Patents by Inventor Ying-Jui Huang

Ying-Jui Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160254239
    Abstract: A method of manufacturing micro pins includes forming a release layer over a substrate. A pattern layer is formed over the release layer, in which the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer. A plurality of micro pins are respectively formed in the openings. The pattern layer and the release layer are removed to obtain the micro pins. An isolated conductive micro pin for connecting one or more components is also provided.
    Type: Application
    Filed: February 26, 2015
    Publication date: September 1, 2016
    Inventors: Ying-Jui HUANG, Chung-Shi LIU, Hsin-Hung LIAO, Chien-Ling HWANG
  • Patent number: 9425179
    Abstract: Chip packages and methods of manufacture thereof are described. In an embodiment, a method for manufacturing a chip package may include: providing a support structure including: a base; and a stage pivotably attached to the base, the stage having a surface facing away from the base; attaching a first die having at least one second die disposed thereon to the surface of the stage; pivotably tilting the stage; and after the pivotably tilting, dispensing an underfill over the first die and adjacent to the least one second die, the underfill flowing through a first standoff gap disposed between the first die and the at least one second die.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: August 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Pei-Hsuan Lee, Ying-Jui Huang, Yeong-Jyh Lin, Chung-Shi Liu
  • Publication number: 20160240451
    Abstract: A semiconductor package includes a carrier, at least and adhesive portion, a plurality of micro pins and a die. The carrier has a first surface and second surface opposite to the first surface. The adhesive portion is disposed on the first surface, and the plurality of the micro pins is disposed in the adhesive portions. The die is disposed on the remaining adhesive portion free of the micro pins.
    Type: Application
    Filed: February 13, 2015
    Publication date: August 18, 2016
    Inventors: Chien-Ling HWANG, Bor-Ping JANG, Chung-Shi LIU, Hsin-Hung LIAO, Ying-Jui HUANG
  • Publication number: 20160060953
    Abstract: A waterproof door is rotatably fixed on a housing. The housing defines an opening. The waterproof door is sealed on the opening, which comprises a cap assembly and a sealed assembly mounted on the cap assembly. The cap assembly is rotatably coupled to the housing, which comprises a handle and an extruding block mounted on the handle. The handle and the extruding block are located at two sides of the cap assembly. The sealed assembly comprises a first board and a second board. The first board comprises a support and a gasket ring surrounding the support. The second board located between the extruding block and the support, which comprises a cam comprising a first ending and a second ending opposite to the first ending.
    Type: Application
    Filed: September 1, 2015
    Publication date: March 3, 2016
    Inventor: YING-JUI HUANG
  • Publication number: 20160064355
    Abstract: A chip package may include: a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die.
    Type: Application
    Filed: August 29, 2014
    Publication date: March 3, 2016
    Inventors: Kuo Lung Pan, Ying-Jui Huang, Yu-Feng Chen, Chen-Shien Chen
  • Publication number: 20160064367
    Abstract: Chip packages and methods of manufacture thereof are described. In an embodiment, a method for manufacturing a chip package may include: providing a support structure including: a base; and a stage pivotably attached to the base, the stage having a surface facing away from the base; attaching a first die having at least one second die disposed thereon to the surface of the stage; pivotably tilting the stage; and after the pivotably tilting, dispensing an underfill over the first die and adjacent to the least one second die, the underfill flowing through a first standoff gap disposed between the first die and the at least one second die.
    Type: Application
    Filed: August 29, 2014
    Publication date: March 3, 2016
    Inventors: Chien Ling Hwang, Pei-Hsuan Lee, Ying-Jui Huang, Yeong-Jyh Lin, Chung-Shi Liu
  • Publication number: 20160066444
    Abstract: A connector in an electronic device includes a case, a supporting element, and an elastic element. The case defines a through hole and a plurality of latching portions protruding from an inner surface of the case surrounding the through hole. The latching portions include an engaging surface and a guiding surface adjacent to the engaging surface. The supporting element is partially received in the through hole. The supporting element includes terminal recesses and resisting pieces engaging with the engaging surface. The elastic element is partially received in the supporting element and supplied a resilient force. When the supporting element is moved away from the case, the resisting piece is separated from the engaging surface to make contact with the guiding surface under the resilient force. If reassembly of the connector contacts is not in the predetermined order the electronic device will be locked down.
