Patents by Inventor Ying Wang

Ying Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11949142
    Abstract: A feeding structure is provided, which includes first and second substrates opposite to each other, a reference electrode, and a dielectric layer between the first and second substrates. The first substrate includes a coupling branch and a delay branch, which are respectively connected to two output terminals of a power divider and form a current loop with the reference electrode, on a side of a first base plate proximal to the dielectric layer. The second substrate includes a receiving electrode on a side of a second base plate proximal to the dielectric layer, the receiving electrode and the coupling branch form a coupling structure, and their orthographic projections on the first base plate at least partially overlap each other. A length of an orthographic projection of both the coupling branch and the receiving electrode on the first base plate is different from a length of the delay branch.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: April 2, 2024
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Haocheng Jia, Tienlun Ting, Ying Wang, Jie Wu, Liang Li, Cuiwei Tang, Qiangqiang Li
  • Publication number: 20240104030
    Abstract: A data bus coupled to a plurality of memory devices is determined to be in a read mode. Responsive to determining that the data bus is in the read mode, a particular read operation identified in a particular memory queue of memory queues that include identifiers of one or more write operations and identifiers of one or more read operations is determined. The particular memory queue includes a highest number of read operations for a memory device of the memory devices. The particular read operation is transmitted from the particular memory queue over the data bus.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Wei Wang, Jiangli Zhu, Ying Yu Tai, Samir Mittal
  • Publication number: 20240106069
    Abstract: A battery module and an electric vehicle are provided by the present application. The battery module includes a case body and at least one tray; at least one exhaust port is defined in the case body, at least one tray mounting cavity is defined in the case body, and the case body includes a first mounting surface surrounding a periphery of the tray; the tray is disposed in the tray mounting cavity to divide the tray mounting cavity into a cell accommodating cavity located above the tray and a pressure relief cavity located below the tray, the tray is provided with through holes facing battery cells, the pressure relief cavity is communicated with the through holes and the exhaust port, respectively, and the cell accommodating cavity is configured to accommodate the battery cells; the tray includes a second mounting surface, and the second mounting surface abuts against the first mounting surface.
    Type: Application
    Filed: October 11, 2022
    Publication date: March 28, 2024
    Applicant: EVE POWER CO., LTD.
    Inventors: Fan Li, Ying Huang, Zhaohai Chen, Zhiwei Chen, Wencong Qiu, Yan Rao, Honghu Wang, Shuxian Chen
  • Patent number: 11938476
    Abstract: A biochemical analysis system capable of sample preparation and processing can include at least one inlet channel having a non-fouling, slippery surface to autonomously transport a fluid sample to a chamber by a geometry of the at least one inlet channel. The at least one inlet channel can include a first end, which is open and exposed, and a second end connected to the chamber for mixing and reaction of the fluid sample, and the at least one inlet channel can include a converging or diverging angle.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: March 26, 2024
    Assignee: The Penn State Research Foundation
    Inventors: Pak Kin Wong, Tak-Sing Wong, Jing Wang, Hui Li, Yi Lu, Ying Wan
  • Patent number: 11942277
    Abstract: A method of manufacturing a semiconductor structure includes: forming a first oxide layer over a landing pad layer; forming a middle patterned dielectric layer over the first oxide layer; sequentially forming a second oxide layer and a top dielectric layer over the middle patterned dielectric layer; forming a trench through the top dielectric layer, the second oxide layer and the first oxide layer; conformally forming a bottom conductive layer in the trench; removing a portion of the top dielectric layer adjacent to the trench to expose a portion of the second oxide layer beneath the portion of the top dielectric layer; and performing an etching process to remove the second oxide layer and the first oxide layer. A semiconductor structure is also provided.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: March 26, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Mao-Ying Wang, Yu-Ting Lin
  • Patent number: 11943939
    Abstract: An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Kai Hsu, Jerry Chang Jui Kao, Chin-Shen Lin, Ming-Tao Yu, Tzu-Ying Lin, Chung-Hsing Wang
  • Patent number: 11943918
    Abstract: A memory structure is provided in the present disclosure. The memory structure includes a substrate, a plurality of discrete memory gate structures on the substrate where each of the plurality of memory gate structures includes a floating gate layer and a control gate layer on the floating gate layer, an isolation layer formed between adjacent memory gate structures where a top surface of the isolation layer is lower than a top surface of the control gate layer and higher than a bottom surface of the control gate layer, an opening is formed on an exposed sidewall of the control gate layer, and a bottom of the opening is lower than or coplanar with the top surface of the isolation layer, and a metal silicide layer on an exposed surface of the control gate layer and the top surface of the isolation layer.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: March 26, 2024
