Patents by Inventor Yong Bo

Yong Bo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240394810
    Abstract: Disclosed is an apparatus for determining an energy cost applied to an energy sharing transaction system which performs a secondary energy sharing transaction between a seller and a buyer having an energy production facility which is operated by using primary energy as a power source to produce secondary energy.
    Type: Application
    Filed: December 27, 2023
    Publication date: November 28, 2024
    Inventors: Ki-Hyun KIM, Young-Jin JANG, Yong-Bo SHIM, Ha-Eun KIM, Su-Hee KIM
  • Patent number: 11977867
    Abstract: A code checking method includes: causing a compiler to generate a map file and a low-level code file(s) according to a high-level code file(s); obtaining target function information from the map file; finding a target code file from the low-level code file(s); obtaining a first return command of a target function name of the target function information from the target code file; traversing the low-level code file(s) to obtain each calling module name and a second return command of each calling function name; obtaining a second storage area of each calling module name from the map file; and generating a check failure result when calling of a target function name by each calling function name is not complied with a bank-switching compile form according to a first storage area of the target function information, the first return command, each second storage area, and each second return command.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 7, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yong-Bo Cai, Jun-Chen Zhang, Ming-Rui Li
  • Publication number: 20230305821
    Abstract: A code checking method includes: causing a compiler to generate a map file and a low-level code file(s) according to a high-level code file(s); obtaining target function information from the map file; finding a target code file from the low-level code file(s); obtaining a first return command of a target function name of the target function information from the target code file; traversing the low-level code file(s) to obtain each calling module name and a second return command of each calling function name; obtaining a second storage area of each calling module name from the map file; and generating a check failure result when calling of a target function name by each calling function name is not complied with a bank-switching compile form according to a first storage area of the target function information, the first return command, each second storage area, and each second return command.
    Type: Application
    Filed: August 10, 2022
    Publication date: September 28, 2023
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yong-Bo Cai, Jun-Chen Zhang, Ming-Rui Li
  • Patent number: 11435658
    Abstract: A projection module includes a light source, a reflective structure, and an optical structure. The light source emits laser light. The reflective structure includes a first reflective element and a second reflective element. The optical structure includes a first optical element and a second optical element. The reflective structure is disposed between the laser source and the optical structure. The first reflective element reflects a portion of the laser light towards the second reflective element, and transmits a remaining portion of the laser light towards the second optical element. The second reflective element reflects the laser light from the first reflective element towards the first optical element. The first optical element and the second optical element cooperatively project the laser beam towards an object.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: September 6, 2022
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Shih-Che Lin, Tao Wang, Yong-Bo Luo
  • Patent number: 11368013
    Abstract: An overcurrent protection method is provided. The overcurrent protection method is applied to a USB with a PD function. The overcurrent protection method includes the steps of converting an input voltage into a first voltage to provide power to the first electronic device; determining whether the working current of the first electronic device is greater than a first default value; determining whether the working current of the first electronic device is greater than a second default value; in response to the working current being greater than the first default value, a first sensing signal is generated to disable a switch and to form an open circuit between the first electronic device and the second electronic device; and in response to the working current being greater than the second default value, conversion of the input voltage into the first voltage is stopped.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: June 21, 2022
    Assignee: Wistron Corp.
    Inventors: Yong Bo Li, Yong Qiang Li, Wen Long Yang, Jun Xin Qiu
  • Publication number: 20210397074
    Abstract: A projection module includes a light source, a reflective structure, and an optical structure. The light source emits laser light. The reflective structure includes a first reflective element and a second reflective element. The optical structure includes a first optical element and a second optical element. The reflective structure is disposed between the laser source and the optical structure. The first reflective element reflects a portion of the laser light towards the second reflective element, and transmits a remaining portion of the laser light towards the second optical element. The second reflective element reflects the laser light from the first reflective element towards the first optical element. The first optical element and the second optical element cooperatively project the laser beam towards an object.
