Abstract: Disclosed is an automatic identification and classification production line for waste mobile phones and a classification method of waste mobile phones.

Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, a sidewall between the first surface and the second surface, and a corner region where the first sidewall meets the first surface. A first build-up layer is on at least the first surface. In some embodiments, the corner region comprises a recess and a dielectric material within the recess. In other embodiments, the corner region comprises a first compressive stress and the glass core comprises a second region. The second region comprises a second compressive stress. The first compressive stress is greater than the second compressive stress.

Abstract: The present disclosure is directed to a carrier chuck having a base plate with a top surface, at least one electrode positioned in a first carrier region of the top surface and configured to produce an electrostatic force to retain a panel placed on the carrier chuck during panel processing, and a dielectric layer positioned over the at least one electrode. The at least one electrode extends from the top surface by a height of at least 20 um.

Abstract: Disclosed in the present disclosure is a double-deck multi-span bridge construction method. According to the double-deck bridge construction method of the present disclosure, construction is carried out by using a method of disassembling a support jig frame in a graded and span-separated mode, an upper chord jig frame and a lower chord jig frame can be used in a recycle manner, and construction costs are reduced. In addition, a construction period of building the support jig frame is shortened, and other construction operations can be synchronously carried out on a span in which the jig frame is disassembled, for example, fire retardant coating construction can be carried out on a mounted bridge deck after the jig frame is disassembled, and the construction period of a double-deck multi-span bridge is effectively shortened.

Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

Abstract: A driving method and driving device for a display panel, and a display device. The driving method includes: in a first driving stage, controlling a data voltage signal input terminal to transmit a voltage corresponding to a data voltage to a gate of a drive transistor; and in a second driving stage, controlling the data voltage signal input terminal to transmit a hold voltage to a source of the drive transistor to couple the voltage of the gate of the drive transistor through the hold voltage of the source of the drive transistor.

Abstract: The present disclosure is directed to semiconductor dies and methods that provide a glass substrate, a pulsed laser tool to produce a line-shaped modification to the glass substrate for forming a plurality of structures in the glass substrate. The pulse laser tool may be provided with a predetermined pattern for its movement. The predetermined pattern moves the pulsed laser tool in a series of single steps in a first axial direction and in a series of plural lateral steps in a second axial direction that is perpendicular to the first axial direction, in particular, the single step is followed by the plural lateral steps in a repeating sequence. The series of plural lateral steps form an assembly of line-shaped modifications in parallel rows on the glass substrate, and thereafter the plurality of structures may be formed from the parallel rows of line-shaped modifications in the glass substrate.

Abstract: The light guide film product processing apparatus provided in the present invention relates to the field of light guide film processing, and includes an unwinding device for transmitting a first light guide film, a dot processing device, a cooling device, a cutting device, a waste collecting device, and a product collecting device that are sequentially installed along the transmission direction of the first light guide film, and a linkage controller; the dot processing device transfers dots on both sides of the first light guide film, the cooling device cools the first light guide film after dot processing, the cutting device cuts the cooled first light guide film, the waste collecting device is configured to wind a second light guide film, and the second light guide film is a remaining material after the first light guide film is cut into a light guide film product; and the included angle formed between the winding and transmission direction of the second light guide film and the transmission direction of th

Abstract: A method includes forming a solvent on a stage, and placing, on the solvent formed on the stage, a bottom surface of a substrate on which a residue is formed, so that the residue moves away from the bottom surface of the substrate into the solvent. The method further includes removing the substrate from the solvent into which the residue is moved.

Abstract: Embodiments include package substrates and a method of forming the package substrates. A package substrate includes a dielectric having a cavity that has a footprint, a resistor embedded in the cavity of the dielectric, and a plurality of traces on the resistor, where a plurality of surfaces of the resistor are activated surfaces. The resistor may also have a plurality of sidewalls which may be activated sidewalls and tapered. The dielectric may include metallization particles/ions. The resistor may include resistive materials, such as nickel-phosphorus (NiP), aluminum-nitride (AlN), and/or titanium-nitride (TiN). The package substrate may further include a first resistor embedded adjacently to the resistor. The first resistor may have a first footprint of a first cavity that is different than the footprint of the cavity of the resistor. The resistor may have a resistance value that is thus different than a first resistance value of the first resistor.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.

Abstract: The disclosure discloses a percussion and cutting composite drilling tool, which relates to the field of drilling equipment and is mainly used to solve the problems of low working efficiency and high wear rate of drill bit existed in breaking rocks only by cutting effect. The main structure comprises a PDC drill bit and a percussion drill bit, which is characterized by a percussion structure directly connected to the percussion drill bit. The disclosure provides a percussion and cutting composite drilling tool, which is suitable for strata under different geological conditions and has higher construction efficiency and lower bit wear.

Abstract: Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

Abstract: Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

Abstract: An intelligent monitoring method and apparatus for abnormal working conditions in a heavy metal wastewater treatment process based on transfer learning and a storage medium are provided. During an intelligent monitoring, the abnormal working conditions can be automatically and intelligently recognized by fusing data in the treatment process of the heavy metal wastewater different in source; specifically, a normal sample YSD in the treatment process of the heavy metal wastewater with fixed sources and a small number of normal samples YTD in the treatment process of the heavy metal wastewater with unknown sources are utilized; and first, a data representation dictionary DSD of YSD is obtained through learning on YSD, and then considering different distribution of YSD and YTD, a transfer learning method is adopted to fuse characters of YTD into a dictionary learning process to obtain a dictionary DTD with higher generalization ability.

Abstract: A microelectronic assembly is disclosed, comprising: a substrate having a core made of glass; and a first integrated circuit (IC) die and a second IC die coupled to a first side of the substrate. The core comprises a cavity, a third IC die is located within the cavity, and the core further comprises one or more conductive through-glass via (TGV) that facilitates electrical coupling between the first side of the substrate and an opposing second side of the substrate. In some embodiments, the cavity is a blind cavity; in other embodiments, the cavity is a through-hole. In some embodiments, the third IC die merely provides lateral coupling between the first IC die and the second IC die; in other embodiments, the third IC die also provides electrical coupling between the first side and the second side of the substrate with through-silicon vias.

Abstract: A method of fabricating an RF filter on a semiconductor package comprises forming a first dielectric buildup film. A second dielectric buildup film is formed over the first dielectric buildup film, the second dielectric buildup film comprising a dielectric material that contains a metallization catalyst, wherein the dielectric material comprises one of an epoxy-polymer blend dielectric material, silicon dioxide and silicon nitride, and a low-k dielectric. A trench is formed in the second dielectric buildup film with laser ablation, wherein the laser ablation selectively activates sidewalls of the trench for electroless metal deposition. A metal selectively is plated to sidewalls of the trench based at least in part on the metallization catalyst and immersion in an electroless solution. A low-loss buildup film is formed over the metal that substantially fills the trench.

Abstract: A steam cleaning apparatus may include a wand, a cleaning assembly coupled to the wand, the cleaning assembly including a steam generator, and a cleaning head pivotally coupled to the wand. The cleaning head may include a plurality of cleaning pads, a pad motor having a motor driveshaft, a drivetrain configured to transfer rotational motion of the motor driveshaft to each of the plurality of cleaning pads such that a rotation of the motor driveshaft causes a corresponding rotation in each of the plurality of cleaning pads, and a temperature sensor positioned proximate to the drivetrain, the temperature sensor being configured to measure a temperature of the drivetrain.