Abstract: A three-axis voice coil motor including a base, a spherical bearing, a magnetic component, an X-coil group, a Y-coil group, and at least one Z-coil group is provided. The base has a supporting pole. The spherical bearing is rotatably sleeved around the supporting pole. The magnetic component is securely sleeved around the spherical bearing and the magnetic component rotates along with the spherical bearing. The X-coil group is disposed around the magnetic component along an X-axial direction passing through the spherical bearing, and the X-coil group has first gaps. The Y-coil group is disposed around the magnetic component along a Y-axial direction passing through the spherical bearing, and the Y-coil group has second gaps. The Z-coil group is disposed around the magnetic component along a Z-axial direction passing through the spherical bearing.

Abstract: A method for manufacturing a device may include providing an ultra-high voltage (UHV) component that includes a source region and a drain region, and forming an oxide layer on a top surface of the UHV component. The method may include connecting a low voltage terminal to the source region of the UHV component, and connecting a high voltage terminal to the drain region of the UHV component. The method may include forming a shielding structure on a surface of the oxide layer provided above the drain region of the UHV component, forming a high voltage interconnection that connects to the shielding structure and to the high voltage terminal, and forming a metal routing that connects the shielding structure and the low voltage terminal.

Abstract: An LED display device includes a system board, and multiple daughterboards that are assembled on the system board. The system board includes a drive power circuit, a first gate circuit and a second gate circuit. Each daughterboard includes a substrate, multiple LEDs that are disposed on the substrate, multiple first transistor switches that are respectively connected to the LEDs, and at least one second transistor switch that is connected to the LEDs. With respect to each daughterboard, the first transistor switches and the at least one second transistor switch cooperatively control current flows through the LEDs; the first transistor switches are further connected to the drive power circuit to respectively receive multiple drive currents, and are further connected to the first gate circuit to receive a timing signal; and the at least one second transistor switch is further connected to the second gate circuit to receive a timing signal.

Abstract: A light emitting display device includes a substrate, a drive power circuit, a gate circuit unit, multiple LEDs and a power switch unit. The power switch unit includes multiple first transistor switches and at least one second transistor switch that cooperatively control current flows through the LEDs. The first transistor switches are respectively connected to first terminals of the LEDs. The at least one second transistor switch is connected to second terminals of the LEDs. The first transistor switches are further connected to the drive power circuit to receive multiple drive currents, and are further connected to the gate circuit unit to receive a timing input. The at least one second transistor switch is further connected to the gate circuit unit to receive a timing input. The light emitting display device can have reduced parasitic capacitance effect, and thus reduced power consumption and have improved display quality.

Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.

Abstract: A flexible display panel can be bent around an axis, and includes a flexible substrate and an accommodating structure. The accommodating structure is disposed on the flexible substrate and includes a plurality of polygonal microcups connected to each other, where the polygonal microcups are arranged regularly, and the axis is not substantially parallel to any sidewall of each polygonal microcup.

Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

Abstract: A method of building a model of defect inspection for a light-emitting diode (LED) display is adapted to be implemented by a model-building system. The model-building system stores captured images respectively of LED displays that were displaying images. Each of the captured images corresponds to a status tag that indicates a status of the image being displayed by the respective one of the LED displays. The method includes: performing data preprocessing on the captured images to result in pieces of pre-processed data that respectively correspond to the captured images; and building a model of defect inspection by using an algorithm of machine learning based on the pieces of pre-processed data and the status tags.

Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

Abstract: A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.

Abstract: The present application provides an SSD card adapter bracket and a circuit board assembly. The SSD card adapter bracket includes a bracket member, a first screw, a conductive bouncing sheet, and a second screw. The bracket member includes a card base part and an extension part, and one side of the card base part is provided with a screw base. One side of the extension part is connected to the card base part, and the other side of the extension part is provided with a connection part. The first screw is threadedly connected to the screw base, and can press the SSD card to the screw base. The conductive bouncing sheet has a first end part and a second end part, the first end part is sandwiched between the first screw and the screw base, and the second end part corresponds to the connection part.

