Patents by Inventor Yong Mo

Yong Mo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12199094
    Abstract: Fin field effect transistors (FinFETs) having various different thicknesses of gate oxides and related apparatuses, methods, and computing systems are disclosed. An apparatus includes first FinFETs, second FinFETs, and third FinFETs. The first FinFETs include a first gate oxide material, a second gate oxide material, and a third gate oxide material. The second FinFETs include the second gate oxide material and the third gate oxide material. The third FinFETs include the third gate oxide material. A method includes forming the first gate oxide material on first fins, second fins, and third fins; removing the first gate oxide material from the second fins and the third fins; forming a second gate oxide material over the first fins, the second fins, and the third fins; and removing the second gate oxide material from the third fins.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: January 14, 2025
    Assignee: Micron Technology, Inc.
    Inventors: Hyuck Soo Yang, Byung Yoon Kim, Yong Mo Yang, Shivani Srivastava
  • Publication number: 20240055715
    Abstract: A power tool includes a housing that defines a battery pack attachment portion, which has a first cavity and a flange. A printed circuit board and a motor are positioned within the housing. The motor is electrically communicates with the printed circuit board. A battery pack receptacle is positioned within the first cavity, is movably coupled to the battery pack attachment portion. The battery pack receptacle includes a groove in which the flange of the battery pack attachment portion is received and a second cavity configured to receive at least a portion of a battery pack. One of a spring or a resilient body is positioned between the battery pack attachment portion and the battery pack receptacle and is configured to bias the battery pack attachment relative to the battery pack receptacle. Power tool terminals are supported by the battery pack receptacle and electrically communicate with the printed circuit board.
    Type: Application
    Filed: August 11, 2022
    Publication date: February 15, 2024
    Inventors: Evan Varner, Curt Austin Laugh, De Yong Mo
  • Patent number: 11868743
    Abstract: A method for supporting block coding is provided. The method includes the steps of: determining an arrangement position of a coding block selected by a user on the basis of a sentence component-specific arrangement order specified from a sentence structure of a spoken language; and providing the user with an arrangement result of the coding block specified on the basis of the arrangement position.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: January 9, 2024
    Assignee: REDBRICK INC.
    Inventors: Yong Mo Liang, Kwang Yong Lee, Sung Ho Yong
  • Publication number: 20230141716
    Abstract: Fin field effect transistors (FinFETs) having various different thicknesses of gate oxides and related apparatuses, methods, and computing systems are disclosed. An apparatus includes first FinFETs, second FinFETs, and third FinFETs. The first FinFETs include a first gate oxide material, a second gate oxide material, and a third gate oxide material. The second FinFETs include the second gate oxide material and the third gate oxide material. The third FinFETs include the third gate oxide material. A method includes forming the first gate oxide material on first fins, second fins, and third fins; removing the first gate oxide material from the second fins and the third fins; forming a second gate oxide material over the first fins, the second fins, and the third fins; and removing the second gate oxide material from the third fins.
    Type: Application
    Filed: November 5, 2021
    Publication date: May 11, 2023
    Inventors: Hyuck Soo Yang, Byung Yoon Kim, Yong Mo Yang, Shivani Srivastava
  • Publication number: 20230111959
    Abstract: A method for supporting block coding is provided. The method includes the steps of: determining an arrangement position of a coding block selected by a user on the basis of a sentence component-specific arrangement order specified from a sentence structure of a spoken language; and providing the user with an arrangement result of the coding block specified on the basis of the arrangement position.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 13, 2023
    Applicant: REDBRICK INC.
    Inventors: Yong Mo LIANG, Kwang Yong LEE, Sung Ho YONG
  • Patent number: 11594536
    Abstract: Some embodiments include an integrated assembly having a CMOS region with fins extending along a first direction, and with gating structures extending across the fins. A circuit arrangement is associated with the CMOS region and includes a pair of the gating structures spaced by an intervening region having a missing gating structure. The circuit arrangement has a first dimension along the first direction. A second region is proximate to the CMOS region. Conductive structures are associated with the second region. Some of the conductive structures are electrically coupled with the circuit arrangement. A second dimension is a distance across said some of the conductive structures along the first direction. The conductive structures and the circuit arrangement are aligned such that the second dimension is substantially the same as the first dimension. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: February 28, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yong Mo Yang, Mohd Kamran Akhtar, Huyong Lee, Sangmin Hwang, Song Guo
  • Patent number: 11522068
    Abstract: One illustrative IC product disclosed herein includes first and second final gate structures and an insulating gate separation structure positioned between the first and second final gate structures. In one embodiment, the insulating gate separation structure has a stepped bottom surface with a substantially horizontally oriented bottom central surface that is surrounded by a substantially horizontally oriented recessed surface, wherein the substantially horizontally oriented bottom central surface is positioned a first level above the substrate and the substantially horizontally oriented recessed surface is positioned at a second level above the substrate, wherein the second level is greater than the first level.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: December 6, 2022
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Jiehui Shu, Chang Seo Park, Shimpei Yamaguchi, Tao Han, Yong Mo Yang, Jinping Liu, Hyuck Soo Yang
  • Publication number: 20220293598
    Abstract: Some embodiments include an integrated assembly having a CMOS region with fins extending along a first direction, and with gating structures extending across the fins. A circuit arrangement is associated with the CMOS region and includes a pair of the gating structures spaced by an intervening region having a missing gating structure. The circuit arrangement has a first dimension along the first direction. A second region is proximate to the CMOS region. Conductive structures are associated with the second region. Some of the conductive structures are electrically coupled with the circuit arrangement. A second dimension is a distance across said some of the conductive structures along the first direction. The conductive structures and the circuit arrangement are aligned such that the second dimension is substantially the same as the first dimension. Some embodiments include methods of forming integrated assemblies.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 15, 2022
    Applicant: Micron Technology, Inc.
