Abstract: A method for turbocharger key-off cooling control may include performing turbocharger key-off cooling control based on engine load for circulating engine coolant to a turbocharger cooling line when high cooling performance of a vehicle is checked by a coolant temperature and an oil temperature at which a turbocharger controller does not require operation of an auxiliary electric water pump when an engine is stopped.

Abstract: Provided is an air conditioner capable of preventing a soldering defect when a circuit element is installed on a circuit board. The air conditioner includes a circuit board configured to form a circuit, a choke coil installed on the circuit board and having a wire wound around on a core, and a support device installed at a lower side of the choke coil to support the choke coil, and provided with a through-hole allowing the wire to pass therethrough, wherein the support device includes a support portion that protrudes from a lower surface of the support device to support the choke coil installed on the circuit board at an interval from the circuit board, the support portion disposed to be spaced apart from the through-hole in a direction away from an outer edge of the support device.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: A quantum hybridization negative differential resistance device having negative differential resistance (NDR) under a low voltage condition using a nanowire based on an organic-inorganic hybrid halide perovskite, and a circuit thereof are provided. The quantum hybridization negative differential resistance device includes a channel formed of an organic-inorganic hybrid halide perovskite crystal and electrodes formed of its inorganic framework and is connected to opposite ends of the channel.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, a heat emission member on the lower semiconductor chip, the heat emission member having a horizontal unit and a vertical unit connected to the horizontal unit, a first semiconductor chip stack and a second semiconductor chip stack on the horizontal unit, and a molding member that surrounds the lower semiconductor chip, the first and second semiconductor chip stacks, and the heat emission member. The vertical unit may be arranged between the first semiconductor chip stack and the second semiconductor chip stack, and an upper surface of the vertical unit may be exposed in the molding member.

Abstract: The present invention relates to: a composition comprising a Sicyos angulatus extract or a fraction thereof as an effective ingredient for preventing, alleviating, or treating liver diseases; and a method for preventing or treating liver diseases, comprising a step of administering the composition to a subject suspected of having a liver disease.

Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.

Abstract: A substrate having an embedded interconnect structure includes an interconnect structure including a circuit member including circuit layers and a passive device disposed in parallel with the circuit member and including an external electrode, and a printed circuit board including an insulating layer covering the interconnect structure, a first wiring layer disposed on the insulating layer, a first wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to an uppermost circuit layer, among the circuit layers, and a second wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to the external electrode of the passive device. A top surface of the uppermost circuit layer, contacting the first wiring via, is coplanar with a top surface of the external electrode, contacting the second wiring via.

Abstract: A semiconductor package includes a connection member having first and second surfaces opposing each other and including a redistribution layer, an integrated circuit chip disposed on the first surface of the connection member, and including a plurality of units, at least one capacitor on the first surface of the connection member and in proximity to the integrated circuit chip, and an encapsulant on the first surface of the connection member and encapsulating the integrated circuit chip and the at least one capacitor, wherein the plurality of units include core power units selected from the group consisting of a central processing unit, a graphics processing unit, and an artificial intelligence unit, at least one of the core power units is disposed adjacent to one edge of the integrated circuit chip, and the at least one capacitor is disposed adjacent to the one edge of the integrated circuit chip.

Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.

Abstract: Provided is an apparatus for managing image data, by which the image data transferred to a mobile device from an image capturing device connected to the mobile device is managed. The apparatus may include a first controller located in a native layer for communicating with a java layer, a second controller located in a java layer for communicating with the native layer, and a plurality of ring-buffer type shared memories in which the image data transferred from the image capturing device is stored. The first controller may store the image data in the shared memory at a first state according to the order of the shared memories and may change the state information of the shared memory to a second state when the image data is completely stored. The second controller may read the image data stored in the shared memories at the second state according to the order of the shared memories and may change the state information of the shared memory to the first state when the image data is completely read.

Abstract: Provided is a back cover for a portable terminal having remote control function, comprising: an infrared module provided on an upper end of the back cover, receiving power from the portable terminal, and emitting infrared rays; a button module including function keys, provided on a front surface of the back cover, and transmitting a control signal to the infrared module, wherein the control signal remotely controls an electronic product; a power supply and data connection module provided on a lower end of a back surface of the back cover; an application execution function key provided on the back cover and executing a remote control application which is installed on the portable terminal; and a camera activation function key provided on the back cover and activating a camera, wherein the camera is mounted on the portable terminal.

