Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.

Abstract: A transport system of a semiconductor fabrication facility, including: a rail for carrying vehicle, a sensor installed on the rail, a controller and a power panel. The sensor is arranged to determine a zone and send a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to adjust a current in accordance with the output signal, wherein the current is output to a cable extending along the rail.

Abstract: A stocking system is provided. The stocking system includes a wafer carrier, a stocking unit, a plurality of pod stoppers and at least one positioning pin. The stocking unit is configured to store the wafer carrier, and includes a carrying plate for carrying the wafer carrier. The pod stoppers stand on an edge of the carrying plate. The at least one positioning pin is disposed on a front portion of the carrying plate, such that the wafer carrier leans against the at least one positioning pin and is tilted toward a back portion of the carrying plate.

Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance crane, a rectangular zone overlapping with the load port of the manufacturing tool, a plurality of first sensors at corners of the rectangular zone, an OHT vehicle, a second sensor on the OHT vehicle, a third sensor on the load port, and a control unit. The first sensors are configured to detect a location of the maintenance crane and to generate a first location data. The second sensor is configured to generate a second location data. The control unit is configured to receive the first location data of the maintenance crane and the second location data of the OHT vehicle. The control unit further sends signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

Abstract: A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.

Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.

Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

Abstract: A method includes providing a rail, a first conveying unit movably mounted on the rail, and a central controller configured to control the first conveying unit; displacing the first conveying unit along the rail at a first speed; obtaining a first vibration measurement upon the displacement of the first conveying unit along the rail at the first speed; analyzing the first vibration measurement; transmitting a first signal based on the analysis of the first vibration measurement to the central controller; providing a second conveying unit movably mounted on the rail; transmitting a first feedback signal based on the first signal from the central controller to the second conveying unit; and displacing the second conveying unit along the rail at a second speed based on the first feedback signal.

Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.

Abstract: A stocking system is provided. The stocking system includes a wafer carrier, a stocking unit, a plurality of pod stoppers and at least one positioning pin. The stocking unit is configured to store the wafer carrier, and includes a carrying plate for carrying the wafer carrier. The pod stoppers stand on an edge of the carrying plate. The at least one positioning pin is disposed on a front portion of the carrying plate, such that the wafer carrier leans against the at least one positioning pin and is tilted toward a back portion of the carrying plate.

Abstract: A stocker for storing a plurality of wafer carriers is provided. The stocker includes a frame, a plurality of pod stoppers, a plurality of truss members and a plurality of partitions. The frame includes a plurality of stocking units. Each of the stocking units includes a carrying plate for carrying one of the plurality of wafer carriers. The pod stoppers stand on an edge of each of the carrying plates. The truss members are disposed diagonally across at least one side surface of at least one of the stocking units, wherein each of the truss members comprises a shock absorber. The partitions are disposed on side surfaces of the stocking units and fixed to the frame.

Abstract: The present invention is a permanent magnet external-rotating brushless motor and an induction motor. It is multi-stabilized in order to fully utilize the characteristics of a magnetic field of 360 degrees, and is multi-functionalized by a wire group selection switch, and multi-stator multi-function The different stator-to-stator line sets are connected to the output power generation or the power supply drive to select different combinations of functions, such as a programmable logic controller module or a 32-bit 32-channel multi-channel servo steering control module, and the execution of the array module is written. The modes are grouped into action groups, and then the computer is used to assist the driver in making decisions by analyzing the artificial road and the road type with artificial intelligence decision trees.

Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance tool including a first track and at least one maintenance crane on the first track, a rectangular zone overlapping with the load port, a plurality of first sensors on the first track and at corners of the rectangular zone configured to detect a location of the maintenance crane and generate a first location date, a transporting tool including a second track and a OHT vehicle on the second track, at least a second sensor on the OHT vehicle and configured to generate a second location data, at least a third sensor on the load port, and a control unit configured to receive the first location data and the second location data, and send signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

Abstract: An automatic cleaning unit for AMHS includes a plurality of sensors disposed on OHT rails. The sensors are configured to define a cleaning zone and to detect a location of an OHT vehicle. The automatic cleaning unit further includes a vacuum generator and a top cleaning part installed over the OHT rails in the cleaning zone. The top cleaning part is coupled to the vacuum generator. The vacuum generator is turned on to perform a vacuum cleaning operation when the sensors detect the OHT vehicle entering the cleaning zone.

Abstract: A transport system of a semiconductor fabrication facility, including: a rail for carrying vehicle, a sensor installed on the rail, a controller and a power panel. The sensor is arranged to determine a zone and send a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to adjust a current in accordance with the output signal, wherein the current is output to a cable extending along the rail.

Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.

Abstract: An apparatus for a semiconductor fabrication facility (FAB) is provided. In one embodiment, the apparatus includes a maintenance tool and a transporting tool configured to transport at least one customized. The maintenance tool includes a first track at a first horizontal plane, at least one maintenance crane movably mounted on the first track, and a plurality of first sensors on the first track. The first sensors are configured to define at least a danger zone and to detect a location of the maintenance crane. The transporting tool includes a second track at a second horizontal plane, at least one overhead hoisting transporting (OHT) vehicle movably mounted on the second track, and at least one second sensor on the OHT vehicle. The second horizontal plane is different from the first horizontal planes. The first horizontal plane and the second horizontal plane at least partially overlap each other from a plane view.

Abstract: The present disclosure relates to a polymerization process wherein the emulsifier is introduced in an initial batch as well as during a continuous feed to provide improved mechanical stability of the generated latex. Improved soap coverage can also be achieved during the polymerization process.

Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.

Abstract: A stocker for storing a plurality of wafer carriers is provided. The stocker includes a frame, a plurality of pod stoppers, a plurality of truss members and a plurality of partitions. The frame includes a plurality of stocking units. Each of the stocking units includes a carrying plate for carrying one of the plurality of wafer carriers. The pod stoppers stand on an edge of each of the carrying plates. The truss members are disposed diagonally across at least one side surface of at least one of the stocking units, wherein each of the truss members comprises a shock absorber. The partitions are disposed on side surfaces of the stocking units and fixed to the frame.