Patents by Inventor Ying Yang

Ying Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127791
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating speech from text. One of the systems includes one or more computers and one or more storage devices storing instructions that when executed by one or more computers cause the one or more computers to implement: a sequence-to-sequence recurrent neural network configured to: receive a sequence of characters in a particular natural language, and process the sequence of characters to generate a spectrogram of a verbal utterance of the sequence of characters in the particular natural language; and a subsystem configured to: receive the sequence of characters in the particular natural language, and provide the sequence of characters as input to the sequence-to-sequence recurrent neural network to obtain as output the spectrogram of the verbal utterance of the sequence of characters in the particular natural language.
    Type: Application
    Filed: November 21, 2023
    Publication date: April 18, 2024
    Inventors: Samuel Bengio, Yuxuan Wang, Zongheng Yang, Zhifeng Chen, Yonghui Wu, Ioannis Agiomyrgiannakis, Ron J. Weiss, Navdeep Jaitly, Ryan M. Rifkin, Robert Andrew James Clark, Quoc V. Le, Russell J. Ryan, Ying Xiao
  • Patent number: 11958788
    Abstract: The present invention discloses a method of preparing an alkali activation material by using red mud-based wet grinding and carbon sequestration and an application thereof. The preparation method includes: (1) adding water, red mud, a crystalline control agent, and a grinding aid into a wet grinding carbon sequestration apparatus to perform wet grinding, and simultaneously introducing CO2 until a slurry pH reaches 7 to 7.5; and removing wet grinding balls by a sieve to obtain a slurry A; (2) adding carbide slag, water and a water reducer to a wet planetary ball grinder tank for wet grinding, and removing wet grinding balls by a sieve to obtain a slurry B; (3) taking 50 to 80 parts of the slurry A and 20 to 50 parts of the slurry B and mixing them to obtain an alkali activation material.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 16, 2024
    Assignee: Hubei University Of Technology
    Inventors: Xingyang He, Weilong Li, Ying Su, Zhengqi Zheng, Jin Yang, Yingbin Wang, Hongbo Tan, Chenghao Li
  • Patent number: 11961880
    Abstract: A semiconductor device includes first and second metal-insulator-metal structures. The first metal-insulator-metal structure includes a first bottom conductor plate, a first portion of a first dielectric layer, a first middle conductor plate, a first portion of a second dielectric layer, and a first top conductor plate stacked up one over another. The second metal-insulator-metal structure includes a second bottom conductor plate, a second portion of the first dielectric layer, a second middle conductor plate, a second portion of the second dielectric layer, and a second top conductor plate stacked up one over another. In a cross-sectional view, the first bottom conductor plate is wider than the first middle conductor plate that is wider than the first top conductor plate, and the second bottom conductor plate is narrower than the second middle conductor plate that is narrower than the first top conductor plate.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yuan-Yang Hsiao, Hsiang-Ku Shen, Tsung-Chieh Hsiao, Ying-Yao Lai, Dian-Hau Chen
  • Publication number: 20240120317
    Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 11, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Cheng-Hsiung Yang, Chien Te Chen, Cong Zhang, Ching-Chuan Hsieh, Yu-Ying Tan, Juan Zhou, Ai-wen Wang, Yih-Fran Lee, Yu-Wen Huang
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240111337
    Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.
    Type: Application
    Filed: May 8, 2023
    Publication date: April 4, 2024
    Applicant: Acer Incorporated
    Inventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
  • Publication number: 20240113262
    Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer, an active region and a second semiconductor layer; a first contact electrode and a second contact electrode formed on the semiconductor stack, wherein the first contact electrode includes a first contact part formed on the first semiconductor layer and the second contact electrode includes a second contact part formed on the second semiconductor layer; an insulating stack formed on the semiconductor stack, including an opening on the second contact part; a first electrode pad and a second electrode pad formed on the insulating stack, wherein the second electrode pad filled in the opening and connecting the second contact part; wherein the second electrode pad includes an upper surface, and the upper surface includes a platform area and a depression area on the second contact part; wherein the platform area has a maximum height relative to other areas of the upper surface; wherein an area of a projection of the plat
    Type: Application
    Filed: September 1, 2023
    Publication date: April 4, 2024
    Inventors: Hsin-Ying WANG, Hui-Chun YEH, Jhih-Yong YANG, Chen OU, Cheng-Lin LU
  • Publication number: 20240113652
    Abstract: A torque tube with a pentagonal cross-section includes a tube body and a cavity disposed in the tube body. The cross-section of the tube body of the length direction is a convex pentagon including a first side, a second side, a third side, a fourth side, and a fifth side that are connected end to end in a circumferential direction to form a closed structure. The tube body is a symmetrical structure with a perpendicular bisector of the third side as an axis, such that the second side is symmetrical with the fourth side, the first side is symmetrical with the fifth side, and the second side and the fourth side are vertically connected to the third side. A solar structure is further provided. The special pentagonal structure of the torque tube provides an additional cross-section for selection while ensuring strength and flexural performance and saving on material costs.
