Abstract: A top-down construction type assembly construction method for paved road surface, including the following steps: step I, manufacturing prefabricating slabs: using a top-down method to manufacture the prefabricating slabs, and providing bolt sleeves, inside the prefabricating slabs, which are evenly arranged in the prefabricating slabs; step II, mounting the prefabricating slabs: on a lower bearing plate, placing the prefabricating slabs in one step, performing a fine tuning on a position and an altitude of the prefabricating slabs, performing a grouting construction, finally forming the paved road surface; the prefabricating slabs are manufactured by laying bricks and pouring concrete, the prefabricating slabs are rolled over and mounted, thus eliminating on-site concrete bonding between bricks and the lower bearing plate, improving overall stability of the bricks and the prefabricating slabs after being mounted, assembled mounting for a paved road surface is implemented, and the construction period is shorte

Abstract: A singulated thin film lithium containing (TFLC) photonics device, as well as a method and system for singulating the device are described. The TFLC photonics device includes a device layer and a silicon substrate. The device layer includes a TFLC layer having a depth. The device layer also has a first sawn edge. The silicon substrate has a second sawn edge and includes an upper portion and a lower portion. The upper portion has the second sawn edge that is mutually aligned with the first sawn edge. The upper portion overhangs the lower portion.

Abstract: The display substrate includes: a substrate; a plurality of pixel units on the substrate, each pixel unit includes a plurality of sub-pixels, each sub-pixel includes a light-emitting element and a pixel drive circuit; a photosensitive circuit on the substrate; a first conductive film layer on the substrate. The pixel drive circuit includes a drive transistor, a gate electrode of the drive transistor is located on a side of a drive active layer away from the substrate, an orthographic projection of the gate electrode of the drive transistor on the substrate at least partially overlaps an orthographic projection of the drive active layer on the substrate. The first conductive film layer includes a first light-shielding portion between the substrate and the drive active layer, and an orthographic projection of the first light-shielding portion on the substrate at least partially overlaps the orthographic projection of the drive active layer on the substrate.

Abstract: A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.

Abstract: A system for testing intelligent vehicles, including a test bench, a hardware-in-the-loop sub-system, a software-in-the-loop sub-system, a target-in-the-loop sub-system and a test management platform. The test bench is configured to simulate the resistance of the actual road according to the road resistance parameters, and simulate the posture of the actual road according to the road posture parameters.

Abstract: Disclosed are a display panel and a display device. The display panel includes: a base substrate; a detection circuit, located on the side of the base substrate, and including a transistor and a photosensitive detection component electrically connected to the transistor, and an orthographic projection of the transistor on the base substrate and an orthographic projection of the photosensitive detection component on the base substrate do not overlap with each other; a planarization layer, located on the side of the detection circuit facing away from the base substrate, and including a first surface facing away from the base substrate at the position in which the transistor is located, and a second surface facing away from the base substrate at the position in which the photosensitive detection component is located; and a light-emitting device, located on the side of the planarization layer away from the detection circuit.

Abstract: A chassis device is provided and includes a case and an operating assembly. The case is for installing a detachable module and includes a first pivoting component pivotally connected to the detachable module, a second pivoting component pivotally connected to the first pivoting component, and a first engaging component movably disposed on the first pivoting component and for removably engaging with a second engaging component of the detachable module. The first pivoting component is restrained from pivoting when the first engaging component engages with the second engaging component of the detachable module, and when the second pivoting component pivots, the second pivoting component pushes the first engaging component, so that the first engaging component disengages from the second engaging component of the detachable module for allowing the first pivoting component to pivot. Furthermore, a related electronic apparatus and a related operating assembly are also provided.

Abstract: A semiconductor device includes a first fin and a second fin in a first direction and aligned in the first direction over a substrate, an isolation insulating layer disposed around lower portions of the first and second fins, a first gate electrode extending in a second direction crossing the first direction and a spacer dummy gate layer, and a source/drain epitaxial layer in a source/drain space in the first fin. The source/drain epitaxial layer is adjacent to the first gate electrode and the spacer dummy gate layer with gate sidewall spacers disposed therebetween, and the spacer dummy gate layer includes one selected from the group consisting of silicon nitride, silicon oxynitride, silicon carbon nitride, and silicon carbon oxynitride.

Abstract: A communication method and a communication apparatus are provided. The method includes: A first device receives first information, determines a target TR pattern based on the first information, and sends information or demodulates received information based on the target TR pattern, where the target TR pattern is a sub-pattern of a longest TR pattern, and the longest TR pattern includes a set of sub-carriers used as reserved tones. The longest TR pattern may include a plurality of TR sub-patterns of different lengths. For example, a first TR pattern of a first length is a sub-pattern of the longest TR pattern, and a second TR pattern of a second length is also a subset of the longest TR pattern. The TR sub-patterns of different lengths may correspond to different carrier bandwidths or quantities of RBs.

