transfer as historical heating and cooling electrical load data of the target domain building; constructing and training a prediction model; and predicting heating and cooling electrical load data of the target domain building through the trained prediction model.
    Type: Application
    Filed: October 11, 2023
    Publication date: June 4, 2026
    Inventors: Yi Yan, Chongyi Tian, Chengdong Li, Ruiqi Wang, Chenlu Tian, Zhuliang Shao, Fan Wang, Ji Li, Biao Qiao, Huiyu Xue, Yukang Cao
  • Publication number: 20260123526
    Abstract: An electronic device includes a substrate having opposite first and second sides, the first side attached to a metal structure, as well as a first semiconductor die attached to the first side of the substrate, a bond wire connected to the first semiconductor die, and a second semiconductor die attached to the second side of the substrate. A method of fabricating an electronic device includes attaching a first semiconductor die to first side of a substrate, attaching an opposite second side of the substrate to a lead frame, connecting a bond wire to a conductive feature of the first semiconductor die, and forming flip chip connections to attach a second semiconductor die to conductive features of an opposite second side of the substrate.
    Type: Application
    Filed: October 24, 2024
    Publication date: April 30, 2026
    Inventors: Yi Yan, Sreeram Nasum S, Suvadip Banerjee
  • Patent number: 12562309
    Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.
    Type: Grant
    Filed: January 30, 2024
    Date of Patent: February 24, 2026
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Yi Yan, Zhemin Zhang, Yuki Sato, Kenji Otake, Vijaylaxmi Khanolkar
  • Publication number: 20260041017
    Abstract: A microelectronic device package includes: a package substrate having a first set of leads spaced from a first die pad configured for mounting semiconductor devices, and a second set of leads spaced from a second die pad configured for mounting additional semiconductor devices, the first die pad and the first set of leads spaced from the second die pad and the second set of leads. Semiconductor devices are mounted to the first die pad and second die pad. A ceramic interposer is mounted to the package substrate in thermal contact with at least the first die pad. Mold compound covers the semiconductor devices, a portion of the ceramic interposer, and portions of the first set and the second set of leads.
    Type: Application
    Filed: July 31, 2024
    Publication date: February 5, 2026
    Inventors: Woochan Kim, Yi Yan, Makoto Shibuya
  • Publication number: 20260016509
    Abstract: A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.
    Type: Application
    Filed: September 23, 2025
    Publication date: January 15, 2026
    Inventors: Yi Yan, Dok Won Lee, Hank Ming Sung, Kenji Otake
  • Publication number: 20260009043
    Abstract: The present disclosure belongs to the technical field of synthetic biology, and relates to a method for producing spermidine. The present disclosure adopts a metabolic engineering method by introducing a novel exogenous pathway, eliminates the inhibition of various products in the spermidine synthesis pathway, changes the spermidine transport system, and enhance the enzymatic activities of key pathways. As a result, genetically engineered strains of Serratia marcescens and Escherichia coli with high yield of spermidine are obtained. The spermidine concentration in the shake flask supernatant reaches 26.8 g/L for genetically engineered strain of Serratia marcescens and 24.7 g/L for the genetically engineered strain of Escherichia coli, respectively, both demonstrating good potential for industrial application.
    Type: Application
    Filed: September 17, 2025
    Publication date: January 8, 2026
    Inventors: Yujie CAI, Linbo GOU, Di LIU, Yi YAN, Jie WANG, Xiaoyuan ZHANG, Yanrui DING
  • Publication number: 20250306133
    Abstract: In an example, a Hall sensor can include an IC die formed on a lead frame that is configured to conduct a current, the IC die being configured to sense a magnetic field resulting from the current. The Hall sensor can include at least one magnetic permeability material film formed on the IC die. The Hall sensor can include at least one permalloy material layer formed on the respective at least one magnetic permeability material film, the at least one magnetic permeability material film and the at least one permalloy material layer combining to provide a magnetic concentrator providing concentration of the magnetic field.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 2, 2025
    Inventors: Anindya PODDAR, Yi YAN, Dok Won LEE
  • Patent number: 12422459
    Abstract: A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.
