Abstract: Disclosed is an apparatus for determining an energy cost applied to an energy sharing transaction system which performs a secondary energy sharing transaction between a seller and a buyer having an energy production facility which is operated by using primary energy as a power source to produce secondary energy.

Abstract: A code checking method includes: causing a compiler to generate a map file and a low-level code file(s) according to a high-level code file(s); obtaining target function information from the map file; finding a target code file from the low-level code file(s); obtaining a first return command of a target function name of the target function information from the target code file; traversing the low-level code file(s) to obtain each calling module name and a second return command of each calling function name; obtaining a second storage area of each calling module name from the map file; and generating a check failure result when calling of a target function name by each calling function name is not complied with a bank-switching compile form according to a first storage area of the target function information, the first return command, each second storage area, and each second return command.

Abstract: A code checking method includes: causing a compiler to generate a map file and a low-level code file(s) according to a high-level code file(s); obtaining target function information from the map file; finding a target code file from the low-level code file(s); obtaining a first return command of a target function name of the target function information from the target code file; traversing the low-level code file(s) to obtain each calling module name and a second return command of each calling function name; obtaining a second storage area of each calling module name from the map file; and generating a check failure result when calling of a target function name by each calling function name is not complied with a bank-switching compile form according to a first storage area of the target function information, the first return command, each second storage area, and each second return command.

Abstract: A projection module includes a light source, a reflective structure, and an optical structure. The light source emits laser light. The reflective structure includes a first reflective element and a second reflective element. The optical structure includes a first optical element and a second optical element. The reflective structure is disposed between the laser source and the optical structure. The first reflective element reflects a portion of the laser light towards the second reflective element, and transmits a remaining portion of the laser light towards the second optical element. The second reflective element reflects the laser light from the first reflective element towards the first optical element. The first optical element and the second optical element cooperatively project the laser beam towards an object.

Abstract: An overcurrent protection method is provided. The overcurrent protection method is applied to a USB with a PD function. The overcurrent protection method includes the steps of converting an input voltage into a first voltage to provide power to the first electronic device; determining whether the working current of the first electronic device is greater than a first default value; determining whether the working current of the first electronic device is greater than a second default value; in response to the working current being greater than the first default value, a first sensing signal is generated to disable a switch and to form an open circuit between the first electronic device and the second electronic device; and in response to the working current being greater than the second default value, conversion of the input voltage into the first voltage is stopped.

Abstract: A projection module includes a light source, a reflective structure, and an optical structure. The light source emits laser light. The reflective structure includes a first reflective element and a second reflective element. The optical structure includes a first optical element and a second optical element. The reflective structure is disposed between the laser source and the optical structure. The first reflective element reflects a portion of the laser light towards the second reflective element, and transmits a remaining portion of the laser light towards the second optical element. The second reflective element reflects the laser light from the first reflective element towards the first optical element. The first optical element and the second optical element cooperatively project the laser beam towards an object.

Abstract: Disclosed herein is a refrigerator having a storage box by which the humidity in a storage compartment is controllable. The refrigerator includes a body having a storage compartment, a storage box installed to be drawable in the storage compartment, a cover located above the storage box and provided to be rotatable, a cover frame configured to support the cover, and a knob configured to rotate the cover to adjust humidity inside the storage box.

Abstract: A display apparatus is provided. The display apparatus includes a display panel and a display controller. The display controller is electrically connected to a USB Type-C interface of a host via a USB Type-C interface of the display apparatus. In response to the USB Type-C interface of the display apparatus being in a USB Type-C default pin-assignment mode, the display controller receives an image signal from the host via two USB SuperSpeed channels of the USB Type-C interface of display apparatus. In response to a display mode of the display apparatus satisfying a specific condition, the display controller controls the USB Type-C interface of the display apparatus to enter a USB Type-C first pin assignment mode, so that the host utilizes the four USB SuperSpeed channels of the USB Type-C interface of the display apparatus to transmit the image signal to the display controller.

