Abstract: The present invention discloses an apparatus and method for controlling a linear compressor which can actively handle load and efficiently perform an operation, by synchronizing an operation frequency with a natural frequency of a movable member varied by the load.

Abstract: A semiconductor package and module, and methods of fabricating the same are provided. A method of fabricating a semiconductor package may include bonding rear surfaces of first and second semiconductor chips to each other, each of the semiconductor chips having chip pads exposed on front surfaces. The method may also include forming an encapsulation portion configured to encapsulate side surfaces of the bonded semiconductor chips, forming via plugs configured to pass through the encapsulation portion, forming an insulating layer configured to expose surfaces of the chip pads and the via plugs on the exposed surfaces of the two semiconductor chips and surfaces of the encapsulation portion, and forming package pads on the exposed surfaces of the chip pads and the surfaces of the via plugs.

Abstract: A manufacturing method of a polycrystalline solar cell is disclosed. A polycrystalline silicon solar cell in accordance with the present invention performs crystallization-annealing amorphous silicon with a metal catalyst so as to reduce a crystallization temperature. The manufacturing method of a solar cell in accordance with the present invention includes the steps of (a) forming a first amorphous silicon layer on a substrate; (b) forming a second amorphous silicon layer on the first amorphous silicon layer; (c) forming a metal layer on the second amorphous silicon layer; (d) performing crystallization-annealing the second amorphous silicon layer; and (e) forming a third amorphous silicon layer on a resulting crystalline silicon layer of the step (d).

Abstract: A polycrystalline silicon solar cell and its manufacturing method are disclosed. The polycrystalline silicon solar cell in according with the present invention is formed by crystallizing amorphous silicon, in which a metal catalyst is used to lower crystallization temperature. The solar cell in according with the present invention is characterized by comprising a plurality of polycrystalline silicon layers, wherein at least one of the plurality of polycrystalline silicon layers contains a metal component.

Abstract: A lamp socket includes a socket housing and a plurality of power supply members. The socket housing has a plurality of connecting holes extended in a vertical direction. The power supply members are disposed in the connecting holes, respectively, and each of the power supply members includes a plurality of lamp connecting parts and an inverter connecting part. The lamp connecting parts are protruded from an upper surface of the socket housing and include first and second portions facing each other. The inverter connecting part is integrally formed with the lamp connecting parts, and is protruded from a lower surface of the socket housing.

Abstract: A method of driving a light source includes: determining a location of pixel data of a display relative to a plurality of light-emitting blocks of a light source, obtaining a plurality of luminance values of the light-emitting blocks corresponding to the location by using a lookup table (LUT) storing the luminance values of the light-emitting blocks, generating a plurality of histograms corresponding to the light-emitting blocks, determining a plurality of target luminance values of the light-emitting blocks using the histograms, and driving the light-emitting blocks using the determined target luminance values. The luminance values of the light-emitting blocks are based on the location of the pixel data within an image block of the display corresponding to each light-emitting block. Each of the histograms indicates a frequency of each of the luminance values of a respective one of the light-emitting blocks.

Abstract: Provided is a printed circuit board having a bump interconnection structure that improves reliability between interconnection layers. Also provided is a method of fabricating the printed circuit board and semiconductor package using the printed circuit board. According to one embodiment, the printed circuit board includes a plurality of bumps formed on a resin layer between a first interconnection layer and a second interconnection layer. The second interconnection layer includes insertion holes corresponding to upper portions of the bumps so that the upper portions of the bumps protrude from the second interconnection layer. The upper portion of at least one of the bumps includes a rivet portion having a diameter greater that the diameter of the corresponding insertion hole to reliably interconnect the first and second interconnection layers.

Abstract: A method of driving a light source includes; converting an externally supplied direct current voltage into a first alternating current voltage, boosting the first alternating current voltage to a second alternating current voltage having a higher voltage than the first alternating current voltage, turning on the light source using the second alternating current voltage, detecting an arc noise detection voltage by adding arc noise generated from a high voltage terminal of the light source and arc noise generated from a low voltage terminal of the light source, and blocking the high voltage from being provided to the light source based on the detected arc noise detection voltage.