    Inventors: Yong Mo Yang, Mohd Kamran Akhtar, Huyong Lee, Sangmin Hwang, Song Guo
  • Publication number: 20210377889
    Abstract: This application provides a communication method. The communication method includes: A first device sends indication information, where the indication information is used to indicate whether the first device sends a first synchronization signal block in a synchronization slot of a sidelink, and the synchronization slot is used to transmit a synchronization signal block; and the first device sends first data in the synchronization slot of the sidelink. Because the first device indicates a sending behavior of the first device in the synchronization slot before sending the first data, a receiver may determine a processing manner of the receiver in the synchronization slot based on the indication information.
    Type: Application
    Filed: August 13, 2021
    Publication date: December 2, 2021
    Inventors: Chao Li, Yong Mo, Xingwei Zhang, Jun Luo, Pu Yuan
  • Publication number: 20210327881
    Abstract: Some embodiments include an integrated assembly having capacitor-contact-regions. Metal-containing interconnects are coupled with the capacitor-contact-regions. A first insulative material is between the metal-containing interconnects. A second insulative material is over the first insulative material. A third insulative material is over the second insulative material. First capacitor electrodes extend through the second and third insulative materials and are coupled with the metal-containing interconnects. Fourth insulative material is adjacent the first capacitor electrodes. Capacitor plate electrodes are adjacent the fourth insulative material and are spaced from the first capacitor electrodes by the fourth insulative material. Some embodiments include methods of forming integrated assemblies.
    Type: Application
    Filed: April 17, 2020
    Publication date: October 21, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Sanh D. Tang, Ke-Hung Chen, Christopher W. Petz, Pankaj Sharma, Yong Mo Yang
  • Patent number: 10832966
    Abstract: Structures and fabrication methods for a field-effect transistor. First and second spacers are formed adjacent to opposite sidewalls of a gate structure. A section of the gate structure is partially removed with a first etching process to form a cut that extends partially through the gate structure. After partially removing the section of the gate structure with the first etching process, upper sections of the first and second sidewall spacers arranged above the gate structure inside the cut are at least partially removed. After at least partially removing the upper sections of the first and second sidewall spacers, the section of the gate structure is completely removed from the cut with a second etching process. A dielectric material is deposited inside the cut to form a dielectric pillar.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: November 10, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Chang Seo Park, Haiting Wang, Shimpei Yamaguchi, Junsic Hong, Yong Mo Yang, Scott Beasor
  • Patent number: 10808952
    Abstract: Disclosed is a humidifier and home appliance having a structure with an air inflow path formed in a water tank separately from a water supply inlet and configured to prevent noise due to air bubbles during water supply to a water reservoir from the water tank, and a structure configured to block the air inflow path in order to prevent water from flowing into the air inflow path during replenishment of water to the water tank.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: October 20, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mun Sub Kim, Hyeong Joon Seo, Hoon Yeong Koh, Ju Hwan Kim, Jin Yong Mo
  • Patent number: 10801741
    Abstract: In an air-conditioning system, a gaseous refrigerant remaining in a reservoir can be discharged from the reservoir even when a cooling operation has started and the reservoir is being filled with a liquid refrigerant. Therefore, the reservoir can be filled with the liquid refrigerant at a faster speed.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae Il Kim, Mun Sub Kim, Tae Woo Kang, Hyeon U Park, Wang Byung Chae, Kyung Hoon Kim, Sung Goo Kim, Hyeong Joon Seo, Hyun Wuk Kang, Jin Yong Mo, Il Yong Cho
  • Patent number: 10746456
    Abstract: Disclosed are provided indoor unit of an air conditioner. A present invention is to provide an indoor unit of an air conditioner having an improved structure for preventing vibrations and noise of a blade due to vibrations of a motor when the blade rotates, and a blade unit applied to the indoor unit. The indoor unit of the air conditioner includes a main body including an outlet, and a blade unit configured to adjust a direction in which air discharged from the outlet is discharged, wherein the blade unit comprises, a blade coupled with the main body to be rotatable in the outlet, a motor including a rotation transfer member, and configured to generate a rotatory force that is transferred to the blade; and a buffer member made of a material having a restoring force, coupled with the blade at one end, and surrounding a part of the rotation transfer member.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: August 18, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mun Sub Kim, Hyun Wuk Kang, You Jae Kim, Jin Yong Mo, Hyeong Joon Seo, Woong Sun, Jun Riul Song
