Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

Abstract: A piezoelectric thin film filter includes: a substrate comprising a parallel cavity constituting the parallel resonator and a series cavity constituting the series resonator; a parallel lower electrode formed on a parallel substrate portion constituting the parallel resonator in the substrate; a series lower electrode formed on a series substrate portion constituting the series resonator in the substrate; a piezoelectric layer formed on the substrate, the parallel lower electrode, and the series lower electrode; and an upper electrode formed on the piezoelectric layer, wherein the series lower electrode comprises a first series lower electrode formed on a portion where the series cavity is formed in the series substrate portion, and a second series lower electrode formed on a portion where the series cavity is not formed in the series substrate portion, wherein a thickness of the first series lower electrode is less than or equal to a predetermined thickness.

Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.

Abstract: An air-gap type film bulk acoustic resonator (FBAR) according to the present invention may include: a substrate comprising an air gap portion on an upper surface thereof; a lower electrode formed on the substrate; a piezoelectric layer formed on the lower electrode; an upper electrode formed on the piezoelectric layer; a protective layer formed on the upper electrode; and a beam structure extended in a dome shape from one side of the upper electrode to define a space portion between the upper electrode and the piezoelectric layer, wherein one end of the beam structure is in contact with the piezoelectric layer.

Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed.

Abstract: A substrate treating apparatus of the present disclosure comprises: a chamber member having an accommodation space configured to accommodate a vessel part where a substrate treatment region constituting a supercritical treatment space are formed, and an opening configured to move the substrate inside or outside; a shutter configured to open or close the chamber member; and a first exhaust part configured to discharge an internal air from the accommodation space to the outside, wherein the temperature of the substrate treatment region is increased.

Abstract: A method for verifying a drone included in an industrial Internet of Things (IIoT) system, using a petri-net modeling is disclosed. In an embodiment, the method includes a step of modeling the IIoT system as a hierarchical petri-net (modeling step); and a step of verifying whether the drone has security vulnerability on the basis of the hierarchical petri-net model (verification step), wherein the verification step can determine that a drone has security vulnerability when at least one of a plurality of determination factors provided as places to the hierarchical petri-net model determines that the drone is operating abnormally.

Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.

Abstract: The present disclosure relates to a method of producing hydrogen peroxide (H2O2) using a microorganism of the genus Desemzia. According to the present disclosure, to overcome transportation cost problems associated with a special transport container, a low temperature and a stabilizer, other than the production cost of hydrogen peroxide (H2O2), Desemzia sp. strain C1, a hydrogen peroxide (H2O2)-producing microorganism, is isolated, cultured, and used to produce hydrogen peroxide (H2O2), and thus it may overcome the transportation cost problems and may be effectively used in an environmentally friendly and economical way in pollutant degradation processes, including sewage treatment plants.

Abstract: Provided are an ozone water decomposition apparatus and method that can decompose ozone water quickly and stably.

Abstract: The present invention relates to user interface distribution method for multi-device interaction, and more particularly, to use the screens of a plurality of smart devices as user interfaces in flexible and fast manner without modifying the code of the application running in these devices. According to the present invention, by separating a subtree including target UI objects of a host device and moving it to a guest device, the target UI objects can be rendered on the guest device without modifying the application. In addition, since the interaction between the UI objects of the guest device and a host application logic is made in the form of a local function call, it is possible to transparently convert the local function call within the device into an RPC call between devices, also provides a way to maintain interaction between devices without modifying the application.

Abstract: An air-gap type film bulk acoustic resonator (FBAR) is provided. The air-gap type FBAR includes a substrate which comprises an air gap portion having a substrate cavity formed in a top surface, a lower electrode formed on the substrate, a piezoelectric layer which is formed on the lower electrode and has one side forming an edge portion in the vicinity of a virtual edge according to vertical projection of the air gap portion, an upper electrode formed on the piezoelectric layer, a first electrode frame which comprises an open ring structure in plane, the open ring structure surrounding a part of a periphery of the piezoelectric layer on the lower electrode, and a second electrode frame positioned on the upper electrode and adjacent to an open portion of the open ring structure.

Abstract: Disclosed is a method of decomposing ozone in ozone water. According to the present invention, a temperature of ozone water is increased by mixing ozone water with heated water, and the ozone in the ozone water is decomposed into oxygen by the increase in the temperature.

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus for treating the substrate includes a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber, and a rear surface cleaning unit for cleaning a rear surface of the substrate, in which the rear surface cleaning unit may clean the rear surface of the substrate while transferring the substrate from the liquid treating chamber to the drying chamber.

Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

Abstract: A substrate processing apparatus includes: a spin chuck, on which a substrate is mounted, the spin chuck rotating the substrate; At least one of a chemical liquid nozzle configured to provide a chemical liquid to a surface of the substrate and a deionzed water nozzle configured to provide a deionized water to a surface of the substrate; and a laser device configured to emit a pulse waver laser beam having a period of 10?9 seconds or less for etching an edge of the substrate.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first process treating unit configured to treat a substrate in a single-type method; a second process treating unit configured to treat a substrate in a batch-type method; and a posture changing unit provided between the first process treating unit and the second process treating unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process treating unit.

Abstract: A foldable display device includes a display module in which a panel hole is defined, a sensor device disposed in the panel hole, and a panel lower cover which is disposed on a surface of the display module and in which a cover hole is defined such that the sensor device is disposed in the cover hole, the panel lower cover including a buffer member and a first adhesive member, which attaches the buffer member to the surface of the display module where a minimum distance between the first adhesive member and the sensor device is greater than a minimum distance between the buffer member and the sensor device.

Abstract: The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.