    Type: Application
    Filed: August 19, 2015
    Publication date: March 3, 2016
    Inventors: CHIH-HSIANG FAN, YING-JUI HUANG
  • Publication number: 20160055355
    Abstract: An anti-tamper device for preventing data from being tampered with by an unauthorized person includes a top cover, a bottom cover, a printed circuit board (PCB), and a signal connector. The bottom cover is assembled to the top cover. The PCB is provided with a plurality of pads. The signal connector is fixed to the top cover, and the signal connector defines a plurality of terminal grooves. At least one of the terminal grooves receives a terminal. When the terminal is electrically connected with the pads for the first time, a first relation signal is generated for initializing the anti-tamper device. When the terminal is electrically disconnected from the pads and the terminal is electrically connected with the pads for the second relation signal. If the second relation signal is different from the first relation signal, the anti-tamper device is prevented from being initialized.
    Type: Application
    Filed: October 28, 2014
    Publication date: February 25, 2016
    Inventor: YING-JUI HUANG
  • Publication number: 20160055356
    Abstract: An anti-data theft structure in an electronic device includes a second cover, a printed circuit board (PCB), a connector, a plurality of terminals, and an elastic element. The PCB includes a first press piece. The connector is rotatably coupled to the second cover and defines a plurality of slots facing PCB. A number of terminals are received in the slots according to a predetermined order. The elastic element is located between the connector and the second cover. When the first press piece resists against connector, the terminals are electrically coupled to the PCB to allow normal working When the first press piece is separated from the connector, the connector is rotated away under the elastic force to cause the terminals to fall from the slots. Reassembly of the connector contacts so as not to be in the predetemined order causes lockdown and lockout of the electronic device.
    Type: Application
    Filed: August 13, 2015
    Publication date: February 25, 2016
    Inventor: YING-JUI HUANG
  • Patent number: 9271410
    Abstract: An anti-tamper device for preventing data from being tampered with by an unauthorized person includes a top cover, a bottom cover, a printed circuit board (PCB), and a signal connector. The bottom cover is assembled to the top cover. The PCB has a plurality of terminal couplers. The signal connector is fastened to the top cover, and the signal connector defines a plurality of terminal grooves. At least one of the terminal grooves receives a terminal. When the terminals are electrically connected to the terminal couplers, a first relation signal is generated to enable the anti-tamper device. When the terminals are not connected to the corresponding terminal couplers, a second relation signal different from the first relation signal is generated by the PCB to make the anti-tamper device unable to work.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: February 23, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Sheng-Yen Lin, Ying-Jui Huang
  • Patent number: 9253906
    Abstract: A cover with an opening structure includes an enclosure defining an opening, a cover rotatably mounted to the enclosure, and a driver mounted in the enclosure. The cover is engaged with the enclosure to cover the opening. The enclosure includes a holder defining a first slot. The first slot includes a first position and a second position. The cover includes a connecting arm, a camshaft and a pivot protruding from opposite sides of the connecting arm, and the pivot is slidably located in the first slot. When the cover is covering the opening, the pivot is located at the first position, and the diver resists the camshaft elastically. When the cover is disengaged from the enclosure, the pivot is driven by release of elasticity to slide from the first position to the second position to rotate the cover to open.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: February 2, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Ying-Jui Huang
  • Publication number: 20150351269
    Abstract: A cover operation mechanism includes a case, a cover rotatably coupled to the case, a positioning portion located on the case, and a driver engaged with the positioning portion. The case includes a receiving portion. The cover covers the receiving portion and includes a shaft slidable and mounted in the slot. The driver includes an elastic element. When the cover is covered on the receiving portion, the driver drives the shaft to make the elastic element generate an elastic force. When the cover is disengaged from the receiving portion by an external force, the elastic force drives the shaft to be moved from one end to an opposite end of the slot to open the cover.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 3, 2015
    Inventor: YING-JUI HUANG
  • Publication number: 20150333033
    Abstract: A method includes moving a first bond head along a first guide apparatus for a first loop. The first guide apparatus is configured in a ring shape. The method also includes picking up a first die using the first bond head during the first loop, and aligning the first die with a first package substrate. The aligning the first die with the first package substrate includes moving the first package substrate in a first direction and a second direction. The first direction and the second direction are contained in a first plane parallel to the first loop. The method further includes placing the first die over the first package substrate during the first loop.
