Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

Abstract: A display panel includes a base layer, a first lower electrode, a first sacrificial pattern layer defining a first lower opening exposing a portion of an upper surface of the first lower electrode, an insulating layer covering a portion of the first sacrificial pattern layer and defining a first emission opening overlapping the first lower opening, a conductive bank defining a first upper opening overlapping the first emission opening, a first emission pattern layer disposed inside the first lower opening, the first emission opening, and the first upper opening and on the first lower electrode, and a first upper electrode disposed on the first emission pattern layer and in contact with an inner surface of the conductive bank defining the first upper opening, and a thickness of the first emission pattern layer is greater than a sum of a thickness of the first sacrificial pattern layer and a thickness.

Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.

Abstract: A connection structure of a stator of a drive motor is configured to allow coils to be wound in a plurality of slots provided in a stator core and to connect the coils withdrawn from the slots. The coils are wound in the slots to form first-type structures and second-type structures configured such that withdrawal directions of three-phase (U-, W- and V-phase) withdrawal lines and N-phase withdrawal lines withdrawn from the slots of the first-type structures are opposite to withdrawal directions of three-phase (U-, W- and V-phase) withdrawal lines and N-phase withdrawal lines withdrawn from the slots of the second-type structures. The first-type structures and the second-type structures are disposed symmetrically to each other with respect to a reference line formed to divide the slots in half.

Abstract: A semiconductor memory device includes a mold structure including a plurality of wordlines on a front side of a first substrate, and a string selection line and a stopper line on the plurality of wordlines. A channel structure extends in a vertical direction to penetrate the mold structure. A block separation area extends in a first direction to cut the mold structure. A protective structure is interposed between the block separation area and the stopper line and not between the block separation area and the string selection line and not between the block separation area and the plurality of wordlines. A string separation structure extends in the first direction to cut the string selection line and the stopper line. A bitline extends in a second direction on the mold structure. A bitline contact connects the channel structure and the bitline.

Abstract: A display device includes: a base substrate including a front surface and a rear surface, and including a display region and a peripheral region adjacent to the display region in a plan view; an organic light-emitting element on the display region; and a sealing layer on the organic light-emitting element. The base substrate includes: a module hole in the display region, and passing through the front surface and the rear surface; a first recess at the display region and recessed from the front surface, the first recess surrounding the module hole in the plan view; and a second recess at the display region and recessed from the front surface, the second recess surrounding the first recess in the plan view. The first recess and the second recess have different widths from each other in a direction parallel to the front surface.

Abstract: A display device includes a substrate. A lower electrode is disposed on the substrate. A metal layer is disposed on the substrate and exposes at least a portion of the lower electrode. A light emitting layer is disposed on the lower electrode and the metal layer. An upper electrode is disposed on the light emitting layer. An insulating layer is disposed on the upper electrode.

Abstract: An embodiment relates to a method of measuring an ambient temperature by using a temperature sensor provided in an integrated circuit (IC) and a measurement error of a temperature sensor may be improved by correcting an output value of a temperature sensor by using a correction value stored in a memory.

Abstract: A tiled display includes a first display device comprising a first display area and a first pad area having grooves, and a second display device comprising a second display area and a second pad area overlapping the second display area, the second pad area having protrusions, wherein the protrusions are inserted into the grooves to connect the first pad area with the second pad area.

Abstract: Provided is a bonding apparatus. The bonding apparatus includes a stage configured to accommodate a substrate, a laser light source configured to provide laser light to devices on the substrate, and a bonding plate provided between the laser light source and the stage and configured to provide the devices on the substrate. The bonding plate includes a transparent substrate; a transparent layer below the transparent substrate; an device adhesion layer below the transparent layer and a reflective pattern provided above or below the transparent substrate and the transparent layer.

Abstract: A display device includes: a display panel including a base layer, a light emitting element layer, and an encapsulation layer; and an input detection unit disposed on the display panel, wherein the display panel includes: a first side and a second side, wherein the encapsulation layer includes an organic encapsulation layer including: an inclined part adjacent to the first side and the second side; and a flat part extending from the inclined part, wherein a first angle formed by the inclined part with respect to an upper surface of the base layer in a first part of the display panel and input detection unit adjacent to the first side is less than a second angle formed by the inclined part with respect to the upper surface of the base layer in a second part of the display panel and input detection unit adjacent to the second side.

Abstract: The present embodiment relates to an oscillator circuit, a semiconductor integrated circuit device and a method for frequency correction of an oscillator circuit, and more particularly, to an oscillator circuit, a semiconductor integrated circuit device and a method for frequency correction of an oscillator circuit capable of stably maintaining an output frequency of a clock signal even when a temperature of the semiconductor integrated circuit device changes.

Abstract: A display device includes a substrate having a display area, in which an image is displayed, and a non-display area, in which no image is displayed. The non-display area is disposed on at least one side of the display area. A plurality of pixels is disposed in the display area. An encapsulation layer is disposed on the plurality of pixels. A dam unit is disposed in the non-display area. The dam unit includes a body part and a plurality of protrusions. Each of the plurality of protrusions protrudes from the body part.

Abstract: The present invention relates to a heterodimeric Fc-fused protein comprising a first Fc region and a second Fc region of an immunoglobulin Fc pair and a physiologically active protein composed of two or more different subunits, wherein one or more subunits of the physiologically active protein are linked separately to one or more ends of the N-terminus or C-terminus of the first Fc region and/or the second Fc region, and CH3 domains of the first Fc region and the second Fc region are mutated so as to promote the heterodimeric Fc formation. Moreover, the present invention relates to a pharmaceutical composition comprising the heterodimeric Fc-fused protein.

Abstract: A humanized antibody or antigen-binding fragment thereof that binds to the human IL-5 receptor alpha subunit (IL-5R?), which is a receptor of human interleukin-5 (IL-5); a nucleic acid encoding the antibody or antigen-binding fragment thereof; a vector containing the nucleic acid; and a cell transformed with the vector are disclosed. A method for producing the antibody or antigen-binding fragment thereof; a conjugate containing the antibody or antigen-binding fragment thereof; a bispecific or multispecific antibody containing the antibody or antigen-binding fragment thereof; and a composition thereof are disclosed. Also disclosed are methods for preventing or treating an allergic disease, an inflammatory disease and/or a disease caused by an increase in eosinophils; and for diagnosis of allergic diseases, inflammatory diseases, and/or diseases caused by an increase in eosinophils.

Abstract: A display device includes a display panel, an organic layer disposed on a surface of the display panel, a polysilazane layer disposed on the organic layer and including a spaced region, and a resin layer disposed in the spaced region of the polysilazane layer. An elastic modulus of the resin layer is lower than an elastic modulus of the polysilazane layer.

Abstract: A display device and a method for fabricating the same are provided, the display device including a substrate including emission areas for displaying images, and a non-emission area between the emission areas, anode electrodes above the substrate and respectively in the emission areas, a bank buffer layer above the substrate in the non-emission area and covering edges of the anode electrodes, a first multi-layer above the bank buffer layer, including a stack of two or more different metal materials, and including an undercut structure, a pixel-defining layer above the first multi-layer, a second multi-layer above the pixel-defining layer, including a stack of two or more different metal materials, and including an undercut structure, and a spacer above the second multi-layer.

Abstract: A display device may include light emitting elements disposed on a first surface of a substrate, a connection electrode disposed on a second surface of the substrate, and a via layer disposed on the connection electrode, and including at least one depression. The passivation layer may be disposed in the depression of the via layer.

Abstract: A chip-on-film package includes plurality of bumps may be arranged on an integrated circuit, and a plurality of metallic lines are connected to the bumps, thereby transmitting data to a panel, and in a data driving apparatus which may be implemented as the integrated circuit, first bumps and second bumps may be arranged in the same direction in a staggered manner.

Abstract: A display device including: first pixels connected to a first write line and a first compensation line; second pixels connected to a second write fine and a second compensation line; third pixels connected to a third write line and a third compensation line; fourth pixels connected to a fourth write line and a fourth compensation line; fifth pixels connected to a fifth write line and a fifth compensation line; sixth pixels connected to a sixth write line and a sixth compensation line; seventh pixels connected to a seventh write line and a seventh compensation line; and eighth pixels connected to an eighth write line and an eighth compensation line, the first to fourth compensation lines are connected to a first node, the fifth and sixth compensation lines are connected to a second node, the seventh and eighth compensation lines are connected to a third node.