Abstract: Disclosed are a method for heat-treating a surface of a spheroidal graphite cast iron, particularly, heat-treating an uppermost surface of spheroidal graphite cast iron, and spheroidal graphite cast iron heat-treated by the same. The method may include first heat treating for forming ferrite and second heat treating for oxy-nitriding. The spheroidal graphite cast iron heat-treated includes an oxidation layer and a compound layer having a thickness of about 15 to 30 ?m, which may be uniform. The method of the heat-treating may decrease the pearlite fraction in the uppermost surface of spheroidal graphite cast iron and increase the ferrite fraction by forming ferrite, thereby forming a compound layer having a thickness of about 15 to 30 ?m during an oxy-nitriding heat treatment.

Abstract: An overcurrent protection method is provided. The overcurrent protection method is applied to a USB with a PD function. The overcurrent protection method includes the steps of converting an input voltage into a first voltage to provide power to the first electronic device; determining whether the working current of the first electronic device is greater than a first default value; determining whether the working current of the first electronic device is greater than a second default value; in response to the working current being greater than the first default value, a first sensing signal is generated to disable a switch and to form an open circuit between the first electronic device and the second electronic device; and in response to the working current being greater than the second default value, conversion of the input voltage into the first voltage is stopped.

Abstract: Disclosed herein is high-strength special steel containing about 0.1 to 0.5 wt % of carbon (C), about 0.1 to 2.3 wt % of silicon (Si), about 0.3 to 1.5 wt % of manganese (Mn), about 1.1 to 4.0 wt % of chromium (Cr), about 0.3 to 1.5 wt % of molybdenum (Mo), about 0.1 to 4.0 wt % of nickel (Ni), about 0.01 to 0.50 wt % of vanadium (V), about 0.05 to 0.50 wt % of titanium (Ti), and the remainder of iron (Fe) and other inevitable impurities.

Abstract: Disclosed herein is a refrigerator having a storage box by which the humidity in a storage compartment is controllable. The refrigerator includes a body having a storage compartment, a storage box installed to be drawable in the storage compartment, a cover located above the storage box and provided to be rotatable, a cover frame configured to support the cover, and a knob configured to rotate the cover to adjust humidity inside the storage box.

Abstract: A refrigerator includes a storeroom configured to have a pantry install part. The refrigerator also includes a pantry arranged in the pantry install part. The refrigerator also includes a filter case configured to receive a water filter and arranged in the pantry install part to be covered by the pantry.

Abstract: Disclosed herein is high-strength special steel containing about 0.1 to 0.5 wt % of carbon (C), about 0.1 to 2.3 wt % of silicon (Si), about 0.3 to 1.5 wt % of manganese (Mn), about 1.1 to 4.0 wt % of chromium (Cr), about 0.3 to 1.5 wt % of molybdenum (Mo), about 0.1 to 4.0 wt % of nickel (Ni), about 0.01 to 0.50 wt % of vanadium (V), about 0.05 to 0.50 wt % of titanium (Ti), and the remainder of iron (Fe) and other inevitable impurities.

Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.

Abstract: Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate dudes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.

Abstract: Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate includes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.

Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.

Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.

Abstract: Semiconductor packages and methods for forming a semiconductor package are presented. The method includes providing a package substrate having first and second major surfaces. The package substrate includes at least one substrate layer having at least one cavity. Interconnect structure is formed. At least one conductive stud is formed within the cavity and a conductive trace and a connection pad are formed over the first major surface of the package substrate and are coupled to top surface of the conductive stud. A package pad is formed and is directly coupled to the conductive stud. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structure. A cap is formed over the package substrate to encapsulate the die.

Abstract: Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package.

Abstract: A battery cover assembly (100) is for use in a portable electronic device. The battery cover includes a housing (10) and a battery cover (20). The housing has a first engaging portion (13) at one end thereof, and a holding portion (11) at an opposite end. The holding portion has an latch plate (1111). The battery cover has a second engaging portion (214) formed at one end thereof for engaging with the first engaging portion and defines a latch opening therein for engaging with the latch plate. The latch plate is integrated with the housing for being elastically deformed by an outside force so as to releasably lock with battery cover.

Abstract: A switch assembly (40) and a portable electronic device (100) are provided. The portable electronic device includes a body section (20), a cover section (10) rotatably connecting to the body section, and the switch assembly. The switch assembly includes a first magnetic component (43), a second magnetic component (45), and a movable magnetic component (47). The first magnetic component is mounted on the cover section. The second magnetic component is mounted on the body section, and attracts to the first magnetic component to maintain the portable electronic device at a closed position. The movable magnetic component is movably mounted on the body section, and repels both to the first and second magnetic. The movable magnetic component provides a repulsive force to repel the cover rotates outwards from the body section, when the magnetic component is driven to move close to the first and second magnetic components.

Abstract: A method and an apparatus provide a service of multimedia data in a mobile terminal. In the method and the apparatus, a package data is generated and stored at a multimedia data providing device. The package data includes an execution condition and a multimedia file corresponding to the execution condition, wherein the multimedia file executes in the mobile terminal when the execution condition is satisfied. When the mobile terminal accesses the multimedia data providing device and requests the multimedia data, the package data including the multimedia data is transmitted to the mobile terminal through communication network. According to the method and the apparatus, the mobile terminal is simply provided various multimedia services.

Abstract: A switch assembly (40) and a portable electronic device (100) are provided. The portable electronic device includes a body section (20), a cover section (10) rotatably connecting to the body section, and the switch assembly. The switch assembly includes a first magnetic component (43), a second magnetic component (45), and a movable magnetic component (47). The first magnetic component is mounted on the cover section. The second magnetic component is mounted on the body section, and attracts to the first magnetic component to maintain the portable electronic device at a closed position. The movable magnetic component is movably mounted on the body section, and repels both to the first and second magnetic. The movable magnetic component provides a repulsive force to repel the cover rotates outwards from the body section, when the magnetic component is driven to move close to the first and second magnetic components.

Abstract: A battery cover assembly (100) is for use in a portable electronic device. The battery cover includes a housing (10) and a battery cover (20). The housing has a first engaging portion (13) at one end thereof, and a holding portion (11) at an opposite end. The holding portion has an latch plate (1111). The battery cover has a second engaging portion (214) formed at one end thereof for engaging with the first engaging portion and defines a latch opening therein for engaging with the latch plate. The latch plate is integrated with the housing for being elastically deformed by an outside force so as to releasably lock with battery cover.

Abstract: A method and an apparatus provide a service of multimedia data in a mobile terminal. In the method and the apparatus, a package data is generated and stored at a multimedia data providing device. The package data includes an execution condition and a multimedia file corresponding to the execution condition, wherein the multimedia file executes in the mobile terminal when the execution condition is satisfied. When the mobile terminal accesses the multimedia data providing device and requests the multimedia data, the package data including the multimedia data is transmitted to the mobile terminal through communication network. According to the method and the apparatus, the mobile terminal is simply provided various multimedia services.