Patents by Inventor Ying An

Ying An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186820
    Abstract: The present invention discloses a power source transfer circuit for switching among a plurality of power sources to supply power to a load. The power source transfer circuit includes a first switch, a second switch and a bypass switch, wherein one of the plurality of power sources supplies power to the load via the first switch and the second switch, and wherein the bypass switch is connected in parallel to the second switch on a neutral line and is configured to control neutral overlapping duration during switching among the plurality of power sources. The power source transfer circuit including a bypass switch provided by the present disclosure can reduce the neutral overlapping duration to microseconds during power source transfer, so as to realize fast and reliable response.
    Type: Application
    Filed: June 28, 2023
    Publication date: June 6, 2024
    Applicant: Schneider Electric Industries SAS
    Inventors: Xiaohang Chen, Haijun Zhao, Ying Shi, Jiamin Chen, Yangfeng Song, Qing Yang, Jihua Dong
  • Publication number: 20240186668
    Abstract: A radio frequency device includes a feeding structure and a phase shifting structure. The feeding structure includes opposite first and second substrates, and a dielectric layer between the first and second substrates. The first substrate includes a coupling branch and a delay branch, which are respectively connected to two output terminals of a power divider, on an inner side of the first substrate. The second substrate includes a receiving electrode on its inner side, the receiving electrode and the coupling branch form a coupling structure, and their orthographic projections on the first substrate at least partially overlap each other. A length of an orthographic projection of both the coupling branch and the receiving electrode on the first substrate is different from a length of the delay branch. The phase shifting structure includes first and second transmission lines directly and electrically connected to the coupling branch and the delay branch, respectively.
    Type: Application
    Filed: February 15, 2024
    Publication date: June 6, 2024
    Inventors: Haocheng JIA, Tienlun TING, Ying WANG, Jie WU, Liang LI, Cuiwei TANG, Qiangqiang LI
  • Publication number: 20240187141
    Abstract: A user equipment (UE) is described. The UE includes receiving circuitry configured to receive a first radio resource control (RRC) message comprising first information used for configuring a Semi-Persistent Scheduling (SPS) physical downlink shared channel (PDSCH) configuration, to receive a second RRC message comprising second information used for configuring that deferring of SPS hybrid automatic repeat request-acknowledgement (HARQ-ACK) is supported, and to receive, based on a detection of a physical downlink control channel (PDCCH) carrying a downlink control information (DCI) format with cyclic redundancy check (CRC)scrambled by a first radio network identifier (RNTI) for an activation of the SPS PDSCH, the SPS PDSCH transmission.
    Type: Application
    Filed: March 22, 2022
    Publication date: June 6, 2024
    Inventors: KAI YING, ZHANPING YIN
  • Patent number: 11999475
    Abstract: A robot includes a housing including a first shell and a second shell and having a first configuration and a second configuration, a rack disposed in an inner cavity of the housing, a telescopic assembly disposed on the rack and connected between the first shell and the second shell, and a rotary wing assembly disposed on the rack and having a folded configuration and a flight configuration. The rotary wing assembly includes: a folding arm with one end rotatably connected to the rack, a rotary wing, and a tilting arm connected between the rotary wing and the folding arm, the tilting arm and the rotary wing are extended to an outside of the housing to be adapted to drive the robot to fly in the flight configuration, and the tilting arm is rotatable relative to the folding arm to adjust a rotation direction of the rotary wing.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: June 4, 2024
    Assignee: CCTEG China Coal Research Institute
    Inventors: Long Ma, Wenzhen Wu, Weizhen Zhang, Qingyong Meng, Ying Feng, Desheng Zhang, Weijian Xu, Qingfeng Rong, Yuliang Ma, Jie Zheng
  • Patent number: 11998613
    Abstract: The present disclosure provides an immunoconjugate includes an antibody comprising an antigen-binding fragment that specifically binds to an epitope in mesothelin, N-glycan binding domain and an N-glycan; a linker linking to the N-glycan; and a payload A and a payload B conjugated to the linker, respectively; wherein the payload A and the payload B are the same or different. A pharmaceutical composition comprises the immunoconjugate and a method for treating cancer are also provided in the disclosure.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: June 4, 2024
    Assignee: DEVELOPMENT CENTER FOR BIOTECHNOLOGY
    Inventors: Shih-Hsien Chuang, Wei-Ting Sun, Ying-Shuan Lailee, Chun-Liang Lai, Wun-Huei Lin, Win-Yin Wei, Shih-Chong Tsai, Cheng-Chou Yu, Chao-Yang Huang
  • Patent number: 11998712
    Abstract: Provided is a microneedle patch which is easily to be applied on a skin surface. One or more holes are provided inside a protective sheet of the microneedle patch, and one or more cutting lines running from an outer edge of the protective sheet toward the holes are also provided. The cutting lines may be symmetrically arranged on both sides of the hole. Providing an incision on the outer edge of the cutting lines of the protective release sheet facilitates cutting along the cutting lines. In the use of the microneedle patch, both sides of the cutting line of the protective release sheet are held and torn so as to bring out a microneedle array adhesive sheet and apply it on a skin. Then the microneedle array surface is slightly compressed, thereby the microneedle is inserted into the stratum corneum.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: June 4, 2024
    Assignee: COSMED PHARMACEUTICAL CO., LTD.
