Patents by Inventor Yong Jang

Yong Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090108774
    Abstract: In a backlight unit and an LCD apparatus having the backlight unit, in which the backlight unit includes a plurality of lamps and an inverter, the inverter provides the lamps with current. The inverter reduces current provided to the lamps to turn off the lamps. Therefore, currents are gradually decreased to reduce noise generated by the transformer when the lamps are turned off.
    Type: Application
    Filed: September 19, 2008
    Publication date: April 30, 2009
    Inventor: Hyeon-Yong Jang
  • Patent number: 7525068
    Abstract: A heating system of a batch type reaction chamber for semiconductor device and a method thereof are disclosed. Each heat unit of heating groups has different height and caloric value at right angles according to the divided areas, thereby it can control an uniform temperature incline of the entire process space of the reaction chamber. Also, the reflecting plates are formed by each heating unit, so that the change of the heating unit can be simple. Furthermore, the divided reflecting blocks are adjacently connected to another reflecting block through the radiant wave shielding slit between them, so that the leakage of the radiant wave can be prevented and the reflecting blocks can be separately attached and deattached to each other. Also, the turning member is formed at the lower portion of the reflecting blocks, so that it can be easily attached and deattached.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: April 28, 2009
    Assignee: Terasemicon Co., Ltd
    Inventors: Taek Yong Jang, Byoung Il Lee, Young Ho Lee
  • Publication number: 20090096071
    Abstract: A semiconductor package may include a semiconductor chip, a molding layer which molds the semiconductor chip, and an interconnection which extends crossing an interface between the semiconductor chip and the molding layer and connects the semiconductor chip to an outside, wherein a shape of the interconnection is changed along the extended length thereof. According to the present invention, even if a mechanical stress or a thermal stress is applied to an interconnection, a crack does not occur in the interconnection or the interconnection is not disconnected. Therefore, a reliability of the semiconductor package is improved.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 16, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Pyoung-Wan KIM, Eun-Chul AHN, Teak-Hoon LEE, Chul-Yong JANG
  • Publication number: 20090072144
    Abstract: Exemplary embodiments provide an infrared (IR) retinal system and method for making and using the IR retinal system. The IR retinal system can include adaptive sensor elements, whose properties including, e.g., spectral response, signal-to-noise ratio, polarization, or amplitude can be tailored at pixel level by changing the applied bias voltage across the detector. “Color” imagery can be obtained from the IR retinal system by using a single focal plane array. The IR sensor elements can be spectrally, spatially and temporally adaptive using quantum-confined transitions in nanoscale quantum dots. The IR sensor elements can be used as building blocks of an infrared retina, similar to cones of human retina, and can be designed to work in the long-wave infrared portion of the electromagnetic spectrum ranging from about 8 ?m to about 12 ?m as well as the mid-wave portion ranging from about 3 ?m to about 5 ?m.
    Type: Application
    Filed: August 1, 2008
    Publication date: March 19, 2009
    Inventors: Sanjay Krishna, Majeed M. Hayat, J. Scott Tyo, Woo-Yong Jang
  • Publication number: 20090065919
    Abstract: In one embodiment, a semiconductor package disclosed herein can be generally characterized as including a resin substrate having a first recess, a first interconnection disposed on a surface of the first recess, a first semiconductor chip disposed in the first recess, and an underfill resin layer substantially filling the first recess and covering a side surface of the first semiconductor chip. The first semiconductor chip is electrically connected to the first interconnection.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 12, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chul-Yong Jang, Eun-Chul Ahn, Pyoung-Wan Kim, Teak-Hoon Lee
  • Publication number: 20090058250
    Abstract: A filter for a display apparatus is placed in front of a display panel, wherein CIE chromaticity coordinates of the filter under a standard of a D65 light source have values of ?2.0?a*?2.0 and ?2.0?b*?2.0. The CIE chromaticity coordinates of the filter under the standard of the D65 light source have a value of 60?L*?80. The colorants include a first colorant absorbing 380 nm to 480 nm wavelength light, a second colorant absorbing 450 nm to 550 nm wavelength light, and a third colorant absorbing 560 nm to 620 nm wavelength light. The first to third colorants can be contained in at least one of a color compensating layer, a low-refraction layer having a refractive index of 1.5 or less, an external light shielding layer, a hard coating layer and an adhesive layer.
    Type: Application
    Filed: August 28, 2008
    Publication date: March 5, 2009
    Applicant: Samsung Corning Precision Glass Co., Ltd.
    Inventors: Dong-Keun Sin, Ji-Yoon Seo, Sung-Nim Jo, Ji-Young Kim, Mi-Young Lim, Kyeong-Keun Woo, Dae-Chul Park, Sang-Yoon Oh, Kun-Yong Jang, Hwa-Yeon Lee, Moon-Jin Choi, Shin-Wook Kim, Seok-Won Kim, Dong-Hwal Lee
  • Publication number: 20090047154
    Abstract: The present invention discloses a linear compressor which can rapidly overcome load and improve compression efficiency, by synchronizing an operation frequency of a linear motor with a natural frequency of a movable member varied by the load and varying a stroke of the movable member according to the load. The linear compressor includes a fixed member having a compression space inside, a movable member linearly reciprocated in the fixed member in the axial direction, for compressing refrigerants sucked into the compression space, one or more springs installed to elastically support the movable member in the motion direction of the movable member, spring constants of which being varied by load, and a linear motor installed to be connected to the movable member, for linearly reciprocating the movable member in the axial direction, and varying a stroke of the movable member according to a predetermined refrigeration force, so that the movable member can be linearly reciprocated to reach a top dead center.