Abstract: The present disclosure provides a memory device, a memory system, and an operation method of a memory device, and relates to the technical field of semiconductor chips. The memory device includes a memory cell array including a source layer, a bottom select gate layer, and a gate layer, and the bottom select gate layer is located between the source layer and the gate layer, wherein the bottom select gate layer includes a plurality of bottom select gates, and a bottom select gate of a first memory string and a bottom select gate of a second memory string are connected with a same select line; and a peripheral circuit coupled to the memory cell array, wherein the peripheral circuit is configured to apply a selection voltage to the select line to control the first memory string and the second memory string.

Abstract: According to one aspect, a method of operating a memory is provided. The method may include applying a first power supply voltage to a common source during a program precharge process. The method may include applying a first voltage to a first bottom gate line and applying a second voltage to a second bottom gate line starting at a first moment of the program precharge process. The method may include applying a second power supply voltage to the first bottom gate line and applying a third voltage to the second bottom gate line after the first moment of the program precharge process.

Abstract: The present disclosure provides a method for operating a memory, a memory and a memory system, and relates to the technical field of semiconductor chip. The method includes: during the erase phase, applying an erase voltage to the word line, and applying an erase voltage to the select line coupled to a target select gate; during the program phase for select gate, applying a pass voltage to the word line, and applying a program voltage to the select line coupled to the target select gate.

Abstract: A baculovirus vector and a use thereof in the preparation of a recombinant adeno-associated virus (rAAV) in an insect cell are provided. The baculovirus vector includes an exogenous gene expression cassette and a stable sequence. The stable sequence is located at a site 5 kb or less from the exogenous gene expression cassette, and the stable sequence is a conserved noncoding element (CNE) sequence or a nucleocapsid assembly-essential element (NAE) sequence. When an insect cell is infected with a recombinant baculovirus (rBV) constructed in this way, after multiple continuous passages, production levels of the rBV and the rAAV still remain relatively stable.

Abstract: A disconnection mechanism, for engaging or disengaging a fixed component and a movable component arranged on a first shaft extending in a first direction. The disconnection mechanism includes a shift fork, connected to the movable component, and constructed to be able to reciprocate linearly in the first direction, so that the movable component is engaged with or disengaged from the fixed component. An actuator includes an output end which rotates about a rotation axis of the actuator at a distance from the rotation axis. A drive rod has a first end rotatably connected to the output end and a second end rotatably connected to the shift fork, so that the output end, when rotating, is able to drive the shift fork to reciprocate linearly.

Abstract: A video memory allocation method and apparatus, and a medium and an electronic device are provided. The method includes: determining a usage capacity of a physical video memory in response to receiving a first call request of an application program for a video memory allocation interface in a target video memory management link library; if a sum of the usage capacity and an applied capacity corresponding to the first call request is greater than a total capacity of the physical video memory, generating a second call request for calling a memory hosting interface according to the first call request, and calling the memory hosting interface based on the second call request; and obtaining a response of the first call request according to a calling result of the second call request.

Abstract: Provided is a liquid crystal display panel. The liquid crystal display panel includes: a first substrate and a second substrate that are opposite to each other, and a liquid crystal layer between the first substrate and the second substrate. The liquid crystal display panel includes a plurality of sub-pixel regions. Each of the plurality of sub-pixel regions includes 4N sub-pixel sub-regions arranged in a single column, and the 4N sub-pixel sub-regions are organized into one group, or a plurality of groups that are adjacent to each other. A same group of sub-pixel sub-regions includes two first sub-regions and two second sub-regions. N is an integer greater than or equal to 1.

Abstract: Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

Abstract: The present disclosure provides an optical element driving mechanism, which includes a movable part, a fixed assembly, and a driving assembly. The movable part is configured to be connected to an optical element. The fixed assembly has an opening for allowing a light beam along an optical axis to pass, and the movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly. The optical element driving mechanism further includes a recovery assembly configured to position the movable part in a first position when the movable part is not driven by the driving assembly.

Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

Abstract: A method for providing document category recommendations may include training a machine learning algorithm; receiving, from a user, a selection of an anchor document; retrieving a user co-viewing sequence; generating, via the trained machine learning algorithm, a sequence embeddings set based on the anchor document and the user co-viewing sequence; comparing the generated embeddings set to respective embeddings for a plurality of candidate sets; determining the candidate set closest to the generated embeddings; and presenting at least one category from the closest candidate set.