Abstract: A device comprises a substrate) of a first material with a surface, which is modified by depositing a bi-layer nanoparticle film. The film includes a nanoparticle layer of a second material on top of and in contact with surface, and a nanoparticle layer of a third material on top of and in contact with the nanoparticle layer of the second material. The nanoparticles of the third material adhere to the nanoparticles of the second material. The substrate region adjoining surface comprises an admixture of the second material in the first material. A fourth material contacts and chemically/mechanically bonds to the nanoparticle layer of the third material.

Abstract: Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices.

Abstract: A method for caching images in a virtual environment uses hash tables to store information about an application or window and to store updated images. Suitable areas of applications or windows are fixed relative to the window for many cases, and also include a relatively small number of possible display statuses. Hash tables are used on an agent side and a client side to track previous image updates. When an updated image is determined to be already stored in a cache, the agent side can transmit a hash identifying the image to the client side, and the client side can update the display with the cached image.

Abstract: The disclosure describes multi-junction solar cell structures that include two or more graded interlayers.

Abstract: In an embodiment, a substrate made of a first material and having a surface is provided. A first and second nozzle dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles respectively while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer comprising sequential and contiguous zones alternating between the first solvent paste and the second solvent paste. Energy is applied to the nanoparticles to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.

Abstract: A Lin-Xie brake used by a mine hoist, a car, a high-speed train, etc. Gas springs are used to replace belleville springs, and a positive pressure is also always applied to brake pads to both ensure and increase the brake reliability and a positive pressure per unit area. And the Lin-Xie brake resolves problems such as deformation of the belleville springs, a serious change in an elastic force, sudden cracking and decompression, inconvenient monitoring, and a manufacturing difficulty. For the Lin-Xie brake, a brake head floating structure is used to reduce a requirement on end face runout of a brake disc. An oil-gas linkage plunger pump is used to replace a hydraulic station, which greatly reduces manufacturing costs, and reduces energy consumption. The Lin-Xie brake is an ideal product to replace medium or large-sized Lin-Xie brakes used by existing mine hoists, cars, high-speed trains, etc.

Abstract: Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices.

Abstract: A wireless communication system includes a number of peripheral devices, a wireless communication device, and a terminal. The wireless communication device includes a first communication module and a second communication module. The second communication module includes a host unit and a device unit. The host unit is used to be wirelessly connected to the peripheral devices. The terminal supports the first communication protocol is used to connect to the first communication module, and the terminal supports the second communication protocol is used to connect to the second communication module via the device unit thereof. A method using the wireless communication system is also provided.

Abstract: A device comprises a substrate and an adhesive nanoparticle layer patterned into zones of electrical conductance and insulation on top of the substrate surface. A diffusion region adjoining the surface comprises an admixture of the nanoparticles in the substrate material. When the nanoparticle layer is patterned from originally all-conductive nanoparticles, the insulating zones are created by selective oxidation; when the nanoparticle layer is patterned from originally all-non-conductive nanoparticles, the conductive zones are created by depositing selectively a volatile reducing agent. A package of insulating material is in touch with the nanoparticle layer and fills any voids in the nanoparticle layer.

Abstract: The present invention relates to matriptase antibodies and immunoconjugates of matriptase antibodies with cytotoxic agents and the use thereof for killing or inhibiting the growth of matriptase-expressing cancer cells, such as those of multiple myeloma and breast cancers. In particular, immunoconjugates comprising a matriptase monoclonal antibody and anticancer agents such as auristatin, including monomethyl auristatin E(MMAE) and monomethyl auristatin F(MMAF) are introduced, which have potent antitumor activity in vivo. Moreover, importantly; there was no weight loss or other evidence of toxicity in the animals, indicating that no significant free drug was released into the circulation from the conjugate. The present invention also provides compositions comprising these new immunoconjugates and use of them for treatment of malignancies comprising cells that express matriptase.

Abstract: A packaged IC wherein a portion of the sidewalls of the packaged IC are solderable metal. A method of forming a packaged IC wherein a portion of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal. A method of forming a packaged IC wherein all of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal and a portion of sidewall of the molding compound is solderable metal.

Abstract: A fabric includes a base, a pattern layer provided on the base, a spacer layer provided on the pattern layer, and a mesh fabric layer laid over the spacer layer. The pattern layer forms a moire pattern using at least one first pattern unit and at least one second pattern unit. When the fabric is observed through the mesh fabric layer in a first viewing direction toward the base, the at least one first pattern unit is visible because the mesh fabric layer covers the at least one second pattern unit. When the fabric is observed through the mesh fabric layer in a second viewing direction toward the base, the at least one second pattern unit is visible because the at least one first pattern unit is covered instead.

Abstract: Aspects disclosed in the detailed description include an ingestible power harvesting device and related applications. An ingestible power harvesting device includes a cathode electrode and an anode electrode that can catalyze a power generating reaction to generate a direct current (DC) power when surrounded by an acidic electrolyte. The cathode electrode and the anode electrode are coupled to an encapsulated electronic device that includes power harvesting circuitry configured to harvest the DC power and output a DC supply voltage for a prolonged period. In examples discussed herein, the prolonged period is at least five days. The DC supply voltage powers an electronic circuit in the encapsulated electronic device to support a defined in vivo operation (e.g., controlled drug delivery, in vivo vital signs monitoring, etc.). As such, the ingestible power harvesting device can operate in vivo for the prolonged period without requiring an embedded conventional battery.

Abstract: An integrated circuit (IC) includes a lead frame that has a set of leads coupled to a corresponding set of pins. A semiconductor die with contacts is coupled to the set of leads. Encapsulating material encloses the semiconductor die, such that the set of pins extend beyond the encapsulating material. An additive coating covers one or more of the plurality of pins.

Abstract: A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

Abstract: A packaged IC wherein a portion of the sidewalls of the packaged IC are solderable metal. A method of forming a packaged IC wherein a portion of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal. A method of forming a packaged IC wherein all of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal and a portion of sidewall of the molding compound is solderable metal.

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

Abstract: A method of forming a multijunction solar cell comprising at least an upper subcell, a middle subcell, and a lower subcell, the method including forming a first alpha layer over said middle solar subcell using a surfactant and dopant including selenium, the first alpha layer configured to prevent threading dislocations from propagating; forming a metamorphic grading interlayer over and directly adjacent to said first alpha layer; forming a second alpha layer using a surfactant and dopant including selenium over and directly adjacent to said grading interlayer to prevent threading dislocations from propagating; and forming a lower solar subcell over said grading interlayer such that said lower solar subcell is lattice mismatched with respect to said middle solar subcell.

Abstract: A method for caching images in a virtual environment uses hash tables to store information about an application or window and to store updated images. Suitable areas of applications or windows are fixed relative to the window for many cases, and also include a relatively small number of possible display statuses. Hash tables are used on an agent side and a client side to track previous image updates. When an updated image is determined to be already stored in a cache, the agent side can transmit a hash identifying the image to the client side, and the client side can update the display with the cached image.