Abstract: A light-emitting diode, includes a substrate; a semiconductor stack formed on the substrate; a first current blocking patterned structure and a second current blocking patterned structure formed on the semiconductor stack and separated from each other; and a plurality of electrodes formed on the semiconductor stack and electrically connected to the semiconductor stack; wherein the first current blocking patterned structure is overlapped with one of the plurality of electrodes and the second current blocking patterned structure is not overlapped with the plurality of electrodes.

Abstract: A system and method for providing an autologous bio-filler to a patient is provided. The method includes harvesting dermal columns from a harvesting site and mincing the dermal columns into microsegments, where the microsegments form the autologous bio-filler. The method also includes injecting the autologous bio-filler into a recipient site of the patient.

Abstract: A display panel includes: a base substrate; and a plurality of pixels on the base substrate, the plurality of pixels including a first pixel and a second pixel. The first pixel includes a first light-transmitting area and a first display area sequentially arranged in a first direction, and the second pixel includes a second light-transmitting area and a second display area sequentially arranged in the first direction. The first pixel and the second pixel are adjacent in a second direction, and the first light-transmitting area and the second light-transmitting area are adjacent in the second direction. The display panel further includes: a first gate line and a second gate line both arranged between the first light-transmitting area and the second light-transmitting area. The first light-transmitting area is contiguous to the first gate line, and the second light-transmitting area is contiguous to the second gate line.

Abstract: A process flow for bonding a die to a substrate incorporates defectivity risk management and yield promotion by reducing flow complexity. In some embodiments, the process flow may include a radiation process on a component substrate to weaken an adhesive bonding of dies from a surface of the component substrate, a first wet clean process on the component substrate after the radiation process to clean die bonding surfaces, eject and pick processes after performing the first wet clean process to remove dies from the component substrate for bonding to a substrate, a plasma activation process on the substrate, a second wet clean process after the plasma activation process on the substrate to clean a substrate bonding surface of the substrate, and a hybrid bonding process to bond die bonding surfaces of the dies to the substrate bonding surface of the substrate.

Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: The present disclosure related to a multilayer composite that may include a first polymethylpentene (TPX) liner, and a silicone-based foam layer overlying the first TPX liner. The silicone-based foam layer may include a component A and a component B, where the component A may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, and a third filler component that may include calcium carbonate, and where the component B may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, a third filler component that may include calcium carbonate, and a fourth filler component that may include zinc borate. The silicone-based foam layer may have a V-0 flammability rating as measured according to ASTM D3801.

Abstract: The present disclosure related to a silicone-based foam may include a component A and a component B, where the component A may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, and a third filler component that may include calcium carbonate, and where the component B may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, a third filler component that may include calcium carbonate, and a fourth filler component that may include zinc borate. The silicone-based foam may have a V-0 flammability rating as measured according to ASTM D3801.

Abstract: A method produces tantalum powder. The method includes: (1) uniformly mixing a tantalum powder raw material, metal magnesium and at least one alkali metal and/or alkaline earth metal halide, loading the mixture into a container, and putting the container in a furnace; (2) raising the temperature of the furnace to 600-1200° C. in the presence of inert gas, and soaking; (3) at the end of soaking, lowering the temperature of the furnace to 600-800° C., vacuumizing the interior of the furnace to 10 Pa or less, soaking under the negative pressure so that the excessive metal is separated; (4) thereafter, raising the temperature of the furnace to 750-1200° C. in the presence of inert gas, and soaking so that the tantalum powder is sintered in the molten salt after oxygen reduction; (5) then cooling to room temperature and passivating to obtain a mixed material containing halide and tantalum powder; and (6) separating the tantalum powder from the resulting mixture.

Abstract: A local amplifier circuit includes write control transistors, configured to connect, based on write enable signal, global data line to local data line; column selection transistors, configured to connect, based on column selection signal, bit line to local data line; first control PMOS transistor having gate connected to local data line, one of source or drain connected to global data line, and the other one connected to read control transistor; and second control PMOS transistor having gate connected to complementary local data line, one of source or drain connected to complementary global data line, and the other one connected to read control transistor. Read control transistors are configured to pull up or down levels at terminals of first control PMOS transistor and second control PMOS transistor, each of which is source or drain connected to a respective one of read control transistors, to preset level based on read enable signal.

Abstract: A low-carbon, high-purity tantalum pentoxide powder has a carbon content of no greater than 15 ppm. A preparation method for the powder includes: (1) adding a fluotantalic acid (H2TaF7) solution into a reaction kettle, controlling the temperature of the reaction kettle at 30-60° C., adding a precipitator until the pH of the reaction solution is 8-10, then stopping introducing ammonia, and aging to obtain a tantalum hydroxide slurry; (2) filtering and washing the slurry obtained in step (1), and then carrying out solid-liquid separation to obtain a tantalum hydroxide filter cake; (3) drying the filter cake obtained in step (2) to obtain white tantalum hydroxide powder; (4) calcining the tantalum hydroxide powder obtained in step (3), crushing and screening the calcined sample to obtain tantalum pentoxide powder; and (5) subjecting the tantalum pentoxide powder obtained in step (4) to heat treatment at a temperature of 1000-1500° C. to obtain the powder.