    Type: Application
    Filed: August 30, 2004
    Publication date: February 19, 2009
    Applicant: LG Electronics, Inc.
    Inventors: Bong-Jun Choi, Chang-Yong Jang, Man-Seok Cho, Shin-Hyun Park, Hyun Kim, Jong-Min Shin, Young-Hoan Jeon, Chul-Gi Roh
  • Publication number: 20090045513
    Abstract: A semiconductor chip package including a semiconductor chip including a first surface having bonding pads, a second surface facing the first surface, and sidewalls; a molding extension part surrounding the second surface and the sidewalls of the semiconductor chip; redistribution patterns extending from the bonding pads over the molding extension part, and electrically connected to the bonding pads; bump solder balls on the redistribution patterns; and a molding layer configured to cover the first surface of the semiconductor chip and the molding extension part, while exposing portions of each of the bump solder balls. The molding layer has concave meniscus surfaces between the bump solder balls adjacent to each other.
    Type: Application
    Filed: August 18, 2008
    Publication date: February 19, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pyoung-Wan KIM, Eun-Chul AHN, Jong-Ho LEE, Teak-Hoon LEE, Chul-Yong JANG
  • Publication number: 20090039491
    Abstract: In one embodiment, a semiconductor package includes a first insulating body and a first semiconductor chip having a first active surface and a first back surface opposite the first active surface. The first semiconductor chip is disposed within the first insulating body. The first active surface is exposed by the first insulating body. The first back surface is substantially surrounded by the first insulating body. The semiconductor package includes a post within the first insulating body and adjacent to a side of the first semiconductor chip.
    Type: Application
    Filed: April 16, 2008
    Publication date: February 12, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pyoung-Wan KIM, Teak-Hoon LEE, Chul-Yong JANG
  • Publication number: 20090027894
    Abstract: A backlight assembly includes a bottom chassis, a flat fluorescent lamp, a frame and a reflecting member. The flat fluorescent lamp is supported in the bottom chassis, and the flat fluorescent lamp includes a plurality of discharge spaces to generate light. The frame is combined with the bottom chassis to hold the flat fluorescent lamp. The reflecting member in one embodiment is coupled to the frame to cover an edge portion of the flat fluorescent lamp. In another embodiment, the reflecting member is integral with the frame.
    Type: Application
    Filed: October 1, 2008
    Publication date: January 29, 2009
    Inventors: Hyeon-Yong Jang, Nam-Ok Kwon
  • Publication number: 20080290514
    Abstract: In a semiconductor device, a package including the semiconductor device and a method of forming the same, the semiconductor device package includes a semiconductor device, a wiring board, and an underfill material layer. The semiconductor device includes a semiconductor chip, a metal layer, and solder balls for bump contacts. The semiconductor chip includes an active surface having bonding pads and a rear surface opposite the active surface and having concave portions corresponding to the bonding pads. The metal layer fills the concave portions and covers the rear surface. The solder balls for bump contacts are provided on the bonding pads. The wiring board includes an upper surface to which the semiconductor device is mounted and a lower surface opposite the upper surface. The underfill material layer fills a space between the active surface of the semiconductor device and the upper surface of the wiring board.
    Type: Application
    Filed: May 20, 2008
    Publication date: November 27, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young-Lyong Kim, Jong-Ho Lee, Chul-Yong Jang
  • Patent number: 7448771
    Abstract: A backlight assembly includes a bottom chassis, a flat fluorescent lamp, a frame and a reflecting member. The flat fluorescent lamp is supported in the bottom chassis, and the flat fluorescent lamp includes a plurality of discharge spaces to generate light. The frame is combined with the bottom chassis to hold the flat fluorescent lamp. The reflecting member in one embodiment is coupled to the frame to cover an edge portion of the flat fluorescent lamp. In another embodiment, the reflecting member is integral with the frame.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: November 11, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeon-Yong Jang, Nam-Ok Kwon
  • Patent number: 7446489
    Abstract: An apparatus of driving a light source for a display device is provided. The apparatus includes a temperature sensor (940) sensing a temperature and generating an output voltage based on the sensed temperature, a buffer (950) generating an output signal having a state depending on the output voltage of the temperature sensor (940), an oscillator (931) generating an oscillating signal having a frequency depending on the state of the output signal of the buffer, and an inverter (920) performing a switching operation in response to the oscillating signal from the oscillator (931). Therefore, the inverter (920) increases the voltage applied to the light source when the temperature near the light source is lower than a predetermined temperature since the frequency of the oscillating signal is increased.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: November 4, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hyeon-Yong Jang
  • Publication number: 20080261659
    Abstract: A mobile communication terminal including a first body, a second body slidably connected to the first body and moveable between a first position and a second position, and a slide module connecting the first body to the second body. The slide module is configured to guide the second body along a curved path between the first position and the second position such that the second body moves in both a lateral and longitudinal direction with respect to the first body.
