Patents by Inventor Yong Oh

Yong Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11005932
    Abstract: A method for interworking data between a plurality of blockchain networks according to an embodiment of the inventive concept includes performing a first phase of a transaction by dividing steps of the transaction for recording data and performing a second phase of the transaction according to a result of performing the first phase, wherein performing the first phase comprises performing a first step of a first transaction for recording the data in a first blockchain network of a plurality of blockchain networks and requesting to perform a first step of a second transaction for recording the data in a second blockchain network of the plurality of blockchain networks. It may be available to interwork data between a plurality of blockchain networks without passing through a separate hub network, and ensure the concurrency of interworked data recording.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 11, 2021
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Young Wn Kwun, Jung Woo Cho, Jun Tae Kim, Kwang Cheol Lee, Hwa Yong Oh, Chang Suk Yoon
  • Publication number: 20210120083
    Abstract: A method for interworking data between a plurality of blockchain networks according to an embodiment of the inventive concept includes performing a first phase of a transaction by dividing steps of the transaction for recording data and performing a second phase of the transaction according to a result of performing the first phase, wherein performing the first phase comprises performing a first step of a first transaction for recording the data in a first blockchain network of a plurality of blockchain networks and requesting to perform a first step of a second transaction for recording the data in a second blockchain network of the plurality of blockchain networks. It may be available to interwork data between a plurality of blockchain networks without passing through a separate hub network, and ensure the concurrency of interworked data recording.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 22, 2021
    Inventors: Young Wn KWUN, Jung Woo CHO, Jun Tae KIM, Kwang Cheol LEE, Hwa Yong OH, Chang Suk YOON
  • Patent number: 10984866
    Abstract: A non-volatile memory device includes a plurality of memory blocks grouped into pages, page buffer regions corresponding to the pages of the plurality of memory blocks; and a peripheral circuit region for supporting operations of the pages of the plurality of memory blocks. The peripheral circuit region comprises a plurality of pool capacitors. At least one of the memory blocks is a dummy block. The dummy block is configured to form a supplementary pool capacitor for suppressing power noise.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: April 20, 2021
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventor: Jin Yong Oh
  • Publication number: 20210065800
    Abstract: A non-volatile memory device includes a plurality of memory blocks grouped into pages, page buffer regions corresponding to the pages of the plurality of memory blocks; and a peripheral circuit region for supporting operations of the pages of the plurality of memory blocks. The peripheral circuit region comprises a plurality of pool capacitors. At least one of the memory blocks is a dummy block. The dummy block is configured to form a supplementary pool capacitor for suppressing power noise.
    Type: Application
    Filed: November 28, 2019
    Publication date: March 4, 2021
    Inventor: Jin Yong Oh
  • Publication number: 20210057427
    Abstract: A non-volatile memory device includes a first substrate, a second substrate, a memory array, a circuit structure, a bonding structure, and a shielding structure. A second front side of the second substrate faces a first front side of the first substrate. The memory array is disposed on the first substrate and disposed at the first front side of the first substrate. The circuit structure is disposed on the second substrate and disposed at the second front side of the second substrate. The bonding structure is disposed between the memory array and the circuit structure. The circuit structure is electrically connected with the memory array through the bonding structure. The shielding structure is disposed between the memory array and the circuit structure and surrounds the bonding structure. The shielding structure is electrically connected to a voltage source.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 25, 2021
    Inventor: Jin Yong Oh
  • Publication number: 20210037819
    Abstract: Disclosed is an herbicidal composition containing: a pyrimidinedione-based compound as an active ingredient; and an efficacy enhancer. The herbicidal composition can increase biological effect expression characteristics of the pyrimidinedione-based composition as a contact herbicide, improve fast-acting property on monocot weeds as well as broadleaf weeds through enhanced spreading ability and penetrating power, and effectively control, at a low dose, even resistant weeds showing resistance to other herbicides. Furthermore, the herbicidal composition retains thermodynamic stability to increase storage stability, and can exhibit uniform and excellent efficacy at the time of chemical treatment through the uniform dispersion of the active ingredient.
    Type: Application
    Filed: March 5, 2019
    Publication date: February 11, 2021
    Applicant: FARMHANNONG CO., LTD.
    Inventors: Jung Kook EOM, Jun Hyuk CHOI, Tae Hyun OH, Sung Hwan KIM, Yong Oh JANG, Tae Joon KIM
  • Publication number: 20210043812
    Abstract: The display panel includes: a panel cover; an adhesive layer positioned below the panel cover; and a plurality of display modules detachably attached to the panel cover by the adhesive layer. The adhesive layer includes: a first adhesive layer positioned on the plurality of display modules, and a second adhesive layer positioned on the first adhesive layer. A peel strength of the second adhesive layer is greater than a peel strength of the first adhesive layer.
    Type: Application
    Filed: July 22, 2020
    Publication date: February 11, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pil Yong OH, Kwang Jae LEE, Sung Soo JUNG, Jeong In HAN
  • Publication number: 20210028334
    Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.
    Type: Application
    Filed: October 15, 2020
    Publication date: January 28, 2021
    Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
  • Publication number: 20210000971
    Abstract: Provided are a fusion protein including glutathione-S-transferase and a protein having binding affinity for a target cell or a target protein, and use thereof as a drug delivery carrier and a pharmaceutical composition. The fusion protein and the drug delivery carrier including the same according to an aspect may sustain an in vivo residence time, and may also have improved target cell-targeting ability, and thus may be effectively delivered to target cells. Accordingly, it may be usefully applied to a targeted therapeutic agent.
