Patents by Inventor Ying Chu

Ying Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12162820
    Abstract: The compounds represented by Formula (I), which are peripheral alkyl and alkenyl chains extended benzene derivatives, are useful as dual autotaxin (ATX)/histone deacetylase (HD AC) inhibitors. These compounds may be included in a pharmaceutical composition along with a pharmaceutically acceptable carrier, and be used in a therapeutically effective amount for prophylaxis or treatment of various diseases and disorders.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: December 10, 2024
    Assignee: TAIWANJ PHARMACEUTICALS CO., LTD.
    Inventors: Syaulan S. Yang, Yan-feng Jiang, Meng-hsien Liu, Chia-hao Chang, Hao Shiuan Liu, Ying-chu Shih, Sheng Hung Liu, Chiung Wen Wang, Ting-ni Huang
  • Patent number: 12062742
    Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: August 13, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Hao-Wei Tseng, Chi-Hai Kuo, Jeng-Ting Li, Ying-Chu Chen, Pu-Ju Lin, Cheng-Ta Ko
  • Publication number: 20240207835
    Abstract: A multifunctional pipette includes a pipette module, a heater module and a magnetic module. The pipette module includes one or more pipette heads. The heater module has a first joint part, and the heater module configured to removably connect to the pipette module by coupling the first joint part to at least one of the plurality of pipette heads. The magnetic module has a second joint part, and the magnetic module configured to removably connect to the pipette module by coupling the second joint part to at least one of the plurality of pipette heads. The multifunctional pipette can be further applied in an automatic detection machine.
    Type: Application
    Filed: March 14, 2023
    Publication date: June 27, 2024
    Inventors: Chih-Chen CHANG, Chih-Ying CHU, Chih-Kuan LIN
  • Publication number: 20240159269
    Abstract: A rotary bearing assembly is disclosed and includes an input shaft, an inner-ring component, an outer-ring component and a load element. The input shaft is configured to combine a rotating shaft of a motor to provide a power input. The inner-ring component includes a gear set, wherein the inner-ring component is sleeved on the input shaft through the gear set and driven by the input shaft. The outer-ring component is sleeved on the inner-ring component through a load element and engaged with the gear set, wherein when the gear set is driven by the input shaft to drive the inner-ring component, the gear set drives the outer-ring component, and the inner-ring component and the outer-ring component are rotated relatively, wherein one of the inner-ring component and the outer-ring component is served to provide a power output, and a rotational speed difference is between the power input and the power output.
    Type: Application
    Filed: August 8, 2023
    Publication date: May 16, 2024
    Inventors: Chi-Wen Chung, Hung-Wei Lin, Hsien-Lung Tsai, Wei-Ying Chu, Chin-Hsiang Chen
  • Publication number: 20240158355
    Abstract: In one aspect, the present disclosure provides compounds which inhibit bromodomain testis (BRDT). In some embodiments, the compounds inhibit bromodomain-2 of BRDT. In another aspect, the present disclosure provides a method of inhibiting BRDT in a male subject, the method comprising administering to the male subject a therapeutically effective amount of a compound of the disclosure. In some embodiments, the method provides a contraceptive effect in the male subject.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 16, 2024
    Inventors: Martin Matzuk, Zhifeng Yu, Angela Ku, Justin Anglin, Feng Li, Damian Young, Ying-Chu Chen, Melek Ucisik, John Faver, Stephen Palmer, Rajesh Sharma, Choel Kim
  • Patent number: 11890612
    Abstract: A multi-channel pipetting assembly includes a linkage member and a plurality of pipetting structures arranged in parallel. Each pipetting structure includes a pipette body, a piston rod, a piston tube, and an elastic element. The pipette body has a plurality of air chambers with different inner diameters, and the air chambers are arranged axially and communicate with each other. The piston rod is fixed to the linkage member. The piston tube is sleeved on the piston rod. The piston rod and the piston tube are located in the pipette body, and are axially and reciprocatingly movable in the pipette body. The piston rod matches the air chamber with the smallest inner diameter, and the piston tube matches the remaining air chambers. The elastic element is telescopically sleeved on the piston rod and corresponds to the piston tube. Therefore, a plurality of volume ranges meeting the accuracy requirements can be provided.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: February 6, 2024
    Assignee: WISTRON CORPORATION
    Inventors: Chi-Neng Weng, Chih-Kuan Lin, Shao-Wei Peng, Chih-Ying Chu
  • Publication number: 20240015953
    Abstract: A method for forming a Dynamic Random Access Memory (DRAM) includes forming an isolation structure in a substrate to define an active region. The method also includes forming a bit line trench in the active region to divide two active pillars. The method also includes forming a buried bit line in the bit line trench. The method also includes forming an insulating material over the bit line in the bit line trench. The top surface of the insulating material is lower than the top surface of the substrate. A trench is formed over the insulating material. The method also includes forming a shallow recess on the sidewalls of each of the active pillars exposed by the trench to make that each of the active pillars has a neck channel region. The method also includes forming a buried word line in the shallow recess.
    Type: Application
    Filed: June 20, 2023
    Publication date: January 11, 2024
    Inventor: Ying-Chu YEN
  • Publication number: 20230402391
    Abstract: A manufacturing method of a package structure includes: forming a redistribution layer on a top surface of a glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer such that the glass substrate has a cutting edge, in which a crack is formed in the cutting edge of the glass substrate; and heating the protective layer such that a portion of the protective layer flows towards a bottom surface of the glass substrate to cover the cutting edge of the glass substrate and fill the crack in the cutting edge of the glass substrate.
    Type: Application
    Filed: July 24, 2022
    Publication date: December 14, 2023
    Inventors: Ying-Chu CHEN, Jeng-Ting LI, Chi-Hai KUO, Cheng-Ta KO, Pu-Ju LIN
  • Publication number: 20230345703
    Abstract: A semiconductor memory structure includes an isolation structure surrounding an active region in a substrate. The structure also includes two word lines disposed in the active region. The structure also includes a bit line contact disposed between two word lines. The structure also includes a first bit line disposed over the bit line contact. The bit line contact includes polysilicon and has a concave top surface.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventor: Ying-Chu Yen
  • Publication number: 20230231087
    Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.
    Type: Application
    Filed: March 7, 2022
    Publication date: July 20, 2023
    Inventors: Hao-Wei TSENG, Chi-Hai KUO, Jeng-Ting LI, Ying-Chu CHEN, Pu-Ju LIN, Cheng-Ta KO
  • Publication number: 20230190142
    Abstract: A system and method of adaptively testing a hearing function performs a hearing test including outputting a sound of a tested word chosen from a selected one of the word lists, receiving an input of a patient in response to the outputted sound, and determining whether the input matches with the tested word. The hearing test is repeated until a testing end condition is satisfied, wherein the selected one of the word lists in a next iteration of the hearing test has a next higher level of difficulty when the input matches with the tested word in a previous iteration of the hearing test, and the selected one of the word lists in the next iteration of the hearing test has a next lower level of difficulty when the input does not match with the tested word in the previous iteration of the hearing test.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 22, 2023
    Inventors: Pei-Hua CHEN, Chia-Ying CHU, Yu-Chen HUNG
  • Publication number: 20230076269
    Abstract: A method and system for monitoring and controlling a semiconductor process are provided. The method includes: forming at least one active region on a substrate; forming a first patterned photoresist layer for defining at least two word lines on the active region after forming the active region; detecting and measuring positions and dimensions of the active region and the first patterned photoresist layer and calculating estimated areas of at least two estimated contact windows in the active region according to a predefined position of at least one bit line; adjusting the predefined position of the at least one bit line according to the estimated areas of the at least two estimated contact windows in the active region; and forming a second patterned photoresist layer on the substrate. The second patterned photoresist layer corresponds to the adjusted predefined position of the at least one bit line.
    Type: Application
    Filed: August 5, 2022
    Publication date: March 9, 2023
    Applicant: Winbond Electronics Corp.
    Inventors: Ying-Chu Yen, Wei-Che Chang
  • Patent number: 11562403
    Abstract: A method for profit sharing is provided. The method includes deciding a first sharing rate according to a first event information and a first category information; obtaining a first sharing amount according to the first sharing rate and a first shared profit of the first category information; deciding a second sharing rate according to a second event information and a second category information; obtaining a second sharing amount according to the second sharing rate and a second shared profit of the second category information; deciding a total sharing amount by summing up the first sharing amount and the second sharing amount; and returning the total sharing amount in response to receiving a request from a user device.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: January 24, 2023
    Assignee: OBOOK INC.
    Inventors: Chun-Kai Wang, Chung-Han Hsieh, Hsiu-An Teng, Chih-Yang Liu, Wei-Te Lin, I-Cheng Lin, Shin-Ying Chu, Zih-Hao Lin, Kang-Hsien Chang
  • Patent number: 11555531
    Abstract: A cycloid speed reducer includes an input shaft, a rolling assembly, first and second cycloid discs, a crankshaft and an output disc. The first and second cycloid discs are disposed around the input shaft and driven by the input shaft. The first and second cycloid discs are located at two opposite sides of the rolling assembly, respectively. The crankshaft includes first and second eccentric ends and first and second concentric ends integrally formed as a one-piece structure and arranged sequentially. The first and second eccentric ends are linked with the first and second cycloid discs respectively. An eccentricity value is between any neighboring two of the concentric and eccentric ends. The diameters of all the concentric and eccentric ends are equal. The output disc is linked with the first or second concentric end. The output disc is a power output end of the cycloid speed reducer.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: January 17, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chi-Wen Chung, Hung-Wei Lin, Wei-Ying Chu, Chin-Hsiang Chen
  • Patent number: 11545493
    Abstract: A method of fabricating a memory device includes forming an oxide layer on a semiconductor substrate, and forming an isolation structure in the semiconductor substrate and the oxide layer to define an active area. The method also includes forming a word line and a bit line in the semiconductor substrate, wherein the bit line is above the word line. The method further includes removing the oxide layer to form a recess between the isolation structure and the bit line, and forming a storage node contact in the recess. In addition, from a top view, the storage node contact of the memory device overlaps a corresponding portion of the active area.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: January 3, 2023
    Assignee: Winbond Electronics Corp.
    Inventors: Ying-Chu Yen, Wei-Che Chang
  • Patent number: 11521975
    Abstract: A method for forming a semiconductor memory structure includes forming an isolation structure surrounding an active region in a substrate. The method also includes forming a first trench to separate the active region into a first active region and a second active region. The method also includes forming a bit line over the bottom portion of the first trench. The method also includes forming a word line surrounding the first active region and the second active region and over the bit line. The method also includes self-aligned forming a contact over the first active region and the second active region. The method also includes forming a capacitor over the contact.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: December 6, 2022
    Assignee: WINBOND ELECTRONICS CORP.
    Inventor: Ying-Chu Yen
  • Publication number: 20220354122
    Abstract: Disclosed is a coating with reversible wettability, the coating having a hydrophobic state wherein the anti-pathogen coating has a hydrophobic surface that repels at least one of bacteria, fungi, and viruses; and a hydrophilic state wherein the anti-pathogen coating has a hydrophilic surface that inactivates at least one of bacteria, fungi, and viruses, wherein the hydrophobic state switchable to the hydrophilic state by exposure to a first switching stimulus and the hydrophilic state switchable to the hydrophobic state by exposure to a second switching stimulus. This reversible wettability switch between superhydrophobicity and superhydrophilicity can be repeated at least three times, which indicating the process for controlled repellent or inactivation of bacteria, fungi, or viruses can be converted at least three times.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 10, 2022
    Inventors: Liqiu Wang, Ying Chu
  • Patent number: 11494117
    Abstract: A method for data processing, comprising updating intermediate storage information according to data to be processed and address information of the data to be processed in a first storage space, until the intermediate storage information has reached a preset size; and performing, in the first storage space, an operation corresponding to the data to be processed using the intermediate storage information, when the intermediate storage information reaches the preset size. By the above method, the computing cost for performing an operation corresponding to the data to be processed in the first storage space can be reduced, the efficiency in performing the corresponding operation can be improved, and with intermediate storage information adapted to the first storage spaces of different sizes, the number of operations on the first storage spaces can be reduced.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: November 8, 2022
    Assignee: INNOGRIT TECHNOLOGIES CO., LTD.
    Inventors: Ying Chu, Wei Chou, Qian Cheng, Cheng-Yun Hsu, Qun Zhao
  • Patent number: 11460255
    Abstract: A vapor chamber device and a manufacturing method are disclosed. The vapor chamber has a housing and multiple independent chambers. The housing includes two shells opposite to each other. The independent chambers are formed between the two shells. Each independent chamber contains a working fluid and has at least one diversion bump and a capillary structure. The diversion bump is formed on an inner surface of the second shell, and the capillary structure is mounted on the diversion bump. When the vapor chamber device is vertically mounted to a heat source, the independent chambers at an upper portion of the vapor chamber device still contain the working fluid. The working fluid in the independent chambers may not all flow to a bottom of the vapor chamber device. Therefore, a contact area between the working fluid and the heat source is increased and heat dissipation efficiency is improved.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: October 4, 2022
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Pu-Ju Lin, Ying-Chu Chen, Wei-Ci Ye, Chi-Hai Kuo, Cheng-Ta Ko
  • Publication number: 20220250051
    Abstract: A multi-channel pipetting assembly includes a linkage member and a plurality of pipetting structures arranged in parallel. Each pipetting structure includes a pipette body, a piston rod, a piston tube, and an elastic element. The pipette body has a plurality of air chambers with different inner diameters, and the air chambers are arranged axially and communicate with each other. The piston rod is fixed to the linkage member. The piston tube is sleeved on the piston rod. The piston rod and the piston tube are located in the pipette body, and are axially and reciprocatingly movable in the pipette body. The piston rod matches the air chamber with the smallest inner diameter, and the piston tube matches the remaining air chambers. The elastic element is telescopically sleeved on the piston rod and corresponds to the piston tube. Therefore, a plurality of volume ranges meeting the accuracy requirements can be provided.
    Type: Application
    Filed: April 29, 2021
    Publication date: August 11, 2022
    Inventors: Chi-Neng Weng, Chih-Kuan Lin, Shao-Wei Peng, Chih-Ying Chu