Abstract: The present disclosure relates to an Akkermansia muciniphila strain having a prophylactic or therapeutic effect on a degenerative brain disease and uses thereof. Since the Akkermansia muciniphila strain, the intestinal microorganism of the present disclosure, shows an effect of improving movement control and cognitive abilities as well as memory in an animal model having a degenerative brain disease such as Parkinson's disease and Alzheimer's disease, it can be useful in the prevention or treatment of brain diseases including Alzheimer's disease, Parkinson's disease, mild cognitive impairment, etc. In addition, it was confirmed in the present disclosure that compared to the Akkermansia muciniphila strain cultured in a mucin-containing medium, that cultured in a mucin-free medium showed a remarkable effect of improving hyperlipidemia, fatty liver, obesity, and hyperglycemia induced in a mouse model by high-fat diet when administered orally (in vivo).

Abstract: The present invention relates to a rolling facility and a rolling method. According to the present invention, the rolling facility comprises: a roughing mill having a roughing mill roll for pressing a material to be transferred; a finishing mill having a finishing mill roll, which is provided on a material transfer path, and pressing the material having passed through the roughing mill; a wiper device provided at a feed-in side of the finishing mill roll, polishing the surface of the finishing mill roll, and supplying cooling fluid to the material; and a cooling device provided on the material transfer path and cooling the material having passed through the finishing mill, wherein the wiper device can include a plurality of cooling header units for supplying the cooling fluid to the material at different positions.

Abstract: Provided are an Agathobaculum sp. strain having prophylactic or therapeutic effects on degenerative brain diseases, and use thereof. Since the intestinal microorganism Agathobaculum butyriciproducens SR79 strain of the present invention may have effects of inhibiting neuroinflammation and effects of improving movement regulation and cognitive and memory functions in animal models with degenerative brain diseases such as Parkinson's disease and Alzheimer's disease, the strain may be effectively used in foods, medicines, or feeds for preventing or treating brain diseases including Alzheimer's disease, Parkinson's disease, mild cognitive impairment, etc., and therefore, it is very useful in the relevant industries.

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, a heat emission member on the lower semiconductor chip, the heat emission member having a horizontal unit and a vertical unit connected to the horizontal unit, a first semiconductor chip stack and a second semiconductor chip stack on the horizontal unit, and a molding member that surrounds the lower semiconductor chip, the first and second semiconductor chip stacks, and the heat emission member. The vertical unit may be arranged between the first semiconductor chip stack and the second semiconductor chip stack, and an upper surface of the vertical unit may be exposed in the molding member.

Abstract: Provided is an image data management apparatus, by which the image data transferred to a mobile device from an image capturing device connected to the mobile device is managed. The apparatus may include a first controller located in a native layer for communicating with a java layer, a second controller located in a java layer for communicating with the native layer, and a shared memory in which the image data transferred from the image capturing device is stored. The first controller may store the image data transferred from the image capturing device in the shared memory when state information of the shared memory is at a first state, and change the state information of the shared memory to a second state when the image data is completely stored in the shared memory.

Abstract: A method for receiving a signal by using M multiple beams in a multi-antenna system including N antenna elements, is provided in and embodiment of the present application. The method includes setting, by M beams, a beam direction for the M beams and a modulation frequency for frequency modulation of a beam response and generating the M beams according to the beam direction and the modulation frequency set by the beams. M beam responses are generated for a receiving signal by using the generated M beams and the generated M beam responses are frequency modulated by using the modulation frequency set by the beams. The frequency-modulated M beam responses are band-pass filtered so as to separate the M beam responses and the separated M beam responses are respectively demodulated.

Abstract: A semiconductor package includes a substrate. A vertically stacked chip structure including two semiconductor chips is mounted on the substrate. A third semiconductor chip is mounted on the substrate and is spaced apart horizontally from the vertically stacked chip structure. A package molding material is disposed on the substrate and covers sidewalls of the vertically stacked chip structure and covers sidewalls of the third semiconductor chip. An electromagnetic shielding layer extends along sidewalls of the package molding material and along an upper surface of the package molding material. The first semiconductor chip is disposed between the second semiconductor chip and the substrate. The first semiconductor chip is connected to a first grounding through via and a first signal/power through via. The second semiconductor chip is connected to a second grounding through via. The electromagnetic shielding layer is connected to the second grounding through via.