  • Publication number: 20190383503
    Abstract: Disclosed is a humidifier and home appliance having a structure with an air inflow path formed in a water tank separately from a water supply inlet and configured to prevent noise due to air bubbles during water supply to a water reservoir from the water tank, and a structure configured to block the air inflow path in order to prevent water from flowing into the air inflow path during replenishment of water to the water tank.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventors: Mun Sub KIM, Hyeong Joon SEO, Hoon Yeong KOH, Ju Hwan KIM, Jin Yong MO
  • Publication number: 20190355832
    Abstract: One illustrative IC product disclosed herein includes first and second final gate structures and an insulating gate separation structure positioned between the first and second final gate structures. In one embodiment, the insulating gate separation structure has a stepped bottom surface with a substantially horizontally oriented bottom central surface that is surrounded by a substantially horizontally oriented recessed surface, wherein the substantially horizontally oriented bottom central surface is positioned a first level above the substrate and the substantially horizontally oriented recessed surface is positioned at a second level above the substrate, wherein the second level is greater than the first level.
    Type: Application
    Filed: July 26, 2019
    Publication date: November 21, 2019
    Inventors: Jiehui Shu, Chang Seo Park, Shimpei Yamaguchi, Tao Han, Yong Mo Yang, Jinping Liu, Hyuck Soo Yang
  • Patent number: 10453936
    Abstract: One illustrative method disclosed herein includes, among other things, forming a sacrificial gate structure above a semiconductor substrate, the sacrificial gate structure comprising a sacrificial gate insulation layer and a sacrificial gate electrode material, performing a first gate-cut etching process to thereby form an opening in the sacrificial gate electrode material and forming an internal sidewall spacer in the opening. In this example, the method also includes, after forming the internal sidewall spacer, performing a second gate-cut etching process through the opening, the second gate-cut etching process being adapted to remove the sacrificial gate electrode material, performing an oxidizing anneal process and forming an insulating material in at least the opening.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: October 22, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Jiehui Shu, Chang Seo Park, Shimpei Yamaguchi, Tao Han, Yong Mo Yang, Jinping Liu, Hyuck Soo Yang
  • Patent number: 10436466
    Abstract: Disclosed is a humidifier and home appliance having a structure with an air inflow path formed in a water tank separately from a water supply inlet and configured to prevent noise due to air bubbles during water supply to a water reservoir from the water tank, and a structure configured to block the air inflow path in order to prevent water from flowing into the air inflow path during replenishment of water to the water tank.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: October 8, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mun Sub Kim, Hyeong Joon Seo, Hoon Yeong Koh, Ju Hwan Kim, Jin Yong Mo
  • Patent number: RE48660
    Abstract: A pipe fixing device comprising a plurality of pipes, for conducting liquid or gas, arranged to cross each other, and a fixing member for fixing the plurality of pipes. The fixing member comprises a plurality of pipe fixing bores, and a plurality of fitting bores for the fitting of bands used to tighten the pipes. The present invention can secure not only easy insertion of the pipes arranged to cross each other, but also enhancement in a coupling force of the pipes through the use of the tightening bands, resulting in stable and reliable fixation of the pipes.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mun Sub Kim, Jai Kwon Lee, Jin Yong Mo, Deug Yong Park, Hyung Suk Han, Ju Hwan Kim
  • Patent number: RE50023
    Abstract: A pipe fixing device comprising a plurality of pipes, for conducting liquid or gas, arranged to cross each other, and a fixing member for fixing the plurality of pipes. The fixing member comprises a plurality of pipe fixing bores, and a plurality of fitting bores for the fitting of bands used to tighten the pipes. The present invention can secure not only easy insertion of the pipes arranged to cross each other, but also enhancement in a coupling force of the pipes through the use of the tightening bands, resulting in stable and reliable fixation of the pipes.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mun Sub Kim, Jai Kwon Lee, Jin Yong Mo, Deug Yong Park, Hyung Suk Han, Ju Hwan Kim