    Type: Application
    Filed: July 2, 2021
    Publication date: April 4, 2024
    Applicant: ARCTECH SOLAR HOLDING CO., LTD.
    Inventors: Ying YANG, Jingqiang CHEN, Yupei XIE
  • Patent number: 11949591
    Abstract: The present disclosure provides a method (100) in a network node advertising a Binding Segment Identifier, BSID. The method (100) includes: receiving (110) a first echo request packet containing a first target Forwarding Equivalence Class, FEC, stack including an FEC associated with the BSID; and transmitting (120), in response to a Time To Live, TTL, expiration associated with the first echo request packet, a first echo reply packet to an initiating network node initiating the first echo request packet, the first echo reply packet containing an indicator indicating that the FEC is to be replaced by a set of FECs.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 2, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Ying Lu, Shuo Yang, Wei Sun, Jinfeng Zhao, Yun Lin
  • Publication number: 20240100015
    Abstract: The present disclosure provides an arctigenin liquid nano-preparation and a preparation method thereof, and relates to the technical field of pharmaceutical preparation. In the present disclosure, arctigenin is prepared into a liquid nano-preparation, having advantages of distribution of a droplet diameter on nanoscale, significantly increased specific surface area, rapid absorption, and high bioavailability. Meanwhile, nano-preparation entered the body can be captured by wandering leucocytes, and a medicament is delivered to inflammatory lesions through chemiotaxis, thereby conferring a targeted drug delivery feature on the arctigenin and making a therapy more targeted. Moreover, in the present disclosure, the arctigenin is dissolved in an oil phase, and the oil phase is dissolved in water by emulsification to further make the arctigenin dissolve in the water and increase water solubility of the arctigenin.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 28, 2024
    Inventors: Bin HE, Lijun WU, Zheng LU, Zhiping RAN, Guoming CHEN, Zhiyong SHAO, Xiabing CHEN, Wei LIU, Ying LI, Wu LIU, Qi ZHOU, Wenhai YANG, Dongqing LIU, Kangyu DU
  • Publication number: 20240104932
    Abstract: Systems, methods, and non-transitory computer-readable media can access a plurality of parameter-based encodings providing a structured representation of an environment captured by one or more sensors associated with a plurality of vehicles traveling through the environment. A given parameter-based encoding of the environment identifies one or more agents that were detected by a vehicle within the environment and respective location information for the one or more agents within the environment. The plurality of parameter-based encodings can be clustered into one or more clusters of parameter-based encodings. At least one scenario associated with the environment can be determined based at least in part on the one or more clusters of parameter-based encodings.
    Type: Application
    Filed: October 6, 2023
    Publication date: March 28, 2024
    Applicant: Lyft, Inc.
    Inventors: Ivan Kirigan, David Tse-Zhou Lu, Sheng Yang, Ranjith Unnikrishnan, Emilie Jeanne Anne Danna, Weiyi Hou, Daxiao Liu, Suneet Rajendra Shah, Ying Liu
  • Publication number: 20240096789
    Abstract: An antifuse structure and IC devices incorporating such antifuse structures in which the antifuse structure includes an dielectric antifuse structure formed on an active area having a first dielectric antifuse electrode, a second dielectric antifuse electrode extending parallel to the first dielectric antifuse electrode, a first dielectric composition between the first dielectric antifuse electrode and the second dielectric antifuse electrode, and a first programming transistor electrically connected to a first voltage supply wherein, during a programming operation a programming voltage is selectively applied to certain of the dielectric antifuse structures to form a resistive direct electrical connection between the first dielectric antifuse electrode and the second dielectric antifuse electrode.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Inventors: Meng-Sheng CHANG, Chien-Ying CHEN, Yao-Jen YANG
  • Publication number: 20240095425
    Abstract: Systems and methods are provided for predicting microhardness properties of a weld that defines a weld joint between at least two workpieces. The system includes a processor programmed to: receive temperature data that includes temperature values each attributed to a corresponding one of a plurality of points of the weld at corresponding times during a welding process used to produce the weld, determine peak temperature values and cooling rate values for each of the points of the weld based on the temperature values, predict a three-dimensional (3D) distribution of microhardness values of the weld based on a machine learning method that evaluates the peak temperature values and the cooling rate values, and generate display data based on the 3D distribution of microhardness values.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicants: GM GLOBAL TECHNOLOGY OPERATIONS LLC, Arizona Board of Regents on behalf of Arizona State University
    Inventors: Ying Lu, Junjie Ma, Hui-ping Wang, Mitchell Poirier, Baixuan Yang, Jay Oswald
  • Publication number: 20240098988
    Abstract: A method of generating an integrated circuit (IC) layout diagram includes overlapping an active region with a plurality of gate regions, thereby defining a program transistor and a read transistor of a one-time-programmable (OTP) bit, overlapping a through via region with a gate region of the plurality of gate regions or with the active region, and overlapping the through via region with a metal region of a back-side metal layer.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Chien-Ying CHEN, Yao-Jen YANG