    Type: Application
    Filed: November 28, 2018
    Publication date: January 7, 2021
    Applicant: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Ja Hyoung Ryu, Joon Yong Oh, Han Sol Kim, Chae Kyu Kim, Se Byung Kang
  • Publication number: 20200411541
    Abstract: A semiconductor device is provided. The semiconductor device includes a first substrate that has a first side for forming memory cells and a second side that is opposite to the first side. The semiconductor device also includes a doped region and a first connection structure. The doped region is formed in the first side of the first substrate and is electrically coupled to at least a source terminal of a transistor (e.g., a source terminal of an end transistor of multiple transistors that are connected in series). The first connection structure is formed over the second side of the first substrate and coupled to the doped region through a first VIA. The first VIA extends from the second side of the first substrate to the doped region.
    Type: Application
    Filed: December 12, 2019
    Publication date: December 31, 2020
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jin Yong Oh, Youn Cheul Kim
  • Patent number: 10878868
    Abstract: A nonvolatile memory device includes: a plurality of word lines that are stacked; a vertical channel region suitable for forming a cell string along with the word lines; and a voltage supplier suitable for supplying a plurality of biases required for a program operation on the word lines, where a negative bias is applied to neighboring word lines disposed adjacent to a selected word line at an end of a pulsing section of a program voltage which is applied to the selected word line.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: December 29, 2020
    Assignee: SK hynix Inc.
    Inventor: Jin Yong Oh
  • Publication number: 20200379981
    Abstract: An accelerated transaction processing apparatus includes a memory for storing one or more instructions, a communication interface for communicating with a blockchain network, and a processor. The processor is configured to determine whether the blockchain network is in a congested state based on monitoring information about the blockchain network, adjust a batch size based on a result of the determination, and perform batch processing for one or more individual transactions using the adjusted batch size.
    Type: Application
    Filed: December 26, 2019
    Publication date: December 3, 2020
    Inventors: Chang Suk YOON, Kyu Sang LEE, Hwa Yong OH, Sang Won LEE, Ki Woon SUNG
  • Publication number: 20200372013
    Abstract: An accelerated transaction processing apparatus includes a memory for storing one or more instructions, a communication interface for communicating with a blockchain network and a processor. The processor is configured to obtain monitoring information on a transaction failure event occurred in the blockchain network, adjust a batch size based on the monitoring information and perform batch processing for one or more individual transactions using the adjusted batch size.
    Type: Application
    Filed: December 26, 2019
    Publication date: November 26, 2020
    Inventors: Kyu Sang LEE, Chang Suk YOON, Hwa Yong OH, Sang Won LEE, Ki Woon SUNG
  • Publication number: 20200365786
    Abstract: A display apparatus including a panel substrate, a TFT panel part including a plurality of connection electrodes disposed on an upper surface of the panel substrate, and a light emitting diode part disposed on the TFT panel part and including a plurality of light emitting modules adjacent to each other, in which each of the light emitting modules includes a plurality of pixels, each of the pixels includes three sub-pixels, and the three sub-pixels include blue light emitting diodes, green light emitting diodes, and red light emitting diodes.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee, Kwang Yong Oh
  • Publication number: 20200357965
    Abstract: A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Myung Jin KIM, Kwang Yong OH
  • Publication number: 20200341049
    Abstract: Provided are a device and a method for monitoring substrates to determine a processed state of the substrates and inspecting presence of abnormality in the processed substrates. A device for inspecting substrates includes a substrate mounting part moving relative to the substrate and for mounting a substrate, a measurement part for monitoring the substrate, a control part configured to control a movement path of the measurement part so that at least some regions are monitored from positions different from each other with respect to a plurality of substrates, and an analysis part configured to determine presence of abnormality from monitoring information about the plurality of substrates.
    Type: Application
    Filed: December 27, 2018
    Publication date: October 29, 2020
    Inventors: Gu Hyun JUNG, Young Rok KIM, Se Yong OH, Chul Joo HWANG, Jin An JUNG
  • Patent number: 10811572
    Abstract: A light emitting diode package includes: a housing; a light emitting diode chip arranged in the housing; a wavelength conversion unit arranged on the light emitting diode chip; a first fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the cyan wavelength band; and a second fluorescent substance distributed inside the wavelength conversion unit and emitting light having a peak wavelength in the red wavelength band, wherein the peak wavelength of light emitted from the light emitting diode chip is located within a range of 415 nm to 430 nm.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: October 20, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh, Ki Bum Nam, Ji Youn Oh, Sang Shin Park, Michael Lim
  • Patent number: 10805397
    Abstract: The present disclosure relates to a sensor network, machine type communication (MTC), machine-to-machine (M2M) communication, and technology for Internet of things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An apparatus for zone management is provided. The apparatus includes a processor configured to collect environment information of each zone of a plurality of zones, and determine an energy efficiency level of each zone of the plurality of zones based on the environment information.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: October 13, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Oh Lee, Hyun-Suk Min, Sang-Sun Choi
  • Patent number: 10784239
    Abstract: A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 22, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Myung Jin Kim, Kwang Yong Oh, Seung Ryeol Ryu
  • Publication number: 20200164337
    Abstract: The present disclosure relates to a method for separating a carbon isotope and a method for concentrating a carbon isotope using the same, the method for separating a carbon isotope including: cooling a formaldehyde gas to a temperature of from 190K to 250K; and obtaining a mixed gas and residual formaldehyde by photodissociating the cooled formaldehyde gas, the mixed gas including carbon dioxide containing a carbon isotope and hydrogen.
    Type: Application
    Filed: July 17, 2019
    Publication date: May 28, 2020
    Inventors: Do-Young Jeong, Lim Lee, Yonghee Kim, Hyounmin Park, Kwang-Hoon Ko, Taek-Soo Kim, Seong Yong Oh