    Type: Application
    Filed: June 18, 2021
    Publication date: December 23, 2021
    Inventors: SHIH-CHE LIN, TAO WANG, YONG-BO LUO
  • Patent number: 10962281
    Abstract: Disclosed herein is a refrigerator having a storage box by which the humidity in a storage compartment is controllable. The refrigerator includes a body having a storage compartment, a storage box installed to be drawable in the storage compartment, a cover located above the storage box and provided to be rotatable, a cover frame configured to support the cover, and a knob configured to rotate the cover to adjust humidity inside the storage box.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: March 30, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae Bok Lee, Myoung Jin Jang, Yong Bo Shim
  • Patent number: 10922256
    Abstract: A display apparatus is provided. The display apparatus includes a display panel and a display controller. The display controller is electrically connected to a USB Type-C interface of a host via a USB Type-C interface of the display apparatus. In response to the USB Type-C interface of the display apparatus being in a USB Type-C default pin-assignment mode, the display controller receives an image signal from the host via two USB SuperSpeed channels of the USB Type-C interface of display apparatus. In response to a display mode of the display apparatus satisfying a specific condition, the display controller controls the USB Type-C interface of the display apparatus to enter a USB Type-C first pin assignment mode, so that the host utilizes the four USB SuperSpeed channels of the USB Type-C interface of the display apparatus to transmit the image signal to the display controller.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: February 16, 2021
    Assignee: WISTRON CORP.
    Inventors: Li Fan Zheng, Yong Qiang Li, Yong Bo Li, Jun Xin Qiu, Wen Long Yang
  • Publication number: 20200233822
    Abstract: A display apparatus is provided. The display apparatus includes a display panel and a display controller. The display controller is electrically connected to a USB Type-C interface of a host via a USB Type-C interface of the display apparatus. In response to the USB Type-C interface of the display apparatus being in a USB Type-C default pin-assignment mode, the display controller receives an image signal from the host via two USB SuperSpeed channels of the USB Type-C interface of display apparatus. In response to a display mode of the display apparatus satisfying a specific condition, the display controller controls the USB Type-C interface of the display apparatus to enter a USB Type-C first pin assignment mode, so that the host utilizes the four USB SuperSpeed channels of the USB Type-C interface of the display apparatus to transmit the image signal to the display controller.
    Type: Application
    Filed: July 2, 2019
    Publication date: July 23, 2020
    Inventors: Li Fan ZHENG, Yong Qiang LI, Yong Bo LI, Jun Xin QIU, Wen Long YANG
  • Patent number: 10718563
    Abstract: A refrigerator includes a storeroom configured to have a pantry install part. The refrigerator also includes a pantry arranged in the pantry install part. The refrigerator also includes a filter case configured to receive a water filter and arranged in the pantry install part to be covered by the pantry.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: July 21, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae Bok Lee, Sang Chul Ryu, Jin Kyu Seon, Yong Bo Shim
  • Publication number: 20200216923
    Abstract: Disclosed are a method for heat-treating a surface of a spheroidal graphite cast iron, particularly, heat-treating an uppermost surface of spheroidal graphite cast iron, and spheroidal graphite cast iron heat-treated by the same. The method may include first heat treating for forming ferrite and second heat treating for oxy-nitriding. The spheroidal graphite cast iron heat-treated includes an oxidation layer and a compound layer having a thickness of about 15 to 30 ?m, which may be uniform. The method of the heat-treating may decrease the pearlite fraction in the uppermost surface of spheroidal graphite cast iron and increase the ferrite fraction by forming ferrite, thereby forming a compound layer having a thickness of about 15 to 30 ?m during an oxy-nitriding heat treatment.
    Type: Application
    Filed: October 24, 2019
    Publication date: July 9, 2020
    Inventors: Eun-Soo Kwon, Hyung-Gook Lee, Yong-Bo Sim
  • Publication number: 20200059083
    Abstract: An overcurrent protection method is provided. The overcurrent protection method is applied to a USB with a PD function. The overcurrent protection method includes the steps of converting an input voltage into a first voltage to provide power to the first electronic device; determining whether the working current of the first electronic device is greater than a first default value; determining whether the working current of the first electronic device is greater than a second default value; in response to the working current being greater than the first default value, a first sensing signal is generated to disable a switch and to form an open circuit between the first electronic device and the second electronic device; and in response to the working current being greater than the second default value, conversion of the input voltage into the first voltage is stopped.