Abstract: A display apparatus is provided. The display apparatus includes a display panel and a display controller. The display controller is electrically connected to a USB Type-C interface of a host via a USB Type-C interface of the display apparatus. In response to the USB Type-C interface of the display apparatus being in a USB Type-C default pin-assignment mode, the display controller receives an image signal from the host via two USB SuperSpeed channels of the USB Type-C interface of display apparatus. In response to a display mode of the display apparatus satisfying a specific condition, the display controller controls the USB Type-C interface of the display apparatus to enter a USB Type-C first pin assignment mode, so that the host utilizes the four USB SuperSpeed channels of the USB Type-C interface of the display apparatus to transmit the image signal to the display controller.

Abstract: A refrigerator includes a storeroom configured to have a pantry install part. The refrigerator also includes a pantry arranged in the pantry install part. The refrigerator also includes a filter case configured to receive a water filter and arranged in the pantry install part to be covered by the pantry.

Abstract: Disclosed are a method for heat-treating a surface of a spheroidal graphite cast iron, particularly, heat-treating an uppermost surface of spheroidal graphite cast iron, and spheroidal graphite cast iron heat-treated by the same. The method may include first heat treating for forming ferrite and second heat treating for oxy-nitriding. The spheroidal graphite cast iron heat-treated includes an oxidation layer and a compound layer having a thickness of about 15 to 30 ?m, which may be uniform. The method of the heat-treating may decrease the pearlite fraction in the uppermost surface of spheroidal graphite cast iron and increase the ferrite fraction by forming ferrite, thereby forming a compound layer having a thickness of about 15 to 30 ?m during an oxy-nitriding heat treatment.

Abstract: An overcurrent protection method is provided. The overcurrent protection method is applied to a USB with a PD function. The overcurrent protection method includes the steps of converting an input voltage into a first voltage to provide power to the first electronic device; determining whether the working current of the first electronic device is greater than a first default value; determining whether the working current of the first electronic device is greater than a second default value; in response to the working current being greater than the first default value, a first sensing signal is generated to disable a switch and to form an open circuit between the first electronic device and the second electronic device; and in response to the working current being greater than the second default value, conversion of the input voltage into the first voltage is stopped.

Abstract: Disclosed herein is high-strength special steel containing about 0.1 to 0.5 wt % of carbon (C), about 0.1 to 2.3 wt % of silicon (Si), about 0.3 to 1.5 wt % of manganese (Mn), about 1.1 to 4.0 wt % of chromium (Cr), about 0.3 to 1.5 wt % of molybdenum (Mo), about 0.1 to 4.0 wt % of nickel (Ni), about 0.01 to 0.50 wt % of vanadium (V), about 0.05 to 0.50 wt % of titanium (Ti), and the remainder of iron (Fe) and other inevitable impurities.

Abstract: Disclosed herein is a refrigerator having a storage box by which the humidity in a storage compartment is controllable. The refrigerator includes a body having a storage compartment, a storage box installed to be drawable in the storage compartment, a cover located above the storage box and provided to be rotatable, a cover frame configured to support the cover, and a knob configured to rotate the cover to adjust humidity inside the storage box.

Abstract: A refrigerator includes a storeroom configured to have a pantry install part. The refrigerator also includes a pantry arranged in the pantry install part. The refrigerator also includes a filter case configured to receive a water filter and arranged in the pantry install part to be covered by the pantry.

Abstract: Disclosed herein is high-strength special steel containing about 0.1 to 0.5 wt % of carbon (C), about 0.1 to 2.3 wt % of silicon (Si), about 0.3 to 1.5 wt % of manganese (Mn), about 1.1 to 4.0 wt % of chromium (Cr), about 0.3 to 1.5 wt % of molybdenum (Mo), about 0.1 to 4.0 wt % of nickel (Ni), about 0.01 to 0.50 wt % of vanadium (V), about 0.05 to 0.50 wt % of titanium (Ti), and the remainder of iron (Fe) and other inevitable impurities.

Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.

Abstract: Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate dudes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.

Abstract: Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate includes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.

Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.