Abstract: Provided is a display substrate including a substrate, and a light-emitting device and an optical compensation structure which are located on the substrate. The optical compensation structure includes a photoelectric sensor, a transistor and a capacitor, and the photoelectric sensor is electrically connected to the transistor and the capacitor respectively. The photoelectric sensor includes a first electrode, a photosensitive layer located on a side of the first electrode distal from the substrate, and a second electrode located on a side of the photosensitive layer distal from the substrate; the transistor includes a source electrode, a drain electrode, a gate electrode and an active layer; and the capacitor includes a first electrode plate and a second electrode plate located on a side of the first electrode plate distal from the substrate.

Abstract: The present disclosure provides an extracorporeal focused ultrasound treatment device for a pelvic disease. The treatment device includes an ultrasonic transducer and a treatment couch. Sound emitting surface of the ultrasonic transducer is a spherical surface having a first notch, a second notch and a third notch, the first notch and the second notch are respectively positioned at two intersections of the spherical surface and a diameter perpendicular to the main great circle, and the third notch connects the first notch with the second notch; a cross-section of the sound emitting surface parallel to the main great circle is in a shape of an arc; and an ultrasonic wave generated by the sound generation unit is focused at a center of the sphere corresponding to the sound emitting surface. The treatment couch is configured for a human body to lie in a lithotomy position.

Abstract: A light-emitting diode, includes a substrate; a semiconductor stack formed on the substrate; a first current blocking patterned structure and a second current blocking patterned structure formed on the semiconductor stack and separated from each other; and a plurality of electrodes formed on the semiconductor stack and electrically connected to the semiconductor stack; wherein the first current blocking patterned structure is overlapped with one of the plurality of electrodes and the second current blocking patterned structure is not overlapped with the plurality of electrodes.

Abstract: A memory device is provided, including a first bit cell including a first memory cell coupled to a first word line and a second bit cell including a second memory cell coupled to a second word line. The first and second memory cells are coupled to a first control line and further coupled to a first bit line through first and second nodes. The second bit cell further includes a first protection array coupled to the second memory cell at the second node coupled to the first bit line and further coupled to a third word line. When the first and second bit cells operate in different operational types, the first protection array is configured to generate an adjust voltage to the second node according to a voltage level of the third word line while the first bit cell is programmed.

Abstract: A package includes first and second redistribution structures, a die, a permalloy structure, a molding material and a plurality of through vias. The first redistribution structure includes a first metal pattern. The die is disposed over the first redistribution structure. The molding material is disposed over the first redistribution structure and surrounds the die and the permalloy structure. The second redistribution structure is disposed over the die, the permalloy structure and the molding material, and includes a second metal pattern. The through vias penetrate the molding material and connects the first metal pattern to the second metal pattern. The permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern. A method for forming a package is also provided.

Abstract: The present invention relates to a process for reducing an amount of intact phospholipids in a triacylglyceride oil comprising incubating the oil with a polypeptide having phospholipase A1 activity, wherein the polypeptide comprises a polypeptide having at least 80% identity to the mature amino acid sequence of SEQ ID NO: 1.

Abstract: A second metal structure such as a metal plug is formed over a first metal structure, such as a metal line, by causing metal material from the first metal structure to migrate into an opening in a dielectric layer over the first metal structure. The metal material, which may be copper, is of a type that undergoes a reduction in density as it oxidizes. Migration is induced using gases that alternately oxidize and reduce the metal material. Over many cycles, the metal material migrates into the opening. In some embodiments, the migrated metal material partially fills the opening. In some embodiments, the migrated metal material completely fills the opening.

Abstract: An automatically-cleanable thickening performance evaluation instrument for drilling LCMs includes a cleaning device, a kettle body, a thickening motor, a heating component, a test ending component, a top cover, and a bottom cover, where upper and lower ends of the kettle body are both opened; the kettle body is arranged in a third bearing inner race, a third bearing outer race is connected to a first limb, and the first limb is configured to limit a position of the kettle body; and the kettle body is detachably connected to the thickening motor and driven by the thickening motor to rotate. The instrument can realize electric heating and air pressurization to simulate the underground environment, and the kettle body can be completely sealed, such that a measured thickening time is close to an actual thickening time. Moreover, the instrument can be automatically cleaned at the end of a test.