Abstract: Disclosed are some examples of Phase interpolator circuitry used in retimer systems. The phase interpolator circuitry includes a phase interpolator configured to: receive the phase control signal, generate, based on the phase control signal, an output clock signal, and provide the output clock signal to the transmitter to track a plurality data packets. Phase interpolator circuitry is coupled with clock data recovery circuitry. In some implementations, clock data recovery circuitry is coupled between a receiver and a transmitter. The clock data recovery circuitry is configured to: extract a data component from an input data signal associated with the receiver, provide the data component to the transmitter, and generate a phase control signal.

Abstract: A method for packaging an integrated circuit chip includes the steps of: a) providing a plurality of dies and a lead frame which includes a plurality of bonding parts each having a die pad, a plurality of leads each having an end region disposed on and connected to the die pad, and a plurality of bumps each disposed on the end region of a respective one of the leads; b) transferring each of the dies to the die pad of a respective one of the bonding parts to permit each of the dies to be flipped on the respective bonding part; and c) hot pressing each of the dies and the die pad of a respective one of the bonding parts to permit each of the dies to be bonded to the bumps of the respective bonding part.

Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Abstract: An electronic paper display device includes an upper supporting layer, a lower supporting layer, and an electronic ink layer. The lower supporting layer is opposite to the upper supporting layer. At least one of the upper supporting layer and the lower supporting layer has a thickness in a range from 1 ?m to 50 ?m and has a storage modulus in a range from 1 kPa to 100 kPa in 0° C. to 70° C. The electronic ink layer is located between the upper supporting layer and the lower supporting layer.

Abstract: An electronic apparatus includes a flexible display device and a roller. The flexible display device includes a driving substrate, a display layer on the driving substrate, and a front protective layer covering the display layer. The flexible display device has an end portion fixed to the roller. The roller includes a holding groove, a receiving slot, and a retraction assembly. The holding groove is recessed from an external surface of the roller. The end portion is in the holding groove. The flexible display device further includes a main body portion outside the holding groove. A thickness of the end portion is less than a thickness of the main body portion. The receiving slot is recessed from the external surface. The retraction assembly is disposed in the receiving slot. When the retraction assembly abuts against the flexible display device, the retraction assembly is pressed into the receiving slot.

Abstract: A display device includes a flexible display panel, a sealant, and a first reinforcing structure. The flexible display panel includes a lower substrate, an upper substrate, and a display medium layer disposed between the lower substrate and the upper substrate. Each of the lower substrate and the upper substrate has an edge region. A centerline of the flexible display panel is parallel to a short side of the flexible display panel. The sealant is disposed between the edge region of the lower substrate and the edge region of the upper substrate. The first reinforcing structure is disposed among the sealant, the edge region of the lower substrate, and the edge region of the upper substrate. The centerline of the flexible display panel passes through the first reinforcing structure, and the elastic modulus of the first reinforcing structure is greater than that of the sealant.

Abstract: A flexible display device includes a thin-film transistor (TFT) array substrate, a cover film, an electronic ink layer, an edge sealant, an electrode layer, and a reinforcement layer. The electronic ink layer is located between the TFT array substrate and the cover film. The edge sealant is located between the TFT array substrate and the cover film and surrounds the electronic ink layer. The edge sealant defines a packaging area that vertically overlaps the edge sealant. The electrode layer is located on the electronic ink layer. The reinforcement layer is disposed along the packaging area.

Abstract: A support assembly and a chassis structure for positioning and support of large and heavy computer cards. The chassis structure includes a housing, a main board in the housing, and a graphics card slot on the main board. The housing includes a positioning frame on the main board and the support assembly on the frame. The support assembly is detachable. The support assembly includes positioning base plate, positioning member, and adjusting member. The positioning member is on a base which is detachable from the positioning frame. The adjusting member is moveable. The positioning member includes a first support portion, the adjusting member includes a second support portion. Depending on card size, either the first support portion or the second support portion abuts against an end side of a graphics card away from the graphics card slot, to position and firmly hold in place graphics cards of different sizes.

Abstract: A display device includes a carrier, a substrate unit, a plurality of light emitting elements and a circuit unit. The carrier has a top surface and a bottom surface opposite to each other, and a peripheral surface interconnecting the top and bottom surfaces. The substrate unit is disposed on one side of the peripheral surface of the carrier. The light emitting elements are spacedly disposed on the top surface of the carrier. The circuit unit includes a plurality of circuit modules that are disposed on the substrate unit and that are electrically connected to the light emitting elements. Each of the circuit modules includes a switch control circuit and a driving circuit that are configured to control the light emitting elements.