Abstract: A super-regenerative receiver (SRR) includes a super-regenerative oscillator (SRO), and an active channel filter disposed at a front end of the SRO, and configured to filter out an interferer in a signal received by the SRR.

Abstract: Disclosed is a touch motion switch, more particularly a touch motion switch which generates vibrations such that a user feels vibrations when touching a switch. The touch motion switch includes: a case having a first guide therein; a vibration unit coupled to the case to be movable vertically and having a second guide movable vertically along the first guide; a resilient member mounted to the case to support the vibration unit and resiliently deformed when the vibration unit is moved vertically; a magnetic force unit inserted into the case; and a coil unit mounted to the second guide, for providing a driving force such that the vibration unit is vertically moved to vibrate by an electromagnetic interaction with the magnetic force unit.

Abstract: A lifting shackle of a head assembly for a nuclear reactor according to one embodiment of the present invention comprises: a first member and a second member which extend in parallel to each other in a predetermined thickness and length and respectively have an upper portion and a lower portion; a first connection member which connects the upper portion of the first member and the upper portion of the second member to each other and is coupled to a hook; coupling sections which are respectively provided at the lower portions of the first member and the second members and has a hollow portion so as to be coupled to the head assembly for a nuclear reactor via pins; and stress reducing sections which are formed at the upper portions of the first member and the second member such that the stress reducing sections extend from the first connection member to the first member and the side end of the second member at a predetermined curvature and protrudes upwards so as to reduce bending stress that is applied to the

Abstract: An earthquake-resistant reinforcement assembly according to one embodiment of the present invention comprises: a rod of which one end is hinge-coupled to an upper structure; a combination pin which is formed at the other end of the rod and is extended to diametrically cross the rod; and a bracket which is provided on a partition wall of a nuclear reactor containment building and is coupled with the other end, wherein the bracket can withstand a tensile load and a torsional load by including first and second members which face each other and are extended in parallel to load the rod thereon, and groove portions which are formed at the first and second members to be coupled with the combination pin to form the shape of a double bracket.

Abstract: A sliding-type portable terminal is provided. The portable terminal includes a first housing, a first guide member fixed to the first housing, a slide member coupled to the first guide member while facing the first guide member, the slide member being adapted to slide in a first direction under guidance of the first guide member, a second guide member fixed to the slide member, a second housing having a guide recess extending in a second direction so as to receive the second guide member, the second housing being coupled to the second guide member so as to slide in the second direction under guidance of the second guide member and an elastic member having a first end supported on the first guide member and a second end supported on the second housing so as to provide elastic force in such a direction that the first and second ends move away from each other. The sliding-type portable terminal is adapted for convenient use of not only mobile communication services, but also multimedia services.

Abstract: A resonant structure is provided, including a first terminal, a second terminal which faces the first terminal, a wire unit which connects the first terminal and the second terminal, a third terminal which is spaced apart at a certain distance from the wire unit and which resonates the wire unit, and a potential barrier unit which is formed on the wire unit and which provides a negative resistance component. Accordingly, transduction efficiency can be enhanced.

Abstract: A reliable gap-filling process is performed in the manufacturing of a semiconductor device. An apparatus for performing the gap-filling process includes a chamber in which a wafer chuck is disposed, a plasma generator for generating plasma used to etch the wafer, an end-point detection unit for detecting the point at which the etching of the wafer is to be terminated, and a controller connected to the end-point detection unit. The end-point detection unit monitors the structure being etched at a region outside the opening that is to be filled, and generates in real time data representative of the layer that is being etched. As soon as an underlying layer is exposed and begins to be etched, an end-point detection signal is generated and the etching process is terminated. In the case in which the layer being etched is an oxide layer, a uniform etching is achieved despite any irregularity that exists in the thickness to which the oxide layer is formed.

Abstract: The present invention provides a power voltage supplier for stably supplying a noise-free power voltage without increasing a size of a reservoir capacitor by employing a sharing scheme of the reservoir capacitor. The power voltage supplier of a semiconductor memory device includes: a first power voltage supply line for supplying a first power voltage; a second power voltage supply line for supplying a second power voltage; a first reservoir capacitor for supplying the first and the second power voltages stably; and a reservoir capacitor controller for selectively connecting the first reservoir capacitor to the first power voltage supply line or the second power voltage supply line.

Abstract: A portable terminal includes a first housing, a second housing, and a sliding module. The second housing is slidably connected to the first housing such that the second housing slides longitudinally on the first housing to open or close a face of the first housing. The sliding module is interposed between the first housing and the second housing to slidably combine the second housing to the first housing. The sliding module includes a pair of guide rods and a guide plate. The guide rods are mounted spaced apart on the rear face of the second housing along a sliding direction of the second housing. The guide plate is fixed to a face of the first housing. The guide plate is slidably connected to the guide rods.

Abstract: A resonant structure is provided, including a first terminal, a second terminal which faces the first terminal, a wire unit which connects the first terminal and the second terminal, a third terminal which is spaced apart at a certain distance from the wire unit and which resonates the wire unit, and a potential barrier unit which is formed on the wire unit and which provides a negative resistance component. Accordingly, transduction efficiency can be enhanced.

