Patents by Inventor Yong-suk Kim

Yong-suk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROSTATIC DISCHARGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140159565
    Abstract: Disclosed herein are an electrostatic discharging structure including single-wall carbon nano tubes disposed between electrodes at a predetermined interval to precisely control discharge starting voltage generating a discharge phenomenon between electrodes, and a method of manufacturing an electrostatic discharging structure.
    Type: Application
    Filed: December 9, 2013
    Publication date: June 12, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hee BAE, Sang Moon Lee, Sung Kwon Wi, Yong Suk Kim
  • ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140159849
    Abstract: Disclosed herein are an electronic component and a method of manufacturing the same. In the electronic component having a hexahedral shape and including an insulating portion formed on an upper part of a base substrate, a coil pattern portion formed in the insulating portion and wound with a conductive wire, and a plurality of external electrodes separated from each other and electrically connected with the coil pattern portion, each external electrode covers a part of an upper surface of the insulating portion and extending to an upper surface of the electronic component and a region between the external electrodes is provided with a ferrite block covering an exposed surface of the insulating portion, thereby improving magnetic permeability as compared with the electronic component of the related art.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 12, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hee BAE, Sang Moon Lee, Sung Kwon Wi, Yong Suk Kim
  • METHOD FOR MANUFACTURING MAGNETIC SUBSTRATE AND COMMON MODE FILTER
    Publication number: 20140153147
    Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.
    Type: Application
    Filed: February 5, 2014
    Publication date: June 5, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Kwon WI, Jeong Bok KWAK, Sang Moon LEE, Young Seuck YOO, Yong Suk KIM
  • COMMON MODE NOISE CHIP FILTER AND METHOD FOR PREPARING THEREOF
    Publication number: 20140152402
    Abstract: Disclosed herein are a common mode noise chip filter and a method for preparing thereof, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer composite layer on the substrate provided with the coil patterns, wherein the ferrite-polymer composite layer includes spherical ferrite particles and flake shaped ferrite particles.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 5, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon LEE, Jun Hee BAE, Sung Kwon WI, Yong Suk KIM
  • COMMON MODE NOISE CHIP FILTER AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140145797
    Abstract: Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 29, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hee BAE, Sang Moon LEE, Sung Kwon WI, Yong Suk KIM
  • THIN FILM TYPE CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140145814
    Abstract: Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer.
    Type: Application
    Filed: November 21, 2013
    Publication date: May 29, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon LEE, Jun Hee BAE, Sung Kwon WI, Yong Suk KIM
  • ELECTRODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND ENERGY STORAGE DEVICE INCLUDING THE ELECTRODE STRUCTURE
    Publication number: 20140146439
    Abstract: Disclosed herein is an electrode structure for an energy storage device, the electrode structure including a current collector and an active material layer formed on the current collector, the active material layer including a carbon material and metal particles formed on the carbon material.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 29, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hoon Choi, Yong Suk Kim, Eun Sil Kim, Se Woong Paeng, Bae Kyun Kim
  • TOUCH PANEL
    Publication number: 20140139759
    Abstract: Disclosed is a touch panel. The touch panel includes a substrate, a sensor part on the substrate, a connection electrode to connect the sensor part on the substrate, and an anti-view part on the connection electrode. A position of the connection electrode corresponds to a position of the anti-view part. A method of fabricating the touch panel includes forming the sensor part on the substrate, forming a connection electrode layer on the substrate, and patterning the connection electrode layer. The connection electrode layer includes a conductive layer and an anti-view layer.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 22, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Seong Su OEM, Hyun Min NAH, Yong Suk KIM, Jin Bok KIM, Myung Ki MIN, Woo Ju JEONG, Jae Hak HER
  • THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140133107
    Abstract: Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geon Se CHANG, Sung Kwon WI, Yong Suk KIM
  • FILTER CHIP ELEMENT AND METHOD OF PREPARING THE SAME
    Publication number: 20140132366
    Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Suk KIM, Sung Kwon WI, Hyeog Soo SHIN, Sang Moon LEE, Young Seuck YOO, Sung Jin PARK
  • Light emitting device package and lighting apparatus using the same
    Patent number: 8704265
    Abstract: In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: April 22, 2014
    Assignee: LG Electronics Inc.
    Inventors: Bu Wan Seo, Sung Woo Kim, Hoon Hur, Yong Suk Kim
  • FILTER FOR REMOVING NOISE
    Publication number: 20140104027
    Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic body; primary and secondary patterns spirally provided on the lower magnetic body in parallel to each other; an insulating layer for covering the primary and secondary patterns; and an upper magnetic body provided on the insulating layer, wherein the primary and secondary patterns are formed to have a ratio of vertical thickness (T) to horizontal width (W) of 0.27?T/W?2.4. According to the present invention, it is possible to improve performance and capacity by implementing high common-mode impedance in the same frequency and reduce manufacturing costs by simplifying structures and processes.