Abstract: The invention provides a cost effective way of determining the status of a light emitting device, such as a light emitting device in a non-emitting display device. The apparatus includes a light emitting device, a voltage supply coupled to the light emitting device for making a current flow through the light emitting device, and an electrically conductive device spaced apart from the light emitting device for inducing a voltage proportional to the voltage across the light emitting device. A status determining device determines the status of the light emitting device based on the voltage from the electrically conductive device.

Abstract: A method of driving a light source includes; driving a plurality of light-emitting blocks included in a light source module at a uniform luminance during an initial period in response to a power-on signal, and subsequently driving the plurality of light-emitting blocks individually in accordance with respective luminances of a plurality of image blocks aligned with each of the plurality of light-emitting blocks after the initial period.

Abstract: A light source device includes a light source module having a light-emitting block, an image analysis part, a duty ratio calculation part, a duty ratio determination part and a signal generation part. The image analysis part extracts representative luminance data of the light-emitting block based on pixel data. The duty ratio calculation part calculates duty ratio data of the light-emitting block based on the representative luminance data. The duty ratio determination part generates determined duty ratio data of the light-emitting block based on the duty ratio data from a first period, and the signal generation part generates a driving signal having a duty ratio corresponding to the determined duty ratio data to drive the light-emitting block.

Abstract: A rapid immunoassay method and apparatus for detecting foot and mouth disease virus are disclosed. The method and test device permit pen-side testing of animals and provide test results within a relatively short time period. In a preferred embodiment, the method and apparatus provide a means for differentiating between FMDV-infected and FMDV-vaccinated animals.

Abstract: Provided is a semiconductor package, a semiconductor module and a method for fabricating the semiconductor package. The method provides a substrate including a bonding pad. The method forms a dielectric layer for exposing the bonding pad on the substrate. The method forms a redistribution line which is electrically connected to the bonding pad, on the dielectric layer. The method forms an external terminal which is electrically connected to the bonding pad without using a solder mask which limits a position of the external terminal, on the redistribution line.

Abstract: A method of manufacturing a semiconductor device includes forming printed circuit board (PCB) having an embedded interposer. A semiconductor chip or a semiconductor package is mounted onto the embedded interposer using a conductive adhesive agent. The embedded interposer has substantially the same coefficient of thermal expansion (CTE) as the semiconductor chip. The embedded interposer is formed using a semiconductor wafer.

Abstract: A mobile terminal is provided. The mobile terminal includes an upper body, a lower body, and a slide module connecting the upper and lower bodies, where the slide module is configured to slidably move the upper body in a first linear motion relative to the lower body and to tilt the upper body at an angle relative to the lower body in a second motion. The slide module includes an upper slide member fixed to the upper body, a lower slide member fixed to the lower body, and at least one cam portion formed on the upper slide member such that the at least one cam portion is configured to contact the lower slide member when the upper slide member is moved toward an open configuration using the first motion, wherein the contact causes the upper slide member to tilt when the upper slide member is moved to the open configuration using the second motion.

Abstract: A fabricating method of a polysilicon layer is disclosed which can be applied for fabricating a semiconductor device such as a SRAM and so on.

Abstract: A semiconductor device package includes a semiconductor chip having a top surface on which a conductive pad is disposed, a bottom surface opposite to the top surface, and a side surface connecting the top and bottom surfaces to each other; a first insulating layer covering the top surface of the semiconductor chip and laterally extending to the outside of the semiconductor chip; a fillet member covering a boundary where the side surface of the semiconductor chip and the first insulating layer meet each other; and a molding layer covering the bottom surface of the semiconductor chip, the fillet member, and the first insulating layer.

Abstract: A slide type mobile terminal having a first body and a second body is provided. The first body includes a display and a first slide member. The second body includes a key pad and is slidably coupled to the first body. The second body includes a second slide member to slidably engage the corresponding first slide member of the first body to allow movement of the first body and the second body to enable one of closed or tilted configurations. One of the first and second slide members has a curvature along at least one end such that when the first body is extended from the second body, the first body is tilted at a predetermined angle with respect to the second body. The first body receives a portion of the second body and the second body receives a portion of the first body in the closed position.