Abstract: A method for determining an initial bitrate for a communication includes receiving a communication request to establish a digital communication between a first user device and a second user device associated with a plurality of features including a geographical identifier identifying a geographical location associated with the first user device, a first network type connection associated with the first user device, a second network type connection associated with the second user device, and an average bitrate for a previous digital communication of the first user device. The method includes determining, using an initial bitrate predictor model configured to receive the plurality of features as feature inputs, an initial bitrate for the digital communication between the first user device and the second user device, and establishing the digital communication between the first user device and the second user device at the determined initial bitrate.

Abstract: A feeding structure is provided. The feeding structure includes a feeding unit, which includes: a reference electrode, first and second substrates opposite to each other, and a dielectric layer between the first and second substrates. The first substrate includes a first base plate and a first electrode thereon. The first electrode includes a first main body and a plurality of first branches connected to the first main body and spaced apart from each other. The second substrate includes a second base plate and a second electrode thereon. The second electrode includes a second main body and a plurality of second branches, which are connected to the second main body, spaced apart from each other, and in one-to-one correspondence with the plurality of first branches. Orthographic projections of each second branch and a corresponding first branch on the first base plate partially overlap each other.

Abstract: Embodiments of this disclosure relate to the multimedia processing field, and provide a video frame interpolation method, apparatus, and a device. In the video frame interpolation method in this disclosure, a first image at first time, a second image at second time, and sensor data captured by a dynamic vision sensor apparatus are obtained, and the sensor data includes dynamic event data between the first time and the second time. At least one target image is determined based on the first image, the second image, and the sensor data, where the at least one target image is an image corresponding to at least one target time between the first time and the second time. The dynamic event data is used to help compensate for motion information missing from existing image data. This implements accurate prediction of an intermediate image, and improves image prediction effect.

Abstract: A memory is provided. The memory includes: a storage array that includes multiple bit lines, each of the multiple bit lines is connected to multiple storage cells in the storage array; multiple column select signal units that are connected to sensitive amplifiers, the sensitive amplifiers and the multiple bit lines are disposed in one-to-one correspondence; local data buses that are divided into local data buses O and local data buses E, adjacent bit lines are electrically connected to a respective local data bus O and a respective local data bus E, respectively, through a respective sensitive amplifier and a respective column select signal unit; and a first error checking and correcting unit and a second error checking and correcting unit that are configured to check and correct errors of data.

Abstract: The present application disclosures a double production line and a rapid prefabrication process of a segmental beam. The double production line including two production machine and a track system provided on the construction ground; the production machine includes a fixed end mold, two side molds, a bottom mold trolley, a middle internal mold trolley and two side internal mold trolley; two side molds are positioned on two sides of the fixed end mold respectively, the fixed end mold and two side molds together define a pouring position with an end opening, two openings of the pouring position are arranged facing each other; the track system includes a transverse track and a longitudinal track communicated with each other, two pouring positions are both positioned in the extension path of the transverse track, and the longitudinal track is positioned between two pouring positions.

Abstract: Embodiments of process kits for use in a substrate process chamber are provided herein. A process kit for a substrate process chamber including: a cover ring configured to extend over unprotected dicing tape of a tape frame substrate during use and having a central opening configured to expose a semiconductor wafer supported on the dicing tape during use; and a metallic shield disposed adjacent to at least a portion of a lower surface of the cover ring such that the metallic shield at least partially lines the lower surface.

Abstract: A data processing method includes receiving an event data stream, where the event data stream includes at least a first event data item and a second event data item, the first event data item includes a first timestamp for obtaining the first event data item, the second event data item includes a second timestamp for obtaining the second event data item, and the second event data item is obtained most recently before obtaining the first event data item; and obtaining a compressed event data stream corresponding to the event data stream, where the compressed event data stream includes at least a first compressed event data item corresponding to the first event data item, and the first compressed event data item includes first time information.

Abstract: Provided is a method and system for predicting a height of a confined water rising zone. The method includes: obtaining sample data; dividing the sample data into a training sample and a test sample; calculating a degree of correlation between a height and a correlation factor value sequence; screening correlation factors according to the degree of correlation to obtain screened correlation factors; calculating weights of the screened correlation factors using an entropy weight method (EWM); obtaining standardized screened correlation factor value sequences according to correlation factor value sequences corresponding to the screened correlation factors; calculating a value of each indicator according to the standardized screened correlation factor value sequences and the weights; and obtaining a height prediction model of a confined water rising zone based on principal component analysis (PCA)-particle swarm optimization (PSO)-support vector regression (SVR), the value of each indicator, and the test sample.

Abstract: An image sensor structure and a method of fabricating the structure are disclosed, in image sensor structure, at least one die is bonded to pixel substrate by bonding first bonding layer to second bonding layer, and the die includes signal processing circuit and/or storage device for photosensitive elements in pixel substrate. The die is bonded to the pixel substrate so that the signal processing circuit and/or storage device is/are coupled to photosensitive elements in pixel substrate. In this way, signal processing and/or storage functions of the image sensor can be provided without additional occupation of the area of the pixel substrate, allowing for more photosensitive elements to be arranged on the pixel substrate with the same area and thus resulting in a larger photosensitive area. Moreover, less wiring is needed on the 2D plane of the pixel substrate, helping in reducing interference with signals and delays and improving imaging quality.