    Type: Grant
    Filed: October 31, 2023
    Date of Patent: September 23, 2025
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Yi Yan, Dok Won Lee, Hank Ming Sung, Kenji Otake
  • Publication number: 20250290102
    Abstract: Disclosed are production of terpenoid compound and the strain used by, which belong to the technical field of bioengineering. The disclosure constructs an engineered strain of Serratia marcescens in production of hemiterpenes or monoterpenes, and the engineered strain of S. marcescens can produce linalool, isoprene, isopentenol, 1,8-cineole, ?-pinene, pinene, ?-terpinene, geraniol, (+)-limonene, (?)-limonene, myrcene, ?-ocimene, sabinene, (?)-?-bisabolol, farnesol, longifolene, valencene, ?-elemene, farnesene, patchoulol, pentalenene, and ?-santalene. In a 30 L fermenter, the yield of linalool produced by the engineered strain of S. marcescens is 40.72 g·L?1.
    Type: Application
    Filed: May 30, 2025
    Publication date: September 18, 2025
    Inventors: Yujie CAI, Di LIU, Linmeng ZHANG, Long WANG, Yao LU, Xia CHEN, Songsong YAO, Yongai MA, Yi YAN, Xiaoyuan ZHANG, Yanrui DING, Linbo GOU
  • Publication number: 20250226411
    Abstract: A negative electrode material includes a carbon-based material. In an X-ray diffraction pattern of the negative electrode material tested by X-ray diffractometry, a diffraction peak a is exhibited at a diffraction angle 2? of 43° to 44°, a diffraction peak b is exhibited at a diffraction angle 2? of 45° to 47°, an intensity of the diffraction peak a is Ia, and an intensity of the diffraction peak b is Ib, and Ia/Ib>1.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 10, 2025
    Applicant: Ningde Amperex Technology Limited
    Inventors: Yi YAN, Jiali DONG, Yuansen XIE
  • Publication number: 20250226413
    Abstract: A negative electrode material is provided. The negative electrode material comprises a carbon-based material. In a nitrogen adsorption-desorption test of the negative electrode material, 0.004 cm3/g?S?0.030 cm3/g, wherein S is an adsorption volume of pores with a pore diameter of 3 nm to 35 nm in the negative electrode material. In a charge-discharge test of a button battery prepared by using lithium as a negative electrode and using the negative electrode material as a positive electrode, a gravimetric capacity of the negative electrode material measured when the button battery is discharged to ?5 mV is Cap A, and the gravimetric capacity of the negative electrode material measured when the button battery is discharged to a voltage of 5 mV is Cap B, 10 mAh/g?Cap A?Cap B?20 mAh/g.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 10, 2025
    Applicant: Ningde Amperex Technology Limited
    Inventors: Yi Yan, Jiali Dong, Yuansen Xie
  • Publication number: 20250226410
    Abstract: A negative electrode material including a carbon-based material. In a thermogravimetric test of the negative electrode material, the negative electrode material has an exothermic peak within a temperature range of 600° C. to 800° C. in an air atmosphere. The negative electrode material of this application has excellent kinetic performance, thereby effectively improving discharge rate performance of a secondary battery including the negative electrode material.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 10, 2025
    Applicant: Ningde Amperex Technology Limited
    Inventors: Yi Yan, Jiali Dong, Yuansen Xie
  • Publication number: 20250183133
    Abstract: A described example includes: a package substrate including a mounting pad, at least one die pad, a first set of conductive leads, and a second set of conductive leads spaced from the first set of conductive leads; a semiconductor die mounted to the at least one die pad with a first die attach material; a laminate transformer with integral magnetic material mounted on the mounting pad with a second die attach material; first electrical connections of wire bonds or ribbon bonds between the bond pads of the semiconductor die and the first set of conductive leads; second electrical connections of wire bonds or ribbon bonds between the bond pads of the semiconductor die and the laminate transformer with integral magnetic material; and mold compound covering the electrical connections, the semiconductor die, the laminate transformer with integral magnetic material and portions of the package substrate.