    Type: Application
    Filed: July 28, 2015
    Publication date: November 19, 2015
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Yi-Li Hsiao
  • Publication number: 20150313027
    Abstract: An anti-tamper device for preventing data from being tampered with by an unauthorized person includes a top cover, a bottom cover, a printed circuit board (PCB), and a signal connector. The bottom cover is assembled to the top cover. The PCB has a plurality of terminal couplers. The signal connector is fastened to the top cover, and the signal connector defines a plurality of terminal grooves. At least one of the terminal grooves receives a terminal. When the terminals are electrically connected to the terminal couplers, a first relation signal is generated to enable the anti-tamper device. When the terminals are not connected to the corresponding terminal couplers, a second relation signal different from the first relation signal is generated by the PCB to make the anti-tamper device unable to work.
    Type: Application
    Filed: October 28, 2014
    Publication date: October 29, 2015
    Inventors: SHENG-YEN LIN, YING-JUI HUANG
  • Publication number: 20150257292
    Abstract: A cover with an opening structure includes an enclosure defining an opening, a cover rotatably mounted to the enclosure, and a driver mounted in the enclosure. The cover is engaged with the enclosure to cover the opening. The enclosure includes a holder defining a first slot. The first slot includes a first position and a second position. The cover includes a connecting arm, a camshaft and a pivot protruding from opposite sides of the connecting arm, and the pivot is slidably located in the first slot. When the cover is covering the opening, the pivot is located at the first position, and the diver resists the camshaft elastically. When the cover is disengaged from the enclosure, the pivot is driven by release of elasticity to slide from the first position to the second position to rotate the cover to open.
    Type: Application
    Filed: September 29, 2014
    Publication date: September 10, 2015
    Inventor: YING-JUI HUANG
  • Patent number: 9105760
    Abstract: An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: August 11, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Yi-Li Hsiao
  • Patent number: 9106084
    Abstract: A charger for charging an electronic device includes a main body, a latching mechanism, and a number of connecting pins. The main body defines a receiving groove for receiving a part of the electronic device. An opening is defined in a bottom wall of the receiving groove. A receiving slot is defined in one of two opposite major sidewalls of the receiving groove. The latching mechanism is pivotally connected to the main body. The latching mechanism includes an abutting portion received in the opening, and a fastening portion extending upwardly from the abutting portion. A post protrudes from a top face of the abutting portion. The connecting pins are disposed at the fastening portion. The electronic device includes a number of connecting pins for electrically contacting the connecting pins of the charger, and an external protrusion for abutting against the post of the charger.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: August 11, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Ying-Jui Huang
  • Patent number: 8964120
    Abstract: A storage medium disposed in a television is provided. A code of a television software system is stored in the storage medium. The television software system includes a first application, a second application and an application management module. The first application has a first function library. The second application has a second function library different from the first function library. The application management module manages the first application and the second application according to the first function library and the second function library, respectively.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: February 24, 2015
    Assignee: MStar Semiconductor, Inc.
    Inventors: Ying-Jui Huang, Yi-Wei Huang, Wen-Jin Tien
  • Publication number: 20140363966
    Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular, or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
    Type: Application
    Filed: August 25, 2014
    Publication date: December 11, 2014
    Inventors: Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang, Ying-Jui Huang, De-Yuan Lu
  • Publication number: 20140320066
    Abstract: A charger for charging an electronic device includes a main body, a latching mechanism, and a number of connecting pins. The main body defines a receiving groove for receiving a part of the electronic device. An opening is defined in a bottom wall of the receiving groove. A receiving slot is defined in one of two opposite major sidewalls of the receiving groove. The latching mechanism is pivotally connected to the main body. The latching mechanism includes an abutting portion received in the opening, and a fastening portion extending upwardly from the abutting portion. A post protrudes from a top face of the abutting portion. The connecting pins are disposed at the fastening portion. The electronic device includes a number of connecting pins for electrically contacting the connecting pins of the charger, and an external protrusion for abutting against the post of the charger.
    Type: Application
    Filed: August 22, 2013
    Publication date: October 30, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: YING-JUI HUANG