Abstract: Disclosed is an air-gap type film bulk acoustic resonator (FBAR) including a substrate including an air-gap portion with a top surface in which a substrate cavity is formed, a lower electrode formed above the substrate while surrounding the air-gap portion, a piezoelectric layer formed above the lower electrode, and an upper electrode formed above the piezoelectric layer corresponding to a virtual area formed according to a vertical projection of the air-gap portion. Here, the piezoelectric layer includes a void portion having a piezoelectric cavity between the lower electrode and the upper electrode, and the void portion is formed below an edge portion corresponding to an end part of the upper electrode.

Abstract: An air-gap type film bulk acoustic resonator (FBAR) according to the present invention may include: a substrate comprising an air gap portion on an upper surface thereof; a lower electrode formed on the substrate; a piezoelectric layer formed on the lower electrode; an upper electrode formed on the piezoelectric layer; a protective layer formed on the upper electrode; and a beam structure extended in a dome shape from one side of the upper electrode to define a space portion between the upper electrode and the piezoelectric layer, wherein one end of the beam structure is in contact with the piezoelectric layer.

Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.

Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.

Abstract: Semiconductor devices and methods of forming the same are provided. The methods may include forming first and second line patterns. The first line pattern has a first side facing the second line pattern, and the second line pattern has a second side facing the first line pattern. The methods may also include forming a first spacer structure on the first side of the first line pattern and a second spacer structure on the second side of the second line pattern. The first and the second spacer structures may define an opening. The methods may further include forming a first conductor in a lower part of the opening, forming an expanded opening by etching upper portions of the first and second spacer structures, and forming a second conductor in the expanded opening. The expanded opening may have a width greater than a width of the lower part of the opening.

Abstract: The present invention relates to a stirring rod of hot and cold foods supplying machine and an assembled stirring unit thereof. The assembled stirring unit includes an assembled piece and a stirring blade, wherein a length direction of the assembled piece is an axial direction, a direction perpendicular to the axial direction is a radial direction, and the assembled piece has a first joining piece and a second joining piece respectively at two ends thereof in the axial direction. The stirring blade is provided on the assembled piece and extends towards the radial direction, and the stirring blade is twisted at an angle by having the radial direction as an axis. The stirring rod is formed by serially connecting multiple assembled stirring units along the axial direction.

Abstract: A display device is provided.

Abstract: Disclosed is an air-gap type film bulk acoustic resonator (FBAR) including a substrate including an air-gap portion which has a substrate cavity and is formed in a top surface, a lower electrode formed above the substrate, a piezoelectric layer formed above the lower electrode, and an upper electrode formed above the piezoelectric layer and having one side on which an electrode edge is formed to be adjacent to a vertical virtual boundary of a sidewall of the air-gap portion. Here, the piezoelectric layer includes a piezoelectric cavity formed below the electrode edge.

Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.

Abstract: The present invention relates to an assembled material tube of hot and cold foods supplying machine, including a plurality of material tube bodies, in which penetrating feed channels are provided internally; each of the material tube bodies has a cooling channel provided with an inlet and an outlet to respectively and correspondingly input and output a working fluid through the cooling channel for performing thermal exchanges, whereby cooling occurs in segmentations for each of the feed channels; a plurality of temperature measurement units each of which is provided with a detecting end for detecting a temperature in the corresponding feed channel; and a plurality of heating units perform heating in segmentations for each of the feed channels. Accordingly, said machine can be separately used as hot food supplying machine or cold food supplying machine, so as to achieve the aim of using one machine for two purposes.

Abstract: A method for verifying a drone included in an industrial Internet of Things (IIoT) system, using a petri-net modeling is disclosed. In an embodiment, the method includes a step of modeling the IIoT system as a hierarchical petri-net (modeling step); and a step of verifying whether the drone has security vulnerability on the basis of the hierarchical petri-net model (verification step), wherein the verification step can determine that a drone has security vulnerability when at least one of a plurality of determination factors provided as places to the hierarchical petri-net model determines that the drone is operating abnormally.

Abstract: A foldable display device includes a display module in which a panel hole is defined, a sensor device disposed in the panel hole, and a panel lower cover which is disposed on a surface of the display module and in which a cover hole is defined such that the sensor device is disposed in the cover hole, the panel lower cover including a buffer member and a first adhesive member, which attaches the buffer member to the surface of the display module where a minimum distance between the first adhesive member and the sensor device is greater than a minimum distance between the buffer member and the sensor device.

Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

Abstract: A method of manufacturing an electronic device. For example and without limitation, various aspects of the present disclosure provide a method of manufacturing an electronic device that comprises a die comprising a circuit side and a second die side opposite the circuit side, a through hole in the die that extends between the second side of the die and the circuit side of the die, an insulating layer coupled to the inner wall of the through hole, a through electrode inside of the insulating layer, a dielectric layer coupled to the second side of the die, and a conductive pad coupled to the through electrode. The through electrode and the insulating layer may, for example, extend substantially the same distance from the second side of the die.

Abstract: A light sensing device, according to an embodiment, for sensing light emitted from a light source, and reflected or scattered from an object comprises: a light transmitting member; and a light sensing unit disposed on the light transmitting member, wherein the light sensing unit comprises: a light transmitting region; a first electrode layer; a semiconductor layer; and a second electrode layer, wherein the semiconductor layer comprises: a first semiconductor layer disposed around the light-transmitting region; and a second semiconductor layer disposed outside the first semiconductor layer.

Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.

Abstract: Semiconductor devices and methods of forming the same are provided. The methods may include forming first and second line patterns. The first line pattern has a first side facing the second line pattern, and the second line pattern has a second side facing the first line pattern. The methods may also include forming a first spacer structure on the first side of the first line pattern and a second spacer structure on the second side of the second line pattern. The first and the second spacer structures may define an opening. The methods may further include forming a first conductor in a lower part of the opening, forming an expanded opening by etching upper portions of the first and second spacer structures, and forming a second conductor in the expanded opening. The expanded opening may have a width greater than a width of the lower part of the opening.

Abstract: An air-gap type film bulk acoustic resonator (FBAR) is provided. The air-gap type FBAR includes a substrate which comprises an air gap portion having a substrate cavity formed in a top surface, a lower electrode formed on the substrate, a piezoelectric layer which is formed on the lower electrode and has one side forming an edge portion in the vicinity of a virtual edge according to vertical projection of the air gap portion, an upper electrode formed on the piezoelectric layer, a first electrode frame which comprises an open ring structure in plane, the open ring structure surrounding a part of a periphery of the piezoelectric layer on the lower electrode, and a second electrode frame positioned on the upper electrode and adjacent to an open portion of the open ring structure.

Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.

Abstract: A display device is provided.