    Type: Application
    Filed: November 30, 2023
    Publication date: June 5, 2025
    Inventors: Chun Ping Lo, Enis Tuncer, Yi Yan
  • Publication number: 20250138054
    Abstract: A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 1, 2025
    Inventors: Yi Yan, Dok Won Lee, Hank Ming Sung, Kenji Otake
  • Publication number: 20250111013
    Abstract: Provided are an information generation method and apparatus, and an electronic device.
    Type: Application
    Filed: January 3, 2023
    Publication date: April 3, 2025
    Inventors: Xiaoming GAO, Qin LIU, Huihong LI, Fang CHEN, Shidi LIU, Yi YAN, Cong MAI, Jinming ZENG, Yunzhi LIU, Wenhao TAN, Guangwen CAI, Huiying DENG, Xiaoming XU, Yunbin SU, Xueming JIANG, Liyou ZHANG, Mingyi GUO, Jiechao LIAO, Xuehao LI
  • Publication number: 20250096084
    Abstract: A microelectronic device includes a die pad having a first surface and a second, opposite, surface. A first component is directly attached to the first surface of the die pad through a first thermally conductive material. A second component is directly attached to the second surface of the die pad through a second thermally conductive material. At least a portion of the second component overlaps at least a portion of the first component. The microelectronic device further includes a first thermal shunt connecting the die pad to a first lead, and a second thermal shunt connecting the die pad to a second lead. The first thermal shunt is closer to a center of the first component than to a center of the second component. The second thermal shunt is closer to a center of the second component than to a center of the first component.
    Type: Application
    Filed: September 20, 2023
    Publication date: March 20, 2025
    Inventors: Vijaylaxmi Khanolkar, Yi Yan
  • Patent number: 12252716
    Abstract: The disclosure discloses a strain and method for producing rosmarinic acid, and belongs to the technical field of bioengineering. The disclosure constructs a recombinant cell or a combination of recombinant cells expressing 4-coumarate: CoA ligase, rosmarinic acid synthase, polyphosphate kinase 2-I (PPK2-I) and polyphosphate kinase 2-II (PPK2-II), and utilizes the recombinant cell or the combination of recombinant cells to catalyze Danshensu and caffeic acid for synthesizing rosmarinic acid. The disclosure has good industrial application prospects.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: March 18, 2025
    Assignee: Hong-Taoism Research Institute of analytical science and technology LTD., Shaanxi Province
    Inventors: Yujie Cai, Yi Yan, Yanrui Ding, Yajun Bai, Xiaohui Zheng
  • Publication number: 20250053739
    Abstract: The present invention includes techniques for data processing and particularly relates to a method and system for predicting human fall risk based on electronic nursing text (ENT) data. The method comprises the following steps: obtaining an ENT data set, pre-processing data in the ENT data set, and constructing a Morse Fall Scale (MFS) dictionary with the pre-processed data; extracting features from the ENT data of patients to be predicted with a natural language processing technology; analyzing the extracted text features by the MFS dictionary to obtain a data set of risk factors; training a decision tree algorithm by using the data set of risk factors to obtain a prediction result of the patient's fall risk; clustering and precisely nursing the patients according to the prediction result.
    Type: Application
    Filed: October 24, 2022
    Publication date: February 13, 2025
    Applicant: CHONGQING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Haiyan Yu, Xiaolong Zuo, Yi Yan, Guokang Fan
  • Publication number: 20240347267
    Abstract: An apparatus includes a magnetic core and an inductor. The magnetic core has a cylindrical boss and a base plate. The cylindrical boss has a first end and a second end. The base plate extends perpendicularly from the first end of the cylindrical boss. The base plate has a top side and a bottom side. The inductor includes a coil, a first terminal, and a second terminal. The coil is disposed on the top side of the base plate about the cylindrical boss. The first terminal is wrapped from the top side of the base plate to the bottom side of the base plate. The second terminal is wrapped from the top side of the base plate to the bottom side of the base plate.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Inventors: Yi YAN, Hidetoshi INOUE
  • Publication number: 20240170207
    Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: Yi Yan, Zhemin Zhang, Yuki Sato, Kenji Otake, Vijaylaxmi Khanolkar