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Liang Han, Hai Ying Wang
  • Patent number: 11940998
    Abstract: This disclosure provides a computer-implemented method, a computer system and a computer program product for database compression oriented to combinations of fields of a database record. One or more combinations of fields of a record of a database are determined that satisfy a frequency criterion indicating that access frequencies of the one or more combinations of fields are higher than an access frequency threshold. The record is reorganized based on the one or more combinations of fields to store fields of each combination of the one or more combinations of fields in a respective contiguous storage space. The reorganized record is compressed by applying a compression scheme to the one or more combinations of fields.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: March 26, 2024
    Assignee: International Business Machines Corporation
    Inventors: Ying Zhang, Xiaobo Wang, Shuo Li, Sheng Yan Sun
  • Patent number: 11938469
    Abstract: A transparent ceramic substrate is covered by a photocatalyst layer, at least partially. The photocatalyst layer includes a semiconductor material that, upon exposure to electromagnetic radiation, forms a plurality of electrons and a plurality of holes that remain confined to the photocatalyst layer. The transparent ceramic substrate has a diameter that is larger than the wavelength of the electromagnetic radiation for light trapping.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: March 26, 2024
    Assignees: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Yifeng Wang, Ying-Bing Jiang
  • Patent number: 11942425
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor substrate, a contact structure, a first conductive element, and a first dielectric spacer structure. The semiconductor substrate includes an active region and an isolation structure. The contact structure is on the active region of the semiconductor substrate. The first conductive element is on the isolation structure of the semiconductor substrate. The first dielectric spacer structure is between the contact structure and the first to conductive element. The first dielectric spacer structure has a first concave surface facing the first conductive element.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: March 26, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Chih-Ying Tsai, Jui-Seng Wang, Yi-Yi Chen
  • Patent number: 11942784
    Abstract: The present invention discloses a method and device for formulating a coordinated action strategy of SSTS and DVR for voltage sag mitigation. The influence of voltage sag on a whole industrial process of a sensitive user is analyzed, and the sensitive loads of SSTS and DVR which satisfy a governance need are grouped; a practical governance scenario of installing a plurality of DVR is considered to install a minimum-capacity DVR to realize a target of a minimum interruption probability of the whole industrial process of the user; an optimal coordinated governance solution of SSTS and DVR based on sensitive load grouping is proposed; a classification result is obtained for duration time at a time when a voltage sag event occurs through a decision tree constructed based on historical data.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: March 26, 2024
    Assignee: Sichuan University
    Inventors: Ying Wang, Man Wang, Xianyong Xiao, Wenxi Hu, Yang Wang, Zixuan Zheng, Yunzhu Chen
  • Publication number: 20240097520
    Abstract: An axial flux motor includes a rotor assembly and a stator assembly. The rotor assembly has magnets. The stator assembly has a circuit substrate, segmented iron cores, and a coil. The circuit substrate extends radially. The segmented iron cores are supported on the circuit substrate to be opposite to the magnet in the axial direction. Segmented iron cores arranged in the circumferential direction. A coil is sleeved on a segmented iron core. Holding seats of an insulating material correspond respectively to the segmented iron cores. A holding seat abuts with and covers a segmented iron core from both axial sides and the circumferential direction, and is used for winding the coil. The circuit substrate has slot holes. A slot hole is used for embedding and positioning a portion of a holding seat that protrudes more towards one axial side than the coil.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 21, 2024
    Inventors: Keng-Chang WU, Guo-Jhih YAN, Hsiu-Ying LIN, Kuo-Min WANG
  • Publication number: 20240093512
    Abstract: Provided are photo-curable foam-forming compositions, methods of making and using them, and a dispenser for injecting the foam-forming composition for the insulation of buildings. In one aspect, the present disclosure provides for a method of insulating a surface, such as that of a building cavity with an insulating foam, the method comprising: irradiating a foam-forming composition with light, the foam-forming composition comprising: a polymerizable component (e.g., based on epoxy or acrylate); an effective amount of a photoinitiator; and a blowing agent; and injecting the irradiated foam-forming composition adjacent the surface.