Abstract: A reliable gap-filling process is performed in the manufacturing of a semiconductor device. An apparatus for performing the gap-filling process includes a chamber in which a wafer chuck is disposed, a plasma generator for generating plasma used to etch the wafer, an end-point detection unit for detecting the point at which the etching of the wafer is to be terminated, and a controller connected to the end-point detection unit. The end-point detection unit monitors the structure being etched at a region outside the opening that is to be filled, and generates in real time data representative of the layer that is being etched. As soon as an underlying layer is exposed and begins to be etched, an end-point detection signal is generated and the etching process is terminated. In the case in which the layer being etched is an oxide layer, a uniform etching is achieved despite any irregularity that exists in the thickness to which the oxide layer is formed.

Abstract: A reliable gap-filling process is performed in the manufacturing of a semiconductor device. An apparatus for performing the gap-filling process includes a chamber in which a wafer chuck is disposed, a plasma generator for generating plasma used to etch the wafer, an end-point detection unit for detecting the point at which the etching of the wafer is to be terminated, and a controller connected to the end-point detection unit. The end-point detection unit monitors the structure being etched at a region outside the opening that is to be filled, and generates in real time data representative of the layer that is being etched. As soon as an underlying layer is exposed and begins to be etched, an end-point detection signal is generated and the etching process is terminated. In the case in which the layer being etched is an oxide layer, a uniform etching is achieved despite any irregularity that exists in the thickness to which the oxide layer is formed.

Abstract: A sliding-type portable terminal is provided. The portable terminal includes a first housing, a first guide member fixed to the first housing, a slide member coupled to the first guide member while facing the first guide member, the slide member being adapted to slide in a first direction under guidance of the first guide member, a second guide member fixed to the slide member, a second housing having a guide recess extending in a second direction so as to receive the second guide member, the second housing being coupled to the second guide member so as to slide in the second direction under guidance of the second guide member and an elastic member having a first end supported on the first guide member and a second end supported on the second housing so as to provide elastic force in such a direction that the first and second ends move away from each other. The sliding-type portable terminal is adapted for convenient use of not only mobile communication services, but also multimedia services.

Abstract: The present invention provides a power voltage supplier for stably supplying a noise-free power voltage without increasing a size of a reservoir capacitor by employing a sharing scheme of the reservoir capacitor. The power voltage supplier of a semiconductor memory device includes: a first power voltage supply line for supplying a first power voltage; a second power voltage supply line for supplying a second power voltage; a first reservoir capacitor for supplying the first and the second power voltages stably; and a reservoir capacitor controller for selectively connecting the first reservoir capacitor to the first power voltage supply line or the second power voltage supply line.

Abstract: The present invention provides a power voltage supplier for stably supplying a noise-free power voltage without increasing a size of a reservoir capacitor by employing a sharing scheme of the reservoir capacitor. The power voltage supplier of a semiconductor memory device includes: a first power voltage supply line for supplying a first power voltage; a second power voltage supply line for supplying a second power voltage; a first reservoir capacitor for supplying the first and the second power voltages stably; and a reservoir capacitor controller for selectively connecting the first reservoir capacitor to the first power voltage supply line or the second power voltage supply line.

Abstract: Provided is an internal voltage generator for preventing an occurrence of leakage current while a charge pumping is not performed. The internal voltage generator includes: a charge pumping unit for pumping an external voltage to generate a high voltage higher than the external voltage; a level detecting unit for detecting a level drop of the high voltage with respect to a reference voltage and outputting a detection signal; an oscillating unit for generating an oscillation signal in response to the detection signal; a pumping control signal generating unit for controlling a driving of the charge pumping unit in response to the oscillation signal; and a charge pump controlling unit for precharging the charge pumping unit in response to the detection signal.

Abstract: The present invention is related to a negative voltage generating circuit for reliably providing the semiconductor integrated circuit (IC) with a negative voltage. An electric charge pumping device generates a negative voltage by pumping an electric charge to a predetermined level supplied to one of a first node and a second node. A controlling device provides first and second pumping clock signal being clocked alternately every predetermined interval in response to a level of the negative voltage. A pumping controller controls an amount of electric charge supplied to the first node and the second node in response to the first and second pumping clock signals. Further, a reset controller resets the first node and the second node of the electric charge pumping means as the level of the negative voltage when the first and second pumping clock signals are inactivated.

Abstract: A semiconductor memory device including a fuse control circuit for providing with a plurality of fail word line addresses written in its own circuit in advance and outputting a redundancy signal representing that an input address is the same as one of the fail word line addresses, and a normal word line interruption signal, a redundancy word line controller for inputting the redundancy signal and activating a designated redundancy word line; and a normal word line controller, for activating a word line corresponding to the input word line address, which is operated or interrupted in response to the normal word line interruption signal, wherein the normal word line interruption signal has a first logic state (logic low) at a pre-charge interval or when a same address as one of the fail word line addresses is inputted, and has a second logic state (logic high) when a normal address is inputted, and the redundancy signal has a first logic state (logic low) when a same address as one of the fail word line address

Abstract: An RF system integrated with an RF switching unit and an RF modulator unit.

Abstract: A reliable gap-filling process is performed in the manufacturing of a semiconductor device. An apparatus for performing the gap-filling process includes a chamber in which a wafer chuck is disposed, a plasma generator for generating plasma used to etch the wafer, an end-point detection unit for detecting the point at which the etching of the wafer is to be terminated, and a controller connected to the end-point detection unit. The end-point detection unit monitors the structure being etched at a region outside the opening that is to be filled, and generates in real time data representative of the layer that is being etched. As soon as an underlying layer is exposed and begins to be etched, an end-point detection signal is generated and the etching process is terminated. In the case in which the layer being etched is an oxide layer, a uniform etching is achieved despite any irregularity that exists in the thickness to which the oxide layer is formed.