Abstract: Nanowire devices and fin devices are formed in a first region and a second region of a substrate. To form the devices, alternating layers of a first material and a second material are formed, inner spacers are formed adjacent to the layers of the first material, and then the layers of the first material are removed to form nanowires without removing the layers of the first material within the second region. Gate structures of gate dielectrics and gate electrodes are formed within the first region and the second region in order to form the nanowire devices in the first region and the fin devices in the second region.

Abstract: The invention discloses a distributed IoT terminal system and method based on a fiber optic bus RoF. The system comprises a core application part, a pre-channel part, a transmission channel part, an acquisition field part, an acquisition terminal part and a data source. The invention adopts the principle of light-borne ROF to adapt to pan-socialization, decentralization, verticalization, refinement, full traceability, full lifecycle management and governance, instant, real-time, online, interactive and distributed IoT applications. The integrated and integrated application of the invention improves social efficiency and saves social cost. It may be integrated and integrated the application into any application systems, and realized dynamic instant, real-time, online, centimeter level positioning application. It can infer the specific location of the positioning device.

Abstract: A device, method, and processor readable storage medium for controlling travel of a vehicle. The device includes a processor and a controller; the processor is configured to set a speed curve of the vehicle according to a relative speed and distance between the vehicle and the front subject, and the controller is configured to control the vehicle to travel according to the set speed curve.

Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.

Abstract: A device, system and method for controlling an active suspension are provided. The device includes: a Micro Control Unit (MCU), an ultrasonic sensor, a vehicle wheel longitudinal acceleration sensor, and a vehicle body longitudinal acceleration sensor. The vehicle wheel longitudinal acceleration sensor acquires a vehicle wheel longitudinal acceleration signal and transmits it to the MCU. The vehicle body longitudinal acceleration sensor acquires a vehicle body longitudinal acceleration signal and transmits it to the MCU. The ultrasonic sensor excites an ultrasonic wave according to a set angle, and transmits a received echo signal to the MCU.

Abstract: A fingerprint identification module and a terminal device are provided. The fingerprint identification module includes: a decorative ring, provided with a mounting opening; an encapsulation cover, arranged on the decorative ring to close a side of the mounting opening; a fingerprint chip, disposed in the mounting opening, a space is formed between an outer side surface of the fingerprint chip and an inner wall surface of the decorative ring; a protective film, disposed on a side of the fingerprint chip that is towards the encapsulation cover; and a flexible printed circuit (FPC) board, disposed inside the mounting opening, the protective film covers a first partial area of the FPC board, and a second partial area of the FPC board is exposed out of the protective film; the second partial area is an area of the FPC board which is different from the first partial area of the FPC board.

Abstract: A constant temperature circular accelerated loading test system includes: a chassis; a motor reducer and a circular loading wheel group in the middle of the chassis, wherein the motor reducer provides power for the circular loading wheel group, and the circular loading wheel group implements a rolling test on a ground during rotation; a thermally insulated assembly on the chassis, the circular loading wheel group is located in a thermally insulated inner cavity of the thermally insulated assembly; a constant temperature unit on the chassis; a control cabinet on the chassis, wherein the control cabinet is connected to and controls the constant temperature unit and the motor reducer, respectively.

Abstract: A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Abstract: A method includes forming a dielectric layer over a first surface of a semiconductor layer, the dielectric layer including a metallization layer. The method includes forming an opening to expose a portion of the dielectric layer. The method includes forming a buffer oxide layer lining the opening. The method includes forming, according to a patternable layer, a recess in the buffer oxide layer partially extending from a second surface of the buffer oxide layer. The method includes removing the patternable layer. The method includes extending the recess through the buffer oxide layer and a portion of the dielectric layer to expose a portion of the metallization layer. The method includes filling the recess with a conductive material to form a pad structure configured to provide electrical connection to the metallization layer.

Abstract: Provided are a photoelectric chip, a manufacturing method and an installation method, which relate to the field of optical communication and transmission technologies. The chip is provided with a light-splitting groove (3), and the light-splitting groove (3) runs through an absorption layer (2) of the chip; the back of the chip is a light-entering side; the light-splitting groove (3) is configured to transmit and split out part (151) of incident light (15), and the other part (152) of the incident light (15) enters the absorption layer (2) for photovoltaic conversion. The photoelectric chip can split light and monitor optical power of the incident light.

Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.

Abstract: In one embodiment, a set of two or more workflow definitions is stored, wherein each workflow definition describes a workflow of an application. The set of two or more workflow definitions are used to implement a state machine of the application based at least in part on the two or more workflow definitions.