    Type: Application
    Filed: October 24, 2007
    Publication date: October 23, 2008
    Inventors: Chang-Yong JANG, Yong-Hee LEE, Min-Soo Kim
  • Patent number: 7439116
    Abstract: Apparatus and method for forming a polycrystalline silicon thin film by converting an amorphous silicon thin film into the polycrystalline silicon thin film using a metal are provided. The method includes: a metal nucleus adsorbing step of introducing a vapor phase metal compound into a process space where the glass substrate having the amorphous silicon formed thereon is disposed, to adsorb a metal nucleus contained in the metal compound into the amorphous silicon layer; a metal nucleus distribution region-forming step of forming a community region including a plurality of silicon particles every metal nucleus in a plane boundary region occupied by the metal compound by a self-limited mechanism due to the adsorption of the metal nucleus; and an excess gas removing step of purging and removing an excess gas which is not adsorbed in the metal nucleus distribution region-forming step.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: October 21, 2008
    Inventors: Taek Yong Jang, Byoung Il Lee, Young Ho Lee
  • Publication number: 20080242359
    Abstract: A mobile terminal including a first body having a first surface and a second surface and a second body having a first surface and a second surface. In addition, the first body includes a first display located at the first surface and configured to display at least one icon, the at least one icon being selectable by touching the first display where the icon is displayed, a second display located at the second surface and configured to display information, and a receiver located in the first body and configured to transmit sound through the first surface. The second body includes an input device located at the first surface thereof to input information and is rotatably connected to the first body such that the first body can be rotated from a first state to a second state.
    Type: Application
    Filed: October 25, 2007
    Publication date: October 2, 2008
    Inventors: Won-Seok Seol, Min-Soo Kim, Byoung-Wook Kim, Chang-Yong Jang, Ho-Myoung Shin
  • Publication number: 20080213108
    Abstract: The present invention discloses a linear compressor in which a piston is driven by a linear motor and linearly reciprocated inside a cylinder to suck, compress and discharge refrigerants. The linear compressor synchronizes an operation frequency of the linear motor with a natural frequency of the piston, considering that an elastic force of a mechanical spring and a gas spring which elastically support the piston in the motion direction is varied by load. Even if the load is varied, the linear motor is operated in the resonance state, to maximize efficiency. The linear compressor varies a stroke of the piston according to the load, thereby actively handling and rapidly overcoming the load and reducing power consumption.
    Type: Application
    Filed: August 30, 2004
    Publication date: September 4, 2008
    Applicant: LG Electronics, Inc.
    Inventors: Bong-Jun Choi, Chang-Yong Jang, Man-Seok Cho, Shin-Hyun Park, Hyun Kim, Jong-Min Shin, Young-Hoan Jeon, Chul-Gi Roh
  • Publication number: 20080211834
    Abstract: A device for driving a light source in an image display device includes input terminals to receive a horizontal synchronization signal and a control signal, an oscillator to generate a reference signal having a frequency, a controller to modulate the reference signal in response to the control signal and output a modulated signal, and a phase difference detecting unit to receive the horizontal synchronization signal and the modulated signal and detect a phase difference between the horizontal synchronization signal and the modulated signal to generate an output signal indicating the phase difference. The oscillator adjusts the frequency of the reference signal in response to the output signal of the phase difference detecting unit so that the horizontal synchronization signal and the reference signal are synchronized with each other.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 4, 2008
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventor: Hyeon-Yong JANG
  • Patent number: 7419381
    Abstract: A hybrid circuit board includes a first circuit board and a second circuit boards. The first circuit board includes a first body having a slot, and a first circuit pattern formed on the first body and extended to the slot. The second circuit board includes a second body, a protruding portion, a second circuit pattern, and a separating member. The protruding portion extends from the second body. The protruding portion is inserted into the slot of the first circuit board to combine the second circuit board to the first circuit board. The second circuit pattern is formed on the second body to be extended to the protruding portion, so that the second circuit pattern is electrically connected to the first circuit pattern of the first circuit board. The separating member is disposed between the second body and the protruding portion to separate the protruding portion from the second body.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: September 2, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeon-Yong Jang, Cheol-Jin Park
  • Publication number: 20080204397
    Abstract: A backlight device for a liquid crystal display (LCD) panel displaying an image is disclosed. The backlight device includes a plurality of light source groups and a light source driving section. The light source groups include a predetermined number of light sources providing the LCD panel with light. The light source driving section sequentially and repeatedly provides power to the light source groups during a unit frame interval.
    Type: Application
    Filed: January 25, 2008
    Publication date: August 28, 2008
    Inventors: Hyeon-Yong JANG, Seong-Sik CHOI