Abstract: A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of spaced fins, a first end and a second end opposite to the first end. Pluralities of passages are defined between the fins and extending from the first end to the second end of the fin set. Each of the fins has a plurality of louvers defined therein and a plurality of tabs each extending along a side of each of the louvers from each of the fins. The louvers of the fins communicate with the passages between the fins. The tabs of each of the fins extend toward corresponding louvers of the adjacent fin. The passages communicate with ambient air at the first end and the second end of the fin set.

Abstract: A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardly extending to engage in the slot, and a fastening lug (28) secured to a recessed portion (122) of a top surface of a base (12) of the heat sink. The fastening lug extending from a baffle (24) which fittingly engages with a raised portion (124) of the top surface of the base adjacent to the recessed portion.

Abstract: A heat dissipation device includes a seat and a base having a first face and a second face opposite to the first face and thermally contacting the seat. A plurality of fins extends from the first face of the base. Two heat pipes are thermally arranged on the second face of the base. Each of the two heat pipes is bent and has a section sandwiched between the base and the seat, and another section thereof stretching along the base from said section to a portion of the base in no attachment with the seat.

Abstract: A heat sink (10) includes a plurality of fins (12) joined with each other. In one embodiment, each fin includes a main body (13) with an elongated flange (14) and two shortened flanges (16) extending from each of two opposite sides thereof. The shortened flanges extend from the body in an opposite direction to the elongated flange with the elongated flange located therebetween. The elongated flange (14) defines two holes (142) at respective opposite sides thereof and each shortened flange (16) provides an engaging piece (164) in alignment with one hole of the elongated flange. The engaging pieces of one fin engage in corresponding holes of an adjacent fin to thereby combine the fins together.

Abstract: A cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. Each of the engaging members includes a roll piece (15a) with an elongated hole (16a) defined therein and a connecting piece (17a) with an engaging piece (18a) extending therefrom. In assembly of the cooling fins, the engaging pieces of each of the cooling fins engage in the corresponding holes of the roll pieces of an adjacent cooling fin to thereby fasten and join the cooling fins with one another.

Abstract: A fixing apparatus includes a retention module (10) and a back plate (30). The retention module is attached on a printed circuit board (20), which defines a plurality of through apertures (22). The retention module comprises a plurality of posts (12) depending therefrom. Each post is hollow and aligned with a corresponding through aperture. The back plate is attached on a bottom surface of the printed circuit board, for reinforcing the printed circuit board. The back plate comprises a plurality of upwardly extending poles (32). The poles extend through the through apertures and lock inside of the posts to secure the retention module and the back plate on opposites sides of the printed circuit board.

Abstract: A fastening assembly is for securing a heat sink to a heat generating electronic device located on a printed circuit board. The fastening assembly includes a first element and a second element slidably received in the first element. The first element includes a pressing portion, a plurality of outer flexible portions located below the pressing portion and a plurality of inner flexible portions integrally extending inwards from the outer flexible portions, respectively. The pressing portion of the first element presses downwardly the heat sink toward the electronic device. The outer flexible portions of the first element abut upwardly against the printed circuit board. The second element is capable of acting on the inner flexible portions of the first element to motivate the outer flexible portions to release their abutment from the printed circuit board.

Abstract: A heat sink (10) includes a plurality of fins (12) joined with each other. In one embodiment, each fin includes a main body (13) with an elongated flange (14) and two shortened flanges (16) extending from each of two opposite sides thereof. The shortened flanges extend from the body in an opposite direction to the elongated flange with the elongated flange located therebetween. The elongated flange (14) defines two holes (142) at respective opposite sides thereof and each shortened flange (16) provides an engaging piece (164) in alignment with one hole of the elongated flange. The engaging pieces of one fin engage in corresponding holes of an adjacent fin to thereby combine the fins together.

Abstract: Circuits, such as a cascode amplifier or low noise amplifier, having terminals and a voltage-controlled and variable inductive load are disclosed. Any such circuit comprises an output terminal and a voltage-controlled and variable inductive loading network. The voltage-controlled and variable inductive loading network comprises a primary inductor having a first primary inductor terminal for coupling to a supply voltage, a second primary inductor terminal coupled to the output terminal, a secondary inductor sharing mutual inductance with the first inductor, and a variable resistance device having one terminal connected to a first secondary inductor terminal and another terminal connected to a second secondary inductor terminal, wherein the variable resistance device being dependant on mutual induction between the primary and secondary inductors provides loading at the output terminal.

Abstract: The present invention relates to a cooling fin assembly suitable for heat sinks. In one embodiment, the cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. Each of the engaging members including a roll piece (15a) with an elongated hole (16a) defined therein and a connecting piece (17a) with an engaging piece (18a) extending therefrom. In assembly of the cooling fins, the engaging pieces of each of the cooling fins engage in the corresponding holes of the roll pieces of an adjacent cooling fin to thereby fasten and join the cooling fins with one another.

Abstract: Circuits, such as a cascode amplifier or low noise amplifier, having terminals and a voltage-controlled and variable inductive load are disclosed. Any such circuit comprises an output terminal and a voltage-controlled and variable inductive loading network. The voltage-controlled and variable inductive loading network comprises a primary inductor having a first primary inductor terminal for coupling to a supply voltage, a second primary inductor terminal coupled to the output terminal, a secondary inductor sharing mutual inductance with the first inductor, and a variable resistance device having one terminal connected to a first secondary inductor terminal and another terminal connected to a second secondary inductor terminal, wherein the variable resistance device being dependant on mutual induction between the primary and secondary inductors provides loading at the output terminal.

Abstract: This invention is directed to novel silica compositions, metal silicates, germanosilicates, and metal germanosilicates, and patterned objects and films comprising the same. It also includes methods and compositions for making these films and patterned objects on substrates, ranging from silicon wafers to optical fibers, silica, sapphire, quartz and borosilicate glass. These methods incorporate the use of certain precursor compositions, procedures for their application to a substrate and subsequent treatment to produce a patterned object and/or the conversion to glass structures.

Abstract: This invention relates to novel vitreous microlenses and optical filters and methods for their formation. This includes formation of inorganic oxide microlenses and optical filters on other objects, including the production of oxide glasses in various shapes. For example, the present invention is directed to the use of precursor materials such as carboxylated polysiloxanes, including carboxylated polygermanosiloxanes in the hydrogen or fully or partially metal ion exchanged forms to produce the vitreous microlenses and optical filters of the invention.

Abstract: The present invention is directed to a method of forming germanium-containing silicones in which germanium is incorporated into the siloxane backbone with Ge—O—Si bond or onto a carboxylated siloxane in a form such as the germanium ester form, which has a COOGe bond. The germanium mole content ranges from 1 mol % to 50 mol %. The groups attached to silicon and/or germanium include alkyl, alkenyl, and carboxyalkyl and their derivatives. In the materials with pendant carboxylic acid groups, the protons can be replaced by metal ions such as an alkali, alkaline earth, transition metal, or rare earth metal ions. The materials can be crossinked, with the crosslinking being initiated by ultraviolet light or other means with or without a photoinitiator.

Abstract: This invention concerns the joinder of optical waveguide structures and their substrates, methods for joining, attaching or connecting the waveguide structures, and/or materials which can be utilized for constructing such attachments or connections. The invention is also directed to the attachment of alternative silicon and germanium based optical components, methods for making the attachment, and materials utilized to produce the attachment.