    Type: Application
    Filed: December 7, 2021
    Publication date: March 21, 2024
    Inventors: Ying Wang, Choung-Houng Lai, Nicholas David Orf, Rachel Brown, Nicky Chan
  • Publication number: 20240096664
    Abstract: Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Ruiping WANG, Ying WANG, Guan Huei SEE, Ananthkrishna JUPUDI, Praveen Kumar CHORAGUDI
  • Publication number: 20240095060
    Abstract: Systems and methods are taught for providing customers of a cloud computing service to control when updates affect the services provided to the customers. Because multiple customers share the cloud's infrastructure, each customer may have conflicting preferences for when an update and associated downtime occurs. Preventing and resolving conflicts between the preferences of multiple customers while providing them with input for scheduling a planned update may reduce the inconvenience posed by updates. Additionally, the schedule for the update may be transmitted to customers so that they can prepare for the downtime of services associated with the update.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Jiaxing ZHANG, Thomas MOSCIBRODA, Haoran WANG, Jurgen Aubrey WILLIS, Yang CHEN, Ying YAN, James E. JOHNSON, Ajay MANI
  • Publication number: 20240093030
    Abstract: The present invention provides a high-strength and high-heat-resistant bio-based polyamide composition, which consists of the following parts of materials by mass: 43.50-89.95% of bio-based polyamide resin slices; 10-50% of reinforcements; 0.01-2% of rare earth compounds; 0.01-1% of copper salt antioxidant combinations; 0.01-1% of free-radical scavengers; 0.01-0.5% of heat-conducting masterbatches; 0.01-1% of stabilizers; and 0-1% of dispersants. The advantage of the present invention is presented in that: the bio-based polyamide resin slice is prepared through a stepwise polycondensation process of pentanediamine and adipic acid, or through a stepwise polycondensation process of pentanediamine, adipic acid and terephthalic acid and the pentanediamine is prepared through fermentation of starch, so the prepared polyamide resin pertains to an environmentally-friendly engineering plastic.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 21, 2024
    Applicants: SHANGHAI PRET COMPOSITES CO., LTD., ZHEJIANG PRET ADVANCED MATERIALS CO., LTD., CHONGQING PRET NEW MATERIALS CO., LTD., SHANGHAI PRET CHEMICAL NEW MATERIALS CO., LTD
    Inventors: Haisheng ZHANG, Jianrui CHEN, Yi WANG, Ruixiang YAN, Ying CAI, Bing ZHOU, Meiling XU, Qianhui ZHANG, Qing CAI, Guoyi DU, Tinglong YAN, Wen ZHOU
  • Patent number: 11936083
    Abstract: There is provided a phase shifter including a first substrate, a second substrate and a dielectric layer between the first substrate and the second substrate, the first substrate includes a first base and a first electrode layer on a side, of the first base, the second substrate includes a second base, a second electrode layer and a reference voltage leading-in end on a side of the second base, the reference voltage leading-in end is coupled to the second electrode layer, one of the first electrode layer and the second electrode layer includes a body structure and branch structures; an orthographic projection of an end of each branch structure away from the body structure on the first base is overlapped with an orthographic projection of the second electrode layer or the first electrode layer on the first base. An antenna is further provided.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: March 19, 2024
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Cuiwei Tang, Jie Wu, Tienlun Ting, Ying Wang, Haocheng Jia, Liang Li, Qiangqiang Li, Chuncheng Che
  • Patent number: 11931389
    Abstract: The present invention provides a tablet of sporoderm-removed Ganoderma lucidum spore, which includes the following raw materials by weight parts: 13-20 parts of an aqueous extract of sporoderm-disrupted Ganoderma lucidum spore powder, 3-5 parts of sorbitol, and 0.8-1.2 parts of povidone K30; A method for preparing the tablet of sporoderm-removed Ganoderma lucidum spore includes the following steps: mixing the aqueous extract of sporoderm-disrupted Ganoderma lucidum spore powder, sorbitol and povidone K30 for 10-30 min, and subjecting the obtained mixture to granulating, screening and drying to obtain a granular material; and tableting the granular material to obtain the tablet of sporoderm-removed Ganoderma lucidum spore. The tablet of sporoderm-removed Ganoderma lucidum spore has a much higher content of active components, which are also easier to be absorbed.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: March 19, 2024
    Assignees: Zhejiang Shouxiangu Pharmaceutical Company, Ltd., Jinhua Shouxiangu Pharmaceutical Co. Ltd
    Inventors: Zhenhao Li, Mingyan Li, Ying Wang, Huaxian Zheng, Jing Xu
  • Patent number: 11931363
    Abstract: A compound of Formula (I), or a pharmaceutically acceptable salt thereof, is provided that has been shown to be useful for treating a PRC2-mediated disease or disorder: wherein R1, R2, R3, R4, R5, and n are as defined herein.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: March 19, 2024
    Assignee: NOVARTIS AG
    Inventors: Ho Man Chan, Xiang-Ju Justin Gu, Ying Huang, Ling Li, Yuan Mi, Wei Qi, Martin Sendzik, Yongfeng Sun, Long Wang, Zhengtian Yu, Hailong Zhang, Ji Yue (Jeff) Zhang, Man Zhang, Qiong Zhang, Kehao Zhao
  • Publication number: 20240087954
    Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Inventors: JING-CHENG LIN, YING-CHING SHIH, PU WANG, CHEN-HUA YU