  • Patent number: 11932478
    Abstract: A method for manufacturing and packaging a special-shaped cigarette includes the following steps: designing inner packaging case paper capable of being folded into a special-shaped cigarette accommodating cavity; folding the inner packaging case paper to form the special-shaped cigarette accommodating cavity; filling an interior of the special-shaped cigarette accommodating cavity with an ordinary cigarette; and shelving for a certain period of time, so that a cross section of the ordinary cigarette changes from a circle to a special shape, and the ordinary cigarette is accommodated in the special-shaped cigarette accommodating cavity. A diameter of an inscribed circle of the special-shaped cigarette accommodating cavity is less than a diameter of the ordinary cigarette, and a material of the inner packaging case paper is a paperboard or a food grade PVC sheet.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: March 19, 2024
    Assignee: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Xi Yang, Yuan Tian, Ying Wu, Fangrui Chen, Zhijiang Yin
  • Patent number: 11933050
    Abstract: Some embodiments of the present disclosure relate to a roofing system. In some embodiments, the roofing system includes a first roofing material, wherein the first roofing material comprises a top surface and a bottom surface. In some embodiments, the top surface of the first roofing material comprises a nail zone with a plurality of fines. In some embodiments, the roofing system includes a second roofing material, wherein the second roofing material comprises a top surface and a bottom surface. In some embodiments, the bottom surface of the second roofing material comprises a plurality of fines. In some embodiments, the roofing system comprises and a patterned adhesive, which directly contacts at least a portion of the plurality of fines in the nail zone and at least a portion of the plurality of fines on the bottom surface of the second roofing material.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: March 19, 2024
    Assignee: BMIC LLC
    Inventors: James A. Svec, Li-Ying Yang, Daniel E. Boss
  • Patent number: 11933777
    Abstract: A model for predicting bioavailability of arsenic in site soil and a construction method and an application thereof, includes steps of: leveling soil after selecting a measuring point, vertically placing a measuring sleeve, fully supplying water to site soil to be measured, balancing for 20-40 min, measuring a water content in a soil volume not less than 40%, placing a piston DGT device into the measuring sleeve and pressing the device into soil, covering a top of the measuring sleeve with a wind shield, cleaning the piston DGT device after the measurement, analyzing a concentration of available arsenic by ICP-MS, and measuring available arsenic of soil; linearly fitting the available arsenic measured by a DGT method with human bioavailable arsenic measured by a UBM method, and obtaining a model for predicting bioavailability of arsenic in site soil.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: March 19, 2024
    Assignee: INSTITUTE OF SOIL SCIENCE, CHINESE ACADEMY OF SCIENCES
    Inventors: Chen Tu, Yongming Luo, Ying Liu, Guoming Liu, Shuai Yang
  • Publication number: 20240084598
    Abstract: Some embodiments of the present disclosure relate to a roofing system. In some embodiments, the roofing system includes a roofing membrane, which may include a cap, a scrim, and a core. In some embodiments, the roofing system may also include an adhesive film, which may include a first adhesive layer adhered to the roofing membrane, a second adhesive layer configured to adhere the roofing membrane to a roofing substrate, and a barrier layer positioned between the first and second adhesive layers. Methods of manufacturing roofing systems are also disclosed.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 14, 2024
    Inventor: Li-Ying Yang
  • Publication number: 20240084487
    Abstract: A knitted component comprising two yarns, forming at least a heel region of an upper for an article of footwear, where one of the yarns comprises a thermoplastic material. The outer surface may include a fused area comprising a first thermoplastic yarn. The inner surface may be at least partially formed with a second yarn and may substantially exclude the thermoplastic material. There may be a transitional area including a reduced amount of thermoplastic material relative to a fused area. The knitted component may include a cushioning material between layers of the knit element.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Jessica Green, Chun-Ying Hsu, Jaroslav J. Lupinek, Darryl Matthews, William C. McFarland, II, Chun-Yao Tu, Yi-Ning Yang, Cheng-Ying Han
  • Publication number: 20240083667
    Abstract: A method for manufacturing and packaging a special-shaped cigarette includes the following steps: designing inner packaging case paper capable of being folded into a special-shaped cigarette accommodating cavity; folding the inner packaging case paper to form the special-shaped cigarette accommodating cavity; filling an interior of the special-shaped cigarette accommodating cavity with an ordinary cigarette; and shelving for a certain period of time, so that a cross section of the ordinary cigarette changes from a circle to a special shape, and the ordinary cigarette is accommodated in the special-shaped cigarette accommodating cavity. A diameter of an inscribed circle of the special-shaped cigarette accommodating cavity is less than a diameter of the ordinary cigarette, and a material of the inner packaging case paper is a paperboard or a food grade PVC sheet.
    Type: Application
    Filed: November 2, 2021
    Publication date: March 14, 2024
    Applicant: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Xi YANG, Yuan TIAN, Ying WU, Fangrui CHEN, Zhijiang YIN