Abstract: Semiconductor devices may include a field insulating layer that is on a substrate, a gate structure that is on the substrate and separated from the field insulating layer, a first spacer structure that is on sidewalls and a lower surface of the gate structure and is separated from the field insulating layer, and a second spacer structure that is on a part of an upper surface of the field insulating layer that is overlapped by the gate structure.

Abstract: Provided is a method for preparing a sterilizing deodorant and a sterilizing deodorant prepared thereby. Particularly, the method for preparing a sterilizing deodorant includes preparing a first mixed solution containing a green tea leaf extract, a Lespedeza bicolor leaf extract, a Chamaecyparis obtusa leaf extract and a calcined shellfish shell powder, preparing a second mixed solution by adding germanium oxide and nano silver to the first mixed solution, and filtering the second mixed solution through a tourmaline filter. The germanium oxide and the nano silver are contained in a weight ratio of 1:0.5 to 1:3.

Abstract: The disclosure provides a magnetic field sensor for sensing the magnetic field caused by a current to be measured, which includes: substrate; a first drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured; and a second drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured, thus measuring the variation of a capacitance caused by the movement of the first drive electrode and the second drive electrode. Hence, the sensing is achieved by the two drive electrodes with no reference electrode, thus maximizing the mechanical displacement to improve the sensing capability.

Abstract: The present invention provides an amplitude modulator, which is disposed in an area through which a magnetic field flows so as to modulate amplitudes, comprising: a substrate; a first driving electrode which receives a first frequency signal and a second frequency signal supplied from the substrate and carries out resonant motion by the magnetic field; and a second driving electrode for receiving the second frequency signal and carries out resonant motion by the first driving electrode and the magnetic field, wherein a modulated signal is generated by modulating the amplitudes of the first and second frequency signals through the resonant motions of the first and second driving electrodes. Therefore, since the signal generated by modulating a carrier signal through mechanical resonance according to the magnetic field is outputted, amplitude modulation can be carried out without a complicated circuit configuration.

Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.

Abstract: A first conductivity type finFET device can include first embedded sources/drains of a first material that have a first etch rate. The first embedded sources/drains can each include an upper surface having a recessed portion and an outer raised portion relative to the recessed portion. A second conductivity type finFET device can include second embedded sources/drains of a second material that have a second etch rate than is greater that the first etch rate. The second embedded sources/drains can each include an upper surface that is at a different level than the outer raised portions of the first conductivity type finFET device.

Abstract: A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.

Abstract: A magnetic field sensor package according to an embodiment includes: a package body; a magnetic field sensor disposed on top of the package body and including a sensor assembly in which a displacement is generated by a magnetic field; and a conductive line formed on the package body, which is for making current to be measured flow and generating a magnetic field for displacing the sensor assembly, wherein the conductive line generates a magnetic field applied in a perpendicular direction to the sensor assembly.

Abstract: Disclosed are a capacitor and a method of fabricating the same. The capacitor includes a first electrode; a second electrode spaced apart from the first electrode while facing the first electrode; a driving member connected to the second electrode to move the second electrode relative to the first electrode; and an insulating connection member between the driving member and the second electrode.

Abstract: To form a semiconductor device, a through electrode is formed in a semiconductor die, and a dielectric layer is then formed to cover the through electrode. The dielectric layer has an opening by being partially etched to allow the through electrode to protrude to the outside, or has a thickness thinner overall so as to allow the through electrode to protrude to the outside. Subsequently, a conductive pad is formed on the through electrode protruding to the outside through the dielectric layer by using an electroless plating method.

Abstract: The present invention provides an amplitude modulator, which is disposed in an area through which a magnetic field flows so as to modulate amplitudes, comprising: a substrate; a first driving electrode which receives a first frequency signal and a second frequency signal supplied from the substrate and carries out resonant motion by the magnetic field; and a second driving electrode for receiving the second frequency signal and carries out resonant motion by the first driving electrode and the magnetic field, wherein a modulated signal is generated by modulating the amplitudes of the first and second frequency signals through the resonant motions of the first and second driving electrodes. Therefore, since the signal generated by modulating a carrier signal through mechanical resonance according to the magnetic field is outputted, amplitude modulation can be carried out without a complicated circuit configuration.

Abstract: A cleaning solution composition includes an organic solvent in which a metal fluoride does not dissolve, at least one fluoride compound that generates bifluoride (HF2?), and deionized water, wherein the deionized water may be included in a concentration of 1.5 wt % or lower based on the total weight of the cleaning solution composition.

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract: The disclosure provides a magnetic field sensor for sensing the magnetic field caused by a current to be measured, which includes: substrate; a first drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured; and a second drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured, thus measuring the variation of a capacitance caused by the movement of the first drive electrode and the second drive electrode. Hence, the sensing is achieved by the two drive electrodes with no reference electrode, thus maximizing the mechanical displacement to improve the sensing capability.

Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.

Abstract: The disclosure provides a MEMS device including: a fixed substrate having a cavity; a driving unit disposed in the cavity and floating above the fixed substrate; and an elastic unit for physically connecting the fixed substrate with the driving unit and varying the height of the driving unit according to a control current, wherein the elastic unit includes a bimorph driving unit connected to the fixed substrate and bent according to the control current, a spring connected to the driving unit, and a frame connecting the bimorph driving unit to the spring. Therefore, in order to overcome the limitations according to the power consumption and the size-reduction due to a coil and a magnet, the MEMS device drives one lens and thus can reduce the power consumption and the size thereof.

Abstract: Disclosed is a funding management and post-management system using an open platform, including: an investor terminal which accesses an open platform server system over a communication network, checks histories and current achievement statuses of milestones of companies, and inputs investment intentions; a company terminal which accesses the open platform server system over a communication network, registers company information and current achievement status of a milestone, and inputs whether funding is in progress; and the open platform server system which operates a homepage for providing the company information to the investor terminal and the company terminal accessed over a communication network, displays the current achievement status of the milestone of each company, makes public a funding situation of a company which has requested funding, extracts a potential investor who has registered a company which has started funding as an interest company, and performs crowdfunding while individually providing n

Abstract: A system for removing a photoresist includes a solution storage configured to store a preliminary photoresist removal solution, a solution activation unit configured to convert the preliminary photoresist removal solution from the solution storage into an activated photoresist removal solution, and a photoresist removal unit configured to receive the activated photoresist removal solution from the solution activation unit, and configured to load a substrate including a photoresist pattern formed thereon.

Abstract: A cleaning solution composition includes an organic solvent in which a metal fluoride does not dissolve, at least one fluoride compound that generates bifluoride (HF2?), and deionized water, wherein the deionized water may be included in a concentration of 1.5 wt % or lower based on the total weight of the cleaning solution composition.

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.