Abstract: A method in a first Network Function (NF). The method includes: transmitting, to a second NF, a message containing a first binding indication associated with a context hosted by the first NF, the message or the first binding indication containing a parameter identifying a group of contexts.

Abstract: Embodiments of the disclosure provide conformally deposited molybdenum films having reduced resistivity and methods of forming the same. The methods include forming a nucleation layer directly on a dielectric layer on a substrate surface by exposing the substrate surface to a molybdenum-containing precursor and a nucleation reactant, and conformally depositing a molybdenum film on the nucleation layer. Another aspect of the disclosure pertains to a method that is part of a gap fill process, comprising forming a nucleation layer directly on a dielectric region within one or more high aspect ratio gap features, including vertical gap features and/or horizontal gap features, and conformally depositing a molybdenum film on the nucleation layer to fill the feature.

Abstract: Disclosed are antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural features. Also disclosed are polynucleotides and vectors encoding such polypeptide complexes; cells, pharmaceutical compositions, and kits containing such polypeptide complexes; and methods of using such polypeptide complexes.

Abstract: A low dielectric sealing glass powder for a miniature radio-frequency glass insulator is made of the following raw materials expressed in molar percentages: SiO2: 70.5-74.0%, B2O3: 20.5-23.5%, Ga2O3: 0.5-2.0%, P2O5: 0.25-2.0%, Li2O: 0.4-6.0%, K2O: 0.1-1.5%, LaB6: 0.05-1.0%, and NaCl: 0.03-0.3%. The raw material components are simple, and the preparation method is easy to implement. The dielectric constant and dielectric loss of the prepared glass powder are low, and the melting and molding temperature is low, which are convenient for large-scale industrial production. The melting and molding temperature of the low dielectric sealing glass powder ranges from 1320° C. to 1360° C., and the obtained glass has a dielectric constant ranging from 3.8 to 4.1 and a dielectric loss ranging from 4×10?4 to 10×10?4 at a frequency of 1 MHz, and a sealing temperature ranging from 900° C. to 950° C.

Abstract: Embodiments of the present disclosure provide methods and apparatus for user plane path failure and recovery handling A method comprises detecting that a user plane path is failed; and monitoring the user plane path within a configurable period to determine whether the user plane path is recovered or not.

Abstract: Methods and systems for transferring monitoring event information during a mobility procedure are provided. According to one aspect, a method for transferring monitoring event information during a mobility procedure comprises, at a first network node: receiving and storing subscription information indicating that a second network node has subscribed to get notification when there is a data delivery failure involving a User Equipment (UE), followed by the UE becoming reachable; detecting a data delivery failure involving the UE, and setting a flag to indicate that a data delivery failure involving the UE has occurred; receiving, from a third network node, a mobility related request; sending, to the third network node, a response to the mobility related request, comprising an indication that the third network node should notify the second network node when the UE becomes reachable and/or when then UE enters the IDLE state.

Abstract: Embodiments of the present disclosure provide method and apparatus for charging management. A method performed by a first user plane function includes determining a charging action for a first session. The method further includes sending information regarding the charging action for the first session to a second user plane function.

Abstract: A semiconductor device including a device isolation region is provided. The semiconductor device includes first active regions disposed on a substrate, and an isolation region between the active regions. The isolation region includes a first portion formed of a first insulating material, and a second portion formed of a second insulating material, having different characteristics from those of the first insulating material. The first portion is closer to the first active regions than the second portion. The second portion has a bottom surface having a height different from that of a bottom surface of the first portion.

Abstract: The present application discloses a display backplane and a display device. The display backplane includes a plurality of light-emitting sub-areas; each of the light-emitting sub-areas is provided with at least two light-emitting portions; a first light-guiding portion is arranged in each of the light-emitting sub-areas and is located between the at least two light-emitting portions, and a side of the first light-guiding portion close to the light-emitting elements has a second light-reflecting surface, and an orthographic projection of a portion of a side of the first light-guiding portion away from the substrate on the substrate falls within an orthographic projection of a portion of a side of the first light-guiding portion close to the substrate on the substrate.

Abstract: Disclosed are antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural features. Also disclosed are polynucleotides and vectors encoding such polypeptide complexes; cells, pharmaceutical compositions, and kits containing such polypeptide complexes; and methods of using such polypeptide complexes.

Abstract: An alloy consisting of titanium, zirconium, cobalt, and nickel, and its fabrication.

Abstract: Provided is a refrigerator which allows a pivoting bar to pivot to seal a gap between a pair of doors regardless of whether the door at which the pivoting bar is not installed between the pair of doors is open or closed. The refrigerator includes a guide device which induces the pivoting bar to pivot. Here, the guide device includes a rack that is moved forward and backward linearly depending on opening and closing of the second door and includes a second magnet built therein, a pinion gear engaged with the rack and pivoting when the rack is moved linearly, and a guide unit which includes a guide groove guiding a guide protrusion and is engaged with the pinion gear to move linearly in a direction opposite to that of the rack to allow the pivoting bar to pivot when the pinion gear pivots.

Abstract: Disclosed herein is a method by an AMF node 120-4 operative in a 5GS that comprises a UE 112 associated with a Subscriber Permanent Identifier (SUPI) that is associated with subscription data of the UE. The method comprises: sending towards a SMF node, a request relating to a PDU Session of the UE and comprising a Request Type that is set to Existing PDU Session; and receiving from the SMF node, a response comprising a Generic Public Subscription Identifier (GPSI) of the PDU session, which GPSI is associated with the SUPI and which GPSI is to be used in networks outside the 5GS for addressing the subscription data of the UE.

Abstract: A method for fabricating a photovoltaic (PV) module, including: (1) covering a polymer material on the side of the crystalline silicon solar cell attached with a solder ribbon followed by heating to allow bonding of the solder ribbon to the crystalline silicon solar cell, so as to obtain a solar cell module; (2) assembling several solar cell modules into a solar cell string, and connecting multiple solar cell strings to form a solar cell array; (3) laying sealing plates respectively on the front and back sides of the solar cell array to form a stacked body; and (4) subjecting the stacked body to lamination achieve an ohmic contact between the solder ribbon and the grid line, and transformation of the polymer material into a filler layer. This application further provides a PV module fabricated by such method, a solar cell module and a solar cell string.

Abstract: A backlight module and a display device are provided. The backlight module includes a light-emitting substrate and a reflective film layer disposed on a light-exiting surface of the light-emitting substrate. The light-emitting substrate includes a base substrate and light-emitting elements and light-scattering members disposed on one same surface of the base substrate. The reflective film layer includes a plurality of light-exiting holes for light passing through. A part of the light emitted by the light-emitting elements is reflected to the light-scattering members by the reflective film layer and is scattered by the light-scattering members. Therefore, light intensity of regions between the light-emitting elements is enhanced.

Abstract: A method of operation of a cellular communications system is disclosed. The method comprises: at a MME: receiving an attach request from a UE; sending a location update request to a HSS; receiving a location update acknowledgement; sending, to a DNS, a DNS query request comprising an APN FQDN; receiving a DNS query response comprising information that indicates candidate PGWs that satisfy the DNS query request and at least two PGWs belonging to a same PGW set; selecting the first PGW; sending, to a SGW, a first create session request that comprises information that indicates the first PGW; receiving a first create session response; sending an attach accept to the UE; and at the SGW: receiving the first create session request from the MME; forwarding the first create session request to the first PGW; receiving the first create session response; and forwarding the first create session response to the MME.

Abstract: Methods for forming a semiconductor structure are described. The method includes cleaning a substrate to form a substrate surface substantially free of oxide, exposing the substrate surface to a first molybdenum precursor, and exposing the substrate surface to a reactant to selectively deposit a first molybdenum film on the substrate surface. The method may be performed in a processing chamber without breaking vacuum. The method may also include forming one or more of a cap layer and a liner and annealing the substrate. The method may also include depositing a second molybdenum film on the substrate surface.

Abstract: A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy; applying an external force against the bulk alloy to reshape the bulk alloy; and heat-treating the reshaped bulk alloy, wherein the bulk alloy is reshaped and/or heat-treated for manipulating the distribution of the microstructure therein. The present invention also relates to a high entropy alloy structure prepared by the method.

Abstract: A catalyst for continuous production of 1,1,1,3-tetrachloropropane through gas-solid reaction as well as a preparation method and use thereof are provided. The catalyst includes a zero-valent iron and phosphorus co-modified carbon material which includes a carbon material as a carrier, a zero-valent iron supported onto the carrier and serving as an active component, and a phosphate functional group formed on the surface of the carbon material. The preparation method includes: co-modifying a carbon material using a ferric salt and organic phosphorus to obtain the catalyst for continuous production of 1,1,1,3-tetrachloropropane through gas-solid reaction. The present application further provides a method for continuous production of 1,1,1,3-tetrachloropropane through gas-solid reaction.

Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.