    Type: Application
    Filed: February 21, 2019
    Publication date: February 20, 2020
    Inventors: Yong Bo LI, Yong Qiang LI, Wen Long YANG, Jun Xin QIU
  • Patent number: 10487380
    Abstract: Disclosed herein is high-strength special steel containing about 0.1 to 0.5 wt % of carbon (C), about 0.1 to 2.3 wt % of silicon (Si), about 0.3 to 1.5 wt % of manganese (Mn), about 1.1 to 4.0 wt % of chromium (Cr), about 0.3 to 1.5 wt % of molybdenum (Mo), about 0.1 to 4.0 wt % of nickel (Ni), about 0.01 to 0.50 wt % of vanadium (V), about 0.05 to 0.50 wt % of titanium (Ti), and the remainder of iron (Fe) and other inevitable impurities.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: November 26, 2019
    Assignee: Hyundai Motor Company
    Inventors: Sung Chul Cha, Yong Bo Sim, Seung Hyun Hong
  • Publication number: 20180187966
    Abstract: Disclosed herein is a refrigerator having a storage box by which the humidity in a storage compartment is controllable. The refrigerator includes a body having a storage compartment, a storage box installed to be drawable in the storage compartment, a cover located above the storage box and provided to be rotatable, a cover frame configured to support the cover, and a knob configured to rotate the cover to adjust humidity inside the storage box.
    Type: Application
    Filed: January 2, 2018
    Publication date: July 5, 2018
    Inventors: Jae Bok LEE, Myoung Jin JANG, Yong Bo SHIM
  • Publication number: 20180149416
    Abstract: A refrigerator includes a storeroom configured to have a pantry install part. The refrigerator also includes a pantry arranged in the pantry install part. The refrigerator also includes a filter case configured to receive a water filter and arranged in the pantry install part to be covered by the pantry.
    Type: Application
    Filed: November 29, 2017
    Publication date: May 31, 2018
    Inventors: Jae Bok Lee, Sang Chul Ryu, Jin Kyu Seon, Yong Bo Shim
  • Publication number: 20180051364
    Abstract: Disclosed herein is high-strength special steel containing about 0.1 to 0.5 wt % of carbon (C), about 0.1 to 2.3 wt % of silicon (Si), about 0.3 to 1.5 wt % of manganese (Mn), about 1.1 to 4.0 wt % of chromium (Cr), about 0.3 to 1.5 wt % of molybdenum (Mo), about 0.1 to 4.0 wt % of nickel (Ni), about 0.01 to 0.50 wt % of vanadium (V), about 0.05 to 0.50 wt % of titanium (Ti), and the remainder of iron (Fe) and other inevitable impurities.
    Type: Application
    Filed: December 9, 2016
    Publication date: February 22, 2018
    Applicant: Hyundai Motor Company
    Inventors: Sung Chul CHA, Yong Bo SIM, Seung Hyun HONG
  • Patent number: 9472532
    Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: October 18, 2016
    Assignee: UTAC HEADQUARTERS PTE. LTD.
    Inventors: Antonio Bambalan Dimaano, Jr., Nathapong Suthiwongsunthorn, Yong Bo Yang
  • Publication number: 20160043041
    Abstract: Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate dudes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.
    Type: Application
    Filed: October 14, 2015
    Publication date: February 11, 2016
    Inventors: Yong Bo YANG, Chun Hong WO
  • Patent number: 9165878
    Abstract: Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate includes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: October 20, 2015
    Assignee: UNITED TEST AND ASSEMBLY CENTER LTD.
    Inventors: Yong Bo Yang, Chun Hong Wo
  • Publication number: 20150214187
    Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.
    Type: Application
    Filed: April 3, 2015
    Publication date: July 30, 2015
    Inventors: Antonio Bambalan Dimaano, JR., Nathapong Suthiwongsunthorn, Yong Bo Yang