Abstract: A method and an apparatus for recognition a position and generating a path for autonomous driving of a mobile robot in an orchard environment are provided. The method converts three-dimensional (3D) point cloud data for the orchard environment into a 2D grid map, obtains a position of the mobile robot by performing local scan matching and global scan matching on the 2D grid map, and extracts a tree from the 2D grid map based on occupancy of each grid of the 2D grid map. Then, an effective line based on center points of extracted trees is obtained, a destination based on the obtained effective line is generated, and a driving path according to the generated destination and the position of the mobile robot is generated.

Abstract: A display panel includes a first panel region (FPR) including (n?1)-th and n-th pixel rows ((n?1)PR and nPR), and a second panel region (SPR) dividing the nPR to propagate an optical signal. The display panel includes a circuit element layer (CEL) and a display element layer (DEL). The CEL includes a signal line (SL), a pixel driving circuit (PDC), and first to third regions. The SL and the PDC are in the first region. The second region (SR) corresponds to the SPR. The SL and the PDC are not in the SR. The third region (TR) corresponds to the SPR and is along a periphery of the SR. The SL is in the TR, and includes an (n?1)-th scan line ((n?1)SL) connected to the (n?1)PR, an n-th reset line (nRL) connected to the nPR, and a first row connection line in the TR and connecting the (n?1)SL and the nRL.

Abstract: A display device includes: a display panel in which a non-display region and a display region surrounding the non-display region are defined, wherein the display panel includes: a base layer comprising a first region in which a hole is defined corresponding to the non-display region, a second region surrounding the first region, and a third region corresponding to the display region; and first signal line parts disposed on the second region and the third region, the first signal line parts arrayed spaced apart from each other in a first direction, and each of the first signal line parts includes: a first line; a second line spaced apart from the first line; and a first connection part configured to connect the first line and the second line.

Abstract: A diffusion lens may include a plurality of diffusion portions which contacts with an LED, is symmetrical to each other with respect to an optical axis which is a straight direction of the light emitted from the LED, and has convex surfaces.

Abstract: A display device includes: a base substrate having a main region, a subsidiary region, and a bending region between the main region and the subsidiary region; first to fourth touch electrodes on the base substrate at the main region; first to fourth touch signal lines connected to the first to fourth touch electrodes; a first bridge electrode connecting the first and second touch signal lines; a second bridge electrode connecting the third and fourth touch signal lines; and a third bridge electrode connecting a first touch connection electrode connected to the first bridge electrode with a second touch connection electrode connected to the second bridge electrode. The subsidiary region includes a first bridge portion and a second bridge portion. Each of the first bridge electrode and the second bridge electrode is at the first bridge portion, and the third bridge electrode is at the second bridge portion.

Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.

Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.

Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: A display device includes: pixel columns including pixels arranged along a first direction; pixel rows including pixels arranged along a second direction crossing the first direction; data lines connected to respective pixel columns, each of the data lines including a first sub-data line provided at one side of a corresponding pixel column and a second sub-data line provided at another side of the corresponding pixel column; scan lines extending along the second direction and connected to respective pixel rows; and a power line to supply driving power to the pixels, one of the pixels of the pixel columns is connected to the first sub-data line, and a pixel adjacent to the pixel connected to the first sub-data line is connected to the second sub-data line, and the first sub-data line and the second sub-data line in the same pixel column are on different layers from each other.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

Abstract: A display device, includes: a display area including an upper side, a lower side, a left side, a right side, and inclined corner portions where the upper, lower, left, and right sides meet; a demultiplexing circuit unit adjacent to the lower side of the display area and the corner portion connected thereto; and a scan transmission line which extends toward the display area from an outer side of the left side and overlaps with the demultiplexing circuit unit outside the corner portion, wherein the demultiplexing circuit unit includes a demultiplexer transistor, and the scan transmission line is formed of a different conductive layer from an electrode of a demultiplexer transistor.

Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).

Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

Abstract: A storage device includes nonvolatile memory devices that store data, a storage controller, and an adaptive power supply circuit. The storage controller controls the nonvolatile memory devices. The adaptive power supply circuit generates at least one operation voltage based on at least one power supply voltage, and provides the at least one operation voltage to the nonvolatile memory devices and the storage controller. The at least one power supply voltage is provided to the adaptive power supply circuit through a portion of power lines connected to a host. Under control of the storage controller, the adaptive power supply circuit adaptively activates a power disable function associated with a provision of the at least one operation voltage according to a level of a third power supply voltage provided through a third power line of the plurality of power lines. The third power supply voltage is provided by the host.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.