    Type: Application
    Filed: August 7, 2013
    Publication date: April 17, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Ghyu AHN, Sung Kwon Wi, Dong Seok Park, Yong Suk Kim, Ill Kyoo Park, Young Seuck Yoo, Sang Soo Park
  • Common Mode Filter With ESD Protection Pattern Built Therein
    Publication number: 20140062637
    Abstract: Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck Yoo, Kang Heon Hur, Jun Hee Bae, Yong Suk Kim, Sang Moon Lee, Won Chul Sim, Young Do Kweon, Sung Kwon Wi
  • FERRITE POWDER, METHOD FOR PREPARING THE SAME, AND COMMON MODE NOISE FILTER INCLUDING THE SAME AS MATERIAL FOR MAGNETIC LAYER
    Publication number: 20140035714
    Abstract: Disclosed herein are a ferrite powder not including pores in a surface thereof, a method for preparing the same, and a common mode noise filter including the same as a material for a magnetic layer. The spherical ferrite powder in which the pores in the surface thereof are removed as a magnetic layer of the common mode noise filter has high density, such that dispersibility is improved, thereby making it possible to improve adhesive strength with a polymer binder to be mixed. In addition, the adhesive strength between the polymer binder and the ferrite powder is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact.
    Type: Application
    Filed: March 14, 2013
    Publication date: February 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon LEE, Sung Kwon WI, Jun Hee BAE, Young Do KWEON, Yong Suk KIM
  • MULTILAYER INDUCTOR AND PROTECTING LAYER COMPOSITION FOR MULTILAYER INDUCTOR
    Publication number: 20140028430
    Abstract: Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 30, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Sang Moon LEE, Young Seuck YOO, Jeong Bok KWAK, Yong Suk KIM, Young Do KWEON, Sung Kwon WI
  • COMMON MODE NOISE FILTER
    Publication number: 20140002231
    Abstract: Disclosed herein is a common mode noise filter independently including ferrite powder having pores formed in a surface thereof or including at least two kinds of ferrite powder having different particle sizes as a magnetic layer. According to the present invention, the adhesive strength between the polymer binder and the ferrite powder that are included in the magnetic layer is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 2, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon LEE, Sung Kwon WI, Jun Hee BAE, Young Do KWEON, Yong Suk KIM
  • SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
    Publication number: 20130320492
    Abstract: Disclosed herein is a substrate including: a base substrate; an insulating layer formed on an upper portion of the base substrate; a circuit layer formed in a form in which it is buried in the insulating layer; at least one electrode formed on upper portions of the circuit layer and the insulating layer and having a prominence and depression formed at a side thereof; and a dielectric layer formed in a form in which it surrounds the side of the electrode.
    Type: Application
    Filed: May 15, 2013
    Publication date: December 5, 2013
    Inventors: Ju Hwan Yang, Yong Suk Kim, Young Seuck Yoo, Sung Kwon Wi
  • INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130316291
    Abstract: The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.
    Type: Application
    Filed: July 29, 2013
    Publication date: November 28, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Kwon Wi, Young Seuck Yoo, Jeong Bok Kwak, Yong Suk Kim, Sang Moon Lee, Kang Heon Hur
  • SIGNAL PROCESSING CIRCUIT AND SIGNAL PROCESSING SYSTEM OF TOUCH SCREEN
    Publication number: 20130300692
    Abstract: The present invention discloses a signal processing circuit and a signal processing system for processing an input signal provided from a touch screen in response to a driving signal.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 14, 2013
    Applicant: SILICON WORKS CO., LTD.
    Inventors: Yeong Shin JANG, Jung Min CHOI, Yong Suk KIM, Hyung Seog OH
  • CONTROL CIRCUIT OF TOUCH SCREEN AND NOISE REMOVING METHOD
    Publication number: 20130300690
    Abstract: The present invention discloses a control circuit of a touch screen and a noise removing method. The present invention provides a technique for performing differential sensing on two adjacent detection lines of a touch screen panel and integrating a differential sensing signal to filter noise. The control circuit and the noise removing method may remove display noise having an effect on two adjacent detection lines, three-wavelength lamp noise having a predetermined frequency, 60 Hz noise, and charger noise caused by battery charging.
    Type: Application
    Filed: April 24, 2013
    Publication date: November 14, 2013
    Applicant: SILICON WORKS CO., LTD.
    Inventors: Jun Hyeok YANG, Jung Min CHOI, Yong Suk KIM, Hyung Seog OH