Abstract: A method of wireless communication includes transmitting, from a source communication node, a first message to a target communication node requesting a hand-over procedure for handing over one or more mobile devices from the source communication node to the target communication node. The first message indicates a traffic pattern or group information of the one or more mobile devices. The method also includes receiving, by the source communication node, a second message from the target communication node in response to the first message.

Abstract: A method for enhancing quality of media uses an artificial intelligence (AI) enhancing model built-in the client device to enhance the quality of video streams. The AI enhance module is pre-trained by using a neural network in the server to analyze differences between the decoded images and the raw images that are generated by the server. Wherein, the AI enhance module enhances decoded images by using algorithms which are defined by analyzing differences between the decoded images and the raw images. Such that, the enhanced images are visually more similar to the raw images than the decoded images do.

Abstract: A user equipment (UE) is described. The UE includes a higher layer processor configured to monitor an uplink (UL) downlink control information (DCI) format that includes first information for scheduling an enhanced ultra-reliable low-latency communication (URLLC) service on a physical uplink shared channel (PUSCH). The higher layer processor is also configured to monitor a downlink (DL) DCI format that includes second information for scheduling the enhanced URLLC service on a physical downlink shared channel (PDSCH).

Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

Abstract: Example methods relate to avoiding beacon collisions between a repeater and a root AP, optimizing traffic flows based on buffers queued within hardware, and/or optimizing transmissions through a trigger-based mechanism. An example method includes determining loads on buffers within a repeater configured to communicate according to a DBVC protocol. The loads on the buffers correspond to data to be transmitted within upstream and downstream networks. The method includes determining whether to adjust a DBVC duty cycle of the repeater based on the loads. The DBVC duty cycle includes: an on channel duty cycle comprising a ratio of time on an on channel to total time on both the on and off channels; or an off channel duty cycle comprising a ratio of time on the off channel to total time on both the on and off channels. The method includes adjusting the DBVC duty cycle of the repeater.

Abstract: The present disclosure provides a printed circuit board with a plated through hole. The through hole covered by a solder pad at both ends of the through hole. At least two pins are plugged into the through hole, one of which with its head end being thermal contacted with one of the solder pads. Another pin's head end being thermal contacted with the other solder pad. The at least two pins are thermal contacted with one another. Thermal dissipation rate is increased with the structure of the through hole.

Abstract: A display substrate includes: a base substrate; a plurality of pixel circuits on the base substrate; and a plurality of pixels; the pixel includes a first sub-pixel, a second sub-pixel and a third sub-pixel; orthographic projections of the first sub-pixel, the second sub-pixel and the third sub-pixel on the base substrate do not overlap with each other; the first sub-pixel, the second sub-pixel and the third sub-pixel are electrically connected to the pixel circuits in a one-to-one correspondence manner; a first distance in a first direction exists between the first sub-pixel and the second sub-pixel, and a first via is arranged in the first distance; a second distance in the first direction exists between the first sub-pixel and the third sub-pixel, and a first via is arranged in the second distance; a third distance in the first direction exists between the second sub-pixel and the third sub-pixel.

Abstract: Disclosed is a method for improving quality of cured loin ham mediated by sorbitol, belonging to the field of food processing. The method comprises the following steps: treating loin with curing material containing sorbitol, inoculating bacterial suspension, and fermenting at constant temperature and humidity to obtain sorbitol-mediated curing loin ham. Through experiments, it is found that the salt content, pH value and aw of sorbitol group are lower than those of control group in the whole production and processing process; only Lactobacillus is the dominant genus in the control group, while Staphylococcus and Lactobacillus are the dominant genera in the sorbitol group.

Abstract: A display panel has a display region, a fan-out region located on a side of the display region, and a bonding region located on a side of the fan-out region away from the display region. The display panel includes a gate driving circuit disposed in the display region, a plurality of data lines and a plurality of control signal lines that all extends from the display region to the fan-out region, and a plurality of data fan-out leads and a plurality of first fan-out leads that are all disposed in the fan-out region. Each data line is electrically connected to a data fan-out lead. The data fan-out leads are gathered to the bonding region. The control signal lines are electrically connected to the gate driving circuit. Each control signal line is electrically connected to a first fan-out lead. The first fan-out leads are gathered to the bonding region.