Abstract: A multi-spoke-type ultrasonic motor has: a rotating shaft (1), a fastening sleeve cylinder (2), a spring (3), a rotor (4), a stator (5), a fastening screw (6), and piezoelectric ceramics (7). The rotor (4), the stator (5), the spring (3), and the fastening sleeve cylinder (2) are sequentially connected via the rotating shaft (1). The stator (5) is an annular metal plate having internal spoke-like teeth. The upper surface and the lower surface of the stator (5) are provided with identical stator spoke-like teeth for contacting the rotor (4). The rotor (4) and the stator (5) are in close contact under the effect of prestressing of the spring (3). The piezoelectric ceramics (7) are annular plates; upper and lower plates respectively are affixed on the upper and lower surfaces of the stator (5). The motor is capable of increasing the output power of the ultrasonic motor.

Abstract: While displaying the conversation interface of an instant messaging conversation between a first user and a second user, a first client device receives a user request for generating a virtual-item-package. The first client device replaces display of the conversation interface with a virtual-item-package generation interface, including: if the request is for generating a media enhanced virtual-item-package, presenting an affordance for recording an audio and/or video message concurrently with one or more input fields for entering one or more virtual-item-package parameters in the virtual-item-package generation interface; and if the request is for generating a textual virtual-item-package, presenting a text input field for entering a textual message concurrently with the one or more input fields for entering the one or more virtual-item-package parameters, without concurrently presenting the affordance for recording an audio and/or video message in the virtual-item-package generation interface.

Abstract: Nail sealable materials comprising a matrix material and bentonite embedded within the matrix material are described herein in accordance with non-limiting embodiments of the present disclosure. In some embodiments, the nail sealable material comprises a sufficient amount of bentonite, such that the nail sealable material passes ASTM D1970 at a specified nail sealable material test thickness. Some embodiments relate to systems and methods utilizing the nail sealable materials described herein.

Abstract: The present disclosure discloses an antimicrobial peptide Scyreprocin of Scylla paramamosain and a method thereof, wherein an amino acid sequence of the antimicrobial peptide Scyreprocin comprises a sequence shown in SEQ ID NO 01, and the antimicrobial peptide is expressed and purified by using genetic engineering technology. The recombinant antimicrobial peptide Scyreprocin has advantages of wide antimicrobial spectrum, good antimicrobial effect, and rapid germicidal rate, shows great application significance, and has good application in preparation of antimicrobial agents. The recombinant antimicrobial peptide Scyreprocin has no cytotoxicity to mouse hepatocytes AML12, human liver cells L02, and can be safely used for medical treatment or can be used as a feed composition.

Abstract: A method of manufacturing a semiconductor device includes forming a fin structure comprising alternately stacked first semiconductor layers and second semiconductor layers over a substrate. A sacrificial gate structure is formed over the fin structure. Spacers are formed on either side of the sacrificial gate structure. The sacrificial gate structure is removed to form a trench between the spacers. The first semiconductor layers are removed from the trench, while leaving the second semiconductor layers suspended in the trench. A self-assembling monolayer is formed on sidewalls of the spacers in the trench. Interfacial layers are formed encircling the suspended second semiconductor layers, respectively. A high-k dielectric layer is deposited at a faster deposition rate on the interfacial layers than on the self-assembling monolayer. A metal gate structure is formed over the high-k dielectric layer.

Abstract: In one embodiment, a method includes accessing an input vector representing an input post, wherein: the vector space comprises clusters each associated with a topic; each cluster was determined based on a clustering of training-page vectors corresponding to training pages that each comprise training posts, each training post submitted by a user to a training page and comprises content selected by the user; and each training-page vector was generated by an ANN that was trained, based on the training posts of training pages associated with the ANN, to receive a post and then output a probability that the received post is related to the training posts of the training pages; determining that the input vector is located within a particular cluster in the vector space; and determining a topic of the input post based on the topic associated with the particular cluster that the input vector is located within.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a semiconductor substrate having a first surface and a first optical coupler disposed on the first surface of the semiconductor substrate. The first optical coupler includes a first surface facing away from the first surface of the semiconductor substrate and a first lateral surface connected to the first surface of the first optical coupler. The first surface of the first optical coupler and the first lateral surface of the optical coupler define an angle greater than 90 degrees. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: Method of improving tissue integrity of tissue that functions as a barrier are provided. Method of protecting and maintaining tissue integrity of tissue that functions as a barrier are provided. Method of repairing damage to tissue that functions as a barrier, and to restoring and improving function of such damaged tissue are provided. Methods of improving, maintaining, protecting, repairing and/or restoring the integrity of tissue which functions as a barrier and repair of damage to and healing of wounds to such tissue improves, maintains, protects, repairs and restores immunity. The methods comprising contacting the tissue with an effective amount of a composition comprising one or more sources of zinc ions such as zinc oxide, zinc citrate, or combination thereof zinc oxide and zinc citrate, and optionally further comprising arginine and/or one or more neutral amino acids.