    Inventors: Ying-shu Quan, Fumio Kamiyama
  • Patent number: 12001188
    Abstract: Embodiments of the present disclosure provide a method of fast optimization and compensation for volumetric positioning errors of rotary axes of a five-axis CNC system machine tool. The method comprises: establishing a volumetric positioning error model; forming an error database containing 12 geometrical error vectors; constructing a volumetric positioning error compensation table; establishing a compensation value optimization model; completing an iterative optimization of compensation values of volumetric positioning errors; generating a volumetric positioning error compensation file for a CNC system to complete compensation for the volumetric positioning errors; and updating the error database, detecting linkage trajectories of the rotary axes, and setting a linkage trajectory positioning error threshold, and guaranteeing accuracy by iteratively implementing detection, optimization, and compensation.
    Type: Grant
    Filed: August 18, 2023
    Date of Patent: June 4, 2024
    Assignee: CHENGDU AIRCRAFT INDUSTRIAL (GROUP) CO., LTD.
    Inventors: Wenjian Tao, Jie Li, Yunfeng Jiang, Jinlong Hu, Wenping Mou, Zhiyong Song, Ying Li, Lianyu Li, Wangwei Chu
  • Patent number: 12000049
    Abstract: A reactor furnace for coating fiber tow includes an elongate reactor having a fiber tow inlet and a fiber tow outlet; a thermo-chemical reactor section positioned along the elongate reactor; a first microwave source for directing microwave energy along the reactor from a first end of the reactor toward a second end of the reactor; a second microwave source for directing microwave energy along the reactor from the second end of the reactor toward the first end of the reactor; a gas inlet upstream of the thermo-chemical reactor; and a gas outlet downstream of the thermo-chemical reactor.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: June 4, 2024
    Assignee: RTX Corporation
    Inventors: John J. Gangloff, Jr., John E. Holowczak, Ying She, Kenneth David Smith, Haralambos Cordatos, Gurkan Gok, Zissis A. Dardas
  • Patent number: 12000407
    Abstract: A ceiling fan blade assembly structure includes a blade holder, multiple fan blades, and multiple locking assemblies. Multiple fan blade assembly portions are disposed at an outer side of the blade holder. Each fan blade assembly portion includes two first side plates parallel to each other, a first radial positioning portion, and two first vertical positioning portions disposed on the two first side plates. Each fan blade has a fan blade connection portion that includes two second side plates, a second radial positioning portion, and two second vertical positioning portions. The second and the first radial positioning portions are engaged with each other, and the two second and first vertical positioning portions are engaged with each other. Accordingly, the fan blade connection portion is preliminarily positioned on the fan blade assembly portion. Through the locking assembly, the first and the second radial positioning portions are locked together.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: June 4, 2024
    Assignee: HOTECK INC.
    Inventors: Lung-Fa Hsieh, Yu-Chen Hsieh, Min-Yuan Hsiao, Wen-Ting Tang, Hsin-Chu Chang, Ying-Pin Chiang
  • Patent number: 12000455
    Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi Chen Ho, Chih Ping Liao, Chien Ting Lin, Jie-Ying Yang, Wei-Ming Wang, Ker-Hsun Liao, Chi-Hsun Lin
  • Patent number: 12002842
    Abstract: A light-emitting diode, includes a substrate; a semiconductor stack formed on the substrate; a first current blocking patterned structure and a second current blocking patterned structure formed on the semiconductor stack and separated from each other; and a plurality of electrodes formed on the semiconductor stack and electrically connected to the semiconductor stack; wherein the first current blocking patterned structure is overlapped with one of the plurality of electrodes and the second current blocking patterned structure is not overlapped with the plurality of electrodes.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: June 4, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Hsin Ying Wang, Tzung Shiun Yeh, Yu Ling Lin, Bo Jiun Hu
  • Patent number: 12004145
    Abstract: Example methods relate to avoiding beacon collisions between a repeater and a root AP, optimizing traffic flows based on buffers queued within hardware, and/or optimizing transmissions through a trigger-based mechanism. An example method includes determining loads on buffers within a repeater configured to communicate according to a DBVC protocol. The loads on the buffers correspond to data to be transmitted within upstream and downstream networks. The method includes determining whether to adjust a DBVC duty cycle of the repeater based on the loads. The DBVC duty cycle includes: an on channel duty cycle comprising a ratio of time on an on channel to total time on both the on and off channels; or an off channel duty cycle comprising a ratio of time on the off channel to total time on both the on and off channels. The method includes adjusting the DBVC duty cycle of the repeater.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: June 4, 2024
    Assignee: MAXLINEAR INC.
    Inventors: Ying Lu, Richard Kinder
  • Patent number: 12002748
    Abstract: A contact window structure, a metal plug and a forming method thereof, a method of forming the contact window structure and a semiconductor structure are provided. In the method of forming the contact window, an annular pad is formed on a surface of a target layer. A central via, from which partial surface of the target layer is exposed, is formed in the middle part of the annular pad. A dielectric layer covering a substrate, the target layer and the annular pad is formed. The dielectric layer is etched to form an etch hole connected to the central via in the dielectric layer. The annular pad is removed along the etch hole and the central via to enlarge a size of the central via, so as to form the contact window structure by the etch hole and the central via with the enlarged size.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: June 4, 2024
    Assignee: Changxin Memory Technologies, Inc.
    Inventors: Jie Liu, Ping-Heng Wu, Zhan Ying
  • Patent number: 12000766
    Abstract: An automatically-cleanable thickening performance evaluation instrument for drilling LCMs includes a cleaning device, a kettle body, a thickening motor, a heating component, a test ending component, a top cover, and a bottom cover, where upper and lower ends of the kettle body are both opened; the kettle body is arranged in a third bearing inner race, a third bearing outer race is connected to a first limb, and the first limb is configured to limit a position of the kettle body; and the kettle body is detachably connected to the thickening motor and driven by the thickening motor to rotate. The instrument can realize electric heating and air pressurization to simulate the underground environment, and the kettle body can be completely sealed, such that a measured thickening time is close to an actual thickening time. Moreover, the instrument can be automatically cleaned at the end of a test.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: June 4, 2024
    Assignee: CHENGDU UNIVERSITY OF TECHNOLOGY
    Inventors: Jiping She, Hao Zhang, Yang Yang, Bin Yang, Yang Li, Jianjun Ni, Shiyu Zhang, Ying Zhong
  • Patent number: 12002755
    Abstract: A second metal structure such as a metal plug is formed over a first metal structure, such as a metal line, by causing metal material from the first metal structure to migrate into an opening in a dielectric layer over the first metal structure. The metal material, which may be copper, is of a type that undergoes a reduction in density as it oxidizes. Migration is induced using gases that alternately oxidize and reduce the metal material. Over many cycles, the metal material migrates into the opening. In some embodiments, the migrated metal material partially fills the opening. In some embodiments, the migrated metal material completely fills the opening.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: I-Che Lee, Huai-Ying Huang, Ruei-Cheng Shiu
  • Patent number: 12004038
    Abstract: A method of wireless communication includes transmitting, from a source communication node, a first message to a target communication node requesting a hand-over procedure for handing over one or more mobile devices from the source communication node to the target communication node. The first message indicates a traffic pattern or group information of the one or more mobile devices. The method also includes receiving, by the source communication node, a second message from the target communication node in response to the first message.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: June 4, 2024
    Assignee: ZTE Corporation
    Inventors: Mengzhen Wang, Lin Chen, Ying Huang
  • Patent number: 12002770
    Abstract: A package includes first and second redistribution structures, a die, a permalloy structure, a molding material and a plurality of through vias. The first redistribution structure includes a first metal pattern. The die is disposed over the first redistribution structure. The molding material is disposed over the first redistribution structure and surrounds the die and the permalloy structure. The second redistribution structure is disposed over the die, the permalloy structure and the molding material, and includes a second metal pattern. The through vias penetrate the molding material and connects the first metal pattern to the second metal pattern. The permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern. A method for forming a package is also provided.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ying-Chih Hsu, Wen-Shiang Liao
  • Patent number: 12003386
    Abstract: A method for enhancing quality of media uses an artificial intelligence (AI) enhancing model built-in the client device to enhance the quality of video streams. The AI enhance module is pre-trained by using a neural network in the server to analyze differences between the decoded images and the raw images that are generated by the server. Wherein, the AI enhance module enhances decoded images by using algorithms which are defined by analyzing differences between the decoded images and the raw images. Such that, the enhanced images are visually more similar to the raw images than the decoded images do.
    Type: Grant
    Filed: September 26, 2021
    Date of Patent: June 4, 2024
    Assignee: Kabushiki Kaisha Ubitus
    Inventors: Jung-Chang Kuo, Wen-Kae Tsao, Ying-Hau Wu
  • Patent number: 12002528
    Abstract: A memory device is provided, including a first bit cell including a first memory cell coupled to a first word line and a second bit cell including a second memory cell coupled to a second word line. The first and second memory cells are coupled to a first control line and further coupled to a first bit line through first and second nodes. The second bit cell further includes a first protection array coupled to the second memory cell at the second node coupled to the first bit line and further coupled to a third word line. When the first and second bit cells operate in different operational types, the first protection array is configured to generate an adjust voltage to the second node according to a voltage level of the third word line while the first bit cell is programmed.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Gu-Huan Li, Tung-Cheng Chang, Perng-Fei Yuh, Chia-En Huang, Chun-Ying Lee, Yih Wang
  • Patent number: D1029905
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: June 4, 2024
    Inventors: Chao Qin, Davy Ying