Patents by Inventor Yong-hoon Kim

Yong-hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12211591
    Abstract: The present concept relates to a first principle-derived effective mass approximation simulation technology for accurate and efficient computational simulation of an optical property of a quantum nanostructure including creating an effective mass approximation (EMA) parameter through first principle density functional theory (DFT) calculation for a model nanostructure corresponding to a simulation target quantum nanostructure, performing EMA calculation using the EMA parameter created through the DFT calculation, and acquiring the optical property of the quantum nanostructure based on an electronic structure generated through the EMA calculation.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: January 28, 2025
    Assignee: Korea Advanced Institute of Science and Technology
    Inventor: Yong-Hoon Kim
  • Publication number: 20250029964
    Abstract: A display device includes a bank pattern disposed on a substrate, a first electrode pattern disposed on the bank pattern, a light-emitting element disposed on the first electrode pattern to be electrically connected to the first electrode pattern, a second electrode pattern configured to cover the light-emitting element, an inorganic insulating layer configured to cover the bank pattern, the first electrode pattern, and the light-emitting element between the first electrode pattern and the second electrode pattern, and a diffusion layer which includes a plurality of diffusion particles and is in contact with the inorganic insulating layer.
    Type: Application
    Filed: July 17, 2024
    Publication date: January 23, 2025
    Applicant: LG DISPLAY CO., LTD.
    Inventors: Jong Soo HAN, Yong Hoon LEE, Woo Sung KIM, Hyoung Sun PARK, Hyun Seok NA, Hyun Chyol SHIN, Seong Soo CHO, Kyeong Min YUK
  • Publication number: 20250031498
    Abstract: A display panel and a display apparatus including the display panel are presented herein. A display panel according to one or more embodiments includes a substrate; an insulating layer on the substrate; a bank pattern on the insulating layer; a first electrode on the bank pattern; a contact electrode on the insulating layer, the contact electrode spaced apart from the bank pattern; a light-emitting element on the first electrode; a first optical layer surrounding the light-emitting element, the first optical layer comprising an organic insulating material including metal particles; a second optical layer on the contact electrode; and a third optical layer on the first optical layer.
    Type: Application
    Filed: May 28, 2024
    Publication date: January 23, 2025
    Inventors: Yong Hoon Lee, Woo Sung Kim, Jong Soo Han, Sang Hak Shin, Dong Kyu Kim, Hyoung Sun Park, Hyun Seok Na, Hyun Chyol Shin, Seong Soo Cho
  • Patent number: 12202393
    Abstract: An electric headrest sliding device includes a slider configured to be movable upwards and downwards by driving of a motor, a front frame of a headrest, and a rotation link configured to connect the slider to the front frame, wherein the rotation link is rotated forwards or rearwards to push or pull the front frame during upward-and-downward movement of the slider, thereby accurately adjusting the front and rear positions of the headrest.
    Type: Grant
    Filed: March 3, 2023
    Date of Patent: January 21, 2025
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SEOYONCNF
    Inventors: Sang Uk Yu, Tae Hoon Lee, Sang Ho Kim, Seung Young Lee, Jun Namgoong, Yong Jun Shin
  • Patent number: 12205904
    Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 21, 2025
    Assignee: Nepes Co., Ltd.
    Inventors: Yong Tae Kwon, Jun Kyu Lee, Dong Hoon Oh, Su Yun Kim, Kyeong Rok Shin
  • Publication number: 20250022984
    Abstract: A light emitting diode includes an n-type nitride semiconductor layer, a V-pit generation layer located over the n-type nitride semiconductor layer and having a V-pit, an active layer located on the V-pit generation layer, and a p-type nitride semiconductor layer located on the active layer. The active layer includes a well layer, which includes a first well layer portion formed along a flat surface of the V-pit generation layer and a second well layer portion formed in the V-pit of the V-pit generation layer. The active layer emits light having at least two peak wavelengths at a single chip level.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Yong Hyun BAEK, Ji Hun KANG, Chae Hon KIM, Ji Hoon PARK
  • Publication number: 20250024037
    Abstract: The present invention provides a method and device wherein segmentation information for a current picture is encoded/decoded, and the current picture is segmented into at least one of sub-picture units, slice units, and tile units according to the encoded/decoded segmentation information.
    Type: Application
    Filed: October 2, 2024
    Publication date: January 16, 2025
    Applicant: HANWHA VISION CO., LTD.
    Inventors: Jae Gon KIM, Ji Hoon DO, Do Heon PARK, Yong Uk YOON
  • Publication number: 20250022608
    Abstract: The present invention relates to a method and device for predicting aneurysm rupture using artificial intelligence based on morphological and hemodynamic factors of aneurysms. The method for predicting aneurysm rupture according to one embodiment of the present disclosure may comprises acquiring an image of a blood vessel; deriving moment of inertia based on the image of the blood vessel; acquiring a hemodynamic factor; outputting the rupture risk when the moment of inertia and the hemodynamic factor are inputted to a pre-trained artificial neural network; and predicting the possibility of rupture as possible when the rupture risk is greater than a predetermined rupture threshold value, and predicting the possibility of rupture as absent when the rupture risk is not greater than the predetermined rupture threshold value.
    Type: Application
    Filed: September 30, 2024
    Publication date: January 16, 2025
    Inventors: Je Hoon OH, Hyeondong YANG, Yong Bae KIM, Jung-Jae KIM, Kwang-Chun CHO
  • Patent number: 12114428
    Abstract: An electronic component embedded substrate includes: an insulating material including a cavity formed in one surface thereof; a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity; solders disposed on side surfaces of the cavity; and an electronic component disposed in the cavity and at least partially in contact with the solders, wherein the protective layer has a material different from that of the insulating material.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: October 8, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Je Ji, Yong Hoon Kim, Seung Eun Lee
  • Patent number: 12108534
    Abstract: A substrate structure and electronic device provide improved power integrity and simplified manufacturing. The substrate structure includes a first printed circuit board, having a first side and a second side opposing each other, and a plurality of passive components embedded in the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components and a smallest distance between adjacent second passive components.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: October 1, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Eun Lee, Yong Hoon Kim
  • Patent number: 12108535
    Abstract: A printed circuit board (PCB) includes a substrate including a first insulating layer and first wiring patterns disposed on the first insulating layer, an optical sensing chip including a vertical cavity surface emitting laser (VCSEL) and a photodiode, disposed on the first insulating layer to be in contact with at least one of the first wiring patterns, a transimpedance amplifier (TIA) chip disposed to be spaced apart from the optical sensing chip on the first insulating layer and disposed to be in contact with at least one first wiring pattern, different from the first wiring pattern connected to the optical sensing chip, among the first wiring patterns, and a dielectric layer stacked on the substrate and having a hole exposing the VCSEL and the photodiode of the optical sensing chip. The optical sensing chip and the transimpedance amplifier chip are connected through a wiring pattern disposed on the dielectric layer.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: October 1, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Yun Kim, Seung Eun Lee, Yong Hoon Kim
  • Publication number: 20240209022
    Abstract: The present invention relates to novel peptides having anti-inflammatory and tissue regenerative actions and uses thereof.
    Type: Application
    Filed: May 4, 2023
    Publication date: June 27, 2024
    Applicant: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECHNOLOGY
    Inventors: Chul-Ho LEE, Yong-Hoon KIM, Kyoung-Shim KIM, Jung-Ran NOH, Kyeong-Ryooon LEE, Byoung-Chan KIM, Dong-Hee CHOI, Jae-Hoon KIM, Eun-Jung KANG, Jun GO, Young-Keun CHOI, In-Bok LEE, Yun-Jung SEO, Jung-Hyeon CHOI, Dong-Ho CHANG, Hye-Yeon PARK, Jung-Ho PARK
  • Publication number: 20240194876
    Abstract: A positive electrode additive for a lithium secondary battery can improve atmospheric stability. A method of manufacturing the same and a positive electrode for a lithium secondary battery includes the same. The positive electrode additive for a lithium secondary battery is used to manufacture the positive electrode for a lithium secondary battery and includes a lithium (Li)-based additive core and a coating layer of NbOXCy (0?x?2.5 and 0?y?1; where Nb=niobium, O=oxygen, C=carbon) formed on a surface of the additive core.
    Type: Application
    Filed: October 27, 2023
    Publication date: June 13, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Da Bin Jang, Sung Ho Ban, Sang Hun Lee, Yong Hoon Kim, Ha Eun Lee, Seung Min Oh, Chang Hoon Song, Sung Min Park, Hyo Bin Lee, Tae Hee Kim, Min Sik Park
  • Publication number: 20240172368
    Abstract: A printed circuit board includes: a first board unit including a plurality of first insulating layers and a plurality of first wiring layers respectively disposed on or in the plurality of first insulating layers; a second board unit including one or more second insulating layers and one or more second wiring layers respectively disposed on or in the one or more second insulating layers; and a first passive device embedded in at least one of the first and second board units. The second board unit is disposed on the first board unit, and the first board unit has a second cavity passing through at least a portion of the plurality of first insulating layers on the first passive device based on a stacking direction of the plurality of first wiring layers.
    Type: Application
    Filed: May 26, 2023
    Publication date: May 23, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Je JI, Yong Hoon KIM, Seung Eun LEE, Joo Hwan JUNG
  • Publication number: 20240164028
    Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; and a plurality of second circuit patterns respectively disposed on the first insulating layer and respectively having a thickness, thinner than a thickness of each of the plurality of first circuit patterns. At least one of the plurality of first circuit patterns and at least one of the plurality of second circuit patterns are alternately and repeatedly arranged, and a method for manufacturing the printed circuit board, are provided.
    Type: Application
    Filed: July 6, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Ha Kang, Seung Eun Lee, Yong Hoon Kim
  • Patent number: 11963311
    Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers, a passive component disposed in the cavity and including an external electrode electrically connected to at least one of the plurality of wiring layers, and a bridge disposed on the passive component in the cavity and including one or more circuit layers electrically connected to the external electrode.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Woong Choi, Yun Je Ji, Seung Eun Lee, Yong Hoon Kim
  • Publication number: 20240055582
    Abstract: Disclosed are a positive electrode additive material for a lithium secondary battery having an enhancement in atmospheric stability, a method for preparing the same, and a positive electrode for a lithium secondary battery including the same. The positive electrode material includes an core including a lithium component, and a coating layer formed on a surface of the core and including a compound having a formula of LiM?O3 wherein M? is Ta or Nb.
    Type: Application
    Filed: April 20, 2023
    Publication date: February 15, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Chang Hoon Song, Yoon Sung Lee, Sung Ho Ban, Sang Hun Lee, Yong Hoon Kim, Ko Eun Kim, Da Bin Jang, Ha Eun Lee, Hui Beom Nam, Jun Ki Rhee, Seung Min Oh, Sung Min Park, Hyo Bin Lee, Tae Hee Kim, Min Sik Park
  • Publication number: 20240047584
    Abstract: Disclosed are a thin-film transistor and a method for manufacturing the same. The thin-film transistor includes: a substrate serving as a gate electrode; a gate insulating film formed on the substrate; a metal layer formed on the gate insulating film; a metal oxide layer formed on the metal layer and covering an entirety of a surface of the metal layer; a metal oxide semiconductor layer formed so as to cover an entirety of a surface of the metal oxide layer; and a source/drain electrode formed on the metal oxide semiconductor layer, wherein the thin-film transistor further comprises an oxygen depletion layer disposed in an area of the metal oxide semiconductor layer adjacent to the metal oxide layer, wherein the metal oxide semiconductor layer is obtained by crystallizing an amorphous metal oxide semiconductor layer under heat-treatment.
    Type: Application
    Filed: July 10, 2023
    Publication date: February 8, 2024
    Applicants: CHUNGANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION, RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Sung Kyu PARK, Seong Pil JEON, Yong-Hoon KIM, Bo Yeon PARK
  • Patent number: 11894191
    Abstract: A multilayer electronic component may include a first internal electrode layer including a first dielectric layer and first to fourth internal electrodes disposed to be spaced apart from each other on the first dielectric layer, a second internal electrode layer including a second dielectric layer and a fifth internal electrode disposed on the second dielectric layer, a body including a capacitance forming portion in which the first internal electrode layer and the second internal electrode layer are alternately disposed, a connection electrode penetrating through the first and second internal electrode layers, spaced apart from the first to fourth internal electrodes, and connected to the fifth internal electrode, first to fourth external electrodes disposed to be connected to the first to fourth internal electrodes, respectively, on the body, and a fifth external electrode disposed to be connected to the connection electrode on the body.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: February 6, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hoon Kim, Ji Hoon Kim, Gyoung Heon Ko, Yong Hoon Kim
  • Publication number: 20240036093
    Abstract: An apparatus for measuring characteristics of a capacitor component includes a measurement terminal connected to a capacitor component, an inductor connected to the measurement terminal, and a controller generating characteristic information of the capacitor component based on LC resonance of the capacitor component and the inductor. The controller generates capacitance information of the capacitor component based on inductance, based on at least one of a resonant frequency and an amplitude of the LC resonance and the resonant frequency.
    Type: Application
    Filed: July 11, 2023
    Publication date: February 1, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Joo Kim, Seung Won Park, Hee Sun Han, Yong